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| 2001-02-01 | Testing dimensional limits of high I/O flip-chip design The study characterizes underfill materials, examining some large package geometries and design manufacturing processes to avoid defects for I/O counts. |
| 2002-03-11 | SUSS MicroTec, IZM partner in wafer testing, failure analysis SUSS MicroTec Test Systems GmbH has signed a cooperation agreement with Fraunhofer Institute for Reliability and Microintegration (IZM). |
| 2002-08-06 | ON Semiconductor to expand wireless product line ON Semiconductor has launched a campaign to expand its presence in the portable and wireless markets. |
| 2002-04-24 | ON Semiconductor data line protection IC meets USB 2.0 specification The NP4201 data line protection device from ON Semiconductor delivers a maximum line-to-line capacitance of 5pF, and is claimed by the company to be the industry's first four-line protection device to meet the USB 2.0 requirement for signal integrity. |
| 2011-07-08 | Optical sensors improve car safety In order to prevent accidents, Fraunhofer and Microintegration have developed a car sensor system that includes a camera, two sensors and an infrared LED. |
| 2008-06-06 | Will 3D through-silicon vias break into mainstream? The 3D technology based on through-silicon vias technology took center stage at the IEEE 2008 International Interconnect Technology Conference but there is still no consensus just how the industry will bring the long-awaited technology into the mainstream. |
| 2012-09-06 | Research yields smart fabric as anti-theft device The smart fabric, claimed to be significantly cheaper than other burglary detection systems, enables the exact location of the break-in to be identified and is geared to be an invisible means of protecting buildings. |
| 2014-10-27 | LED chip integrates array of 256 light points All the pixels can be individually controlled, providing the basis for adaptive front lighting systems that improve the illumination of the road by actively adapting the distribution of light. |
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