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| 2003-05-08 | Silver epoxy adhesive suits microelectronics apps Tra-Con Singapore's Tra-Duct 2958 snap cure, conductive silver epoxy adhesive is designed for use in microelectronics systems. |
| 2006-08-07 | Automatic die bonder offers increased precision, accuracy Designed for fully automatic, high accuracy precision microelectronics assembly, Palomar's new die bonder performs adhesive dispense, component placement, die attach and flip chip operations over a 720inch2 work area. |
| 2011-12-30 | Rapid acoustic inspection for 300MM wafer generation (Part 1) As wafers become larger and individual die become smaller, acoustic micro imaging is developing the non-destructive tools that can remove defective die to boost reliability and yield. |
| 2014-06-16 | Kingyoup bonding equipment addresses miniaturisation The temporary bonding and de-bonding equipment enables 3D ICs, 2.5D packaging integration and system applications. It promises throughput of over 60 wafers to 100 wafers per hour. |
| 2013-07-10 | Dow Corning boards Imec's 3D IC packaging initiative Dow Corning has teamed up with Imec to advance enabling technologies for 3D IC semiconductor packaging. |
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