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2004-02-17 Taiwan Sintered Metal to launch Shanghai MIM parts
Taiwan Sintered Metals Co. Ltd is set to launch a production line for metal injection molding (MIM) parts in Shanghai, mainland China by the end of this year.
2010-11-04 MIM architecture promises better quantum tunnelling
Researchers report a method for "quantum tunnelling" that uses metal-insulator-metal architecture which the researchers say will pave the way for faster, lower power and cooler running electronics.
2001-06-01 Silicon prototyping verifies IP functions
SoC designers are confronting several important tasks in optimizing next-generation products. New systematic approaches are needed to ensure that IP can be transferred from one process geometry to the next.
2005-03-09 NEC debuts embedded DRAM on 90nm and high-k
Japan's NEC Electronics Corp. on Monday (March 7) rolled out a new embedded DRAM technology, based on its 90nm process.
2002-12-23 Hitachi improves performance of wireless comm ICs
Hitachi Ltd has announced that its Central Research Laboratory has developed a technology that more than triples the capacitance density of metal-insulator-metal (MIM) capacitors in wireless communications ICs.
2015-05-01 Broadcom offers Wi-Fi Wave 2 chips for enterprise market
The BCM43465 chip, a 4x4 11ac MU-MIMO and 3x3 .11ac MU-MIMO BCM43525 are geared to provide increased capacity required for evolving data rates and compatible mobile devices.
2008-01-18 X-FAB turns Malaysia facility to analog/mixed-signal fab
X-FAB Silicon Foundries is transforming its Sarawak, Malaysia facility into an analog/mixed-signal foundry operation.
2008-09-05 X-Fab Sarawak all set to start 0.35?m process tech
X-Fab Silicon Foundries' Malaysian facility in Kuching, Sarawak, with its 200mm production line, now is fully qualified for volume production and second sourcing of the company's 0.35?m high-voltage process technology called XH035.
2003-07-11 Triquint, Agilent design kit to speed IC design
TriQuint Semiconductor and Agilent Technologies Inc. have introduced a next-gen design kit, which accelerates IC design and simulation.
2011-04-29 TowerJazz SiGe process enables high-speed interfaces
The SiGe process enables high-speed interfaces in communication protocols such as Thunderbolt, optical fiber and high-data rate wireless by improving performance while reducing noise and power usage.
2009-02-17 Tower, Triune to collaborate on power management platform
Tower Semiconductor Ltd and Triune Systems LLC have announced an agreement to collaborate on developing what they claim as the "most complete" power management platform in the industry.
2002-01-11 Tower signs technology transfer, licensing agreement with IMEC
Tower Semiconductor Ltd has signed an agreement with IMEC for the technology transfer and licensing of analog modules and applicable technologies for Tower's Fab 2.
2011-08-08 Tower moves SBL13 process to Israel
Specialty foundry Tower has decided to move its SBL13 process to Israel, giving way to development of their SiGe technology and sourcing capability for customers.
2006-01-01 Taiwan's ITRI innovates in emerging memory research
As process technologies move into deep-submicron arena, Taiwan makers realize that they have to develop their proprietary technologies in a bid to keep competitiveness.
2004-07-01 SONET CMOS transceiver hits 10Gbps
Xignal develops a single-chip full-rate 4:1 Serdes chip consuming <1W in a standard 0.13?m CMOS technology.
2004-09-01 SMIC launches high-voltage process for LCD drivers
Chinese silicon foundry provider Semiconductor Mfg Int. Corp. (SMIC) on August 27 announced the development of a high-voltage process technology.
2014-04-10 Six hot tech trends emerge in high-speed memory
While DDR4 comes first to mind in consideration of the latest developments in high-speed memory, several others including embedded DRAM and SRAM cells make the top six list.
2004-08-31 Shifting gear to survive downturn
CEO Roland Pudelko narrates how Dialog Semiconductor shifted its focus and survived the downturn.
2007-03-05 Samsung begins production of 1Gbit DRAM at 60nm
Capitalizing on the increasing demand for large density DRAMs, Samsung Electronics Co. Ltd has started mass production of the industry's 'first' 1Gbit DDR2 DRAM using 60nm process technology.
2005-10-20 Samsung announces 70nm-based 512Mb DDR2 SDRAM
Samsung Electronics announced that it has developed the first 512Mb DDR2 SDRAM using the 70nm process, which is said to be the smallest process technology yet applied to a DRAM device.
2005-10-20 RFICs invoke a paradigm shift
New manufacturing techniques and packaging technologies result in higher performance RFICs.
2003-05-05 RF CMOS process supports basestation integration
Austriamicrosystems is providing foundry service for a 0.35?m RF-CMOS process licensed from Taiwan Semiconductor Mfg Corp.
2003-01-09 PTI uses Moldflow software for tooling, mold simulations
Polymer Technologies Inc. has selected the Moldflow Plastics Insight software to analyze a sophisticated part made out of a nickel-based super alloy for an aerospace manufacturer using a Metal Injection Molding Process.
2005-10-17 Philips addresses gain requirements of RF, microwave apps
Philips introduced QUBiC4X, the latest addition to its QUBiC4 family of high-performance BiCMOS process technologies.
2008-02-28 Jazz Semi upgrades high-voltage BCD power platform
Jazz Semiconductor has announced enhancements to its advanced bipolar CMOS DMOS process platform including the addition of an ultra-low Rds(on) scalable NLDMOS device.
2012-12-12 Intel tweaks 22nm tri-gate SoC for ultra-low leakage
Intel goes into the nitty-gritty of the latest modification to its 22nm tri-gate (FinFET) SoC technology.
2007-06-28 Integrated passive device tools target wireless apps
ON Semiconductor has launched its HighQ copper on silicon integrated passive device (IPD) manufacturing services along with IPD product design tools.
2003-03-25 IMEC, NSC partner on process technology development
IMEC and National Semiconductor have entered a four-year contract to jointly develop an 0.18?m and follow-up generation of SiGe-based BiCMOS process technology.
2007-10-17 IMEC extends CMOS scaling research to DRAM MIMCAP
IMEC announced it has initiated research on next-generation DRAM MIMCAP process technology as part of its (sub-)32nm CMOS device scaling program.
2002-03-20 IBM announces new processes for wireless chip fab
Targeting companies that manufacture wireless devices such as cell phones, IBM has announced the development of two new foundry processes for fabricating chips for consumer products.
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