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2012-06-11 Understanding common inter-IC digital interfaces for audio data transfer
Know the respective roles of I2S, TDM and PDM interfaces, as well as their differences.
2010-09-09 TV remotes morph into motion sensors
As TVs and STBs offer more services, their remote controls need to keep up as well, transforming from the traditional clickers to multi-sensor controllers.
2014-04-21 TSMC to post high Q1 revenue due to smartphones, 28nm tech
The company expects a 22 per cent quarterly increase in sales to between $5.96 billion and $6.06 billion, gross margins between 47.5 per cent and 49.5 per cent.
2015-09-21 TSMC heats up 10nm engine, preps 16nm for 2017
TSMC has gotten off to a slow start with its 16nm FinFET process and has also announced plans for specialty RRAM and MRAM memories that would act as alternatives to embedded flash.
2015-12-14 Top 5 semiconductor M&As of 2015
EE Times Asia reviewed the M&A deals that were either announced or completed this year, and came up with the top five synergies in terms of dollar value.
2011-10-14 The move toward 3D chips
Semiconductor fabrication is moving toward 3D ICs and by next year, 3D chips will be available for commercialization.
2009-02-23 The lowdown on the fab tool market
2009 is off to a rough start for fab tool and materials vendors. But some technologiesand companiesare doing better than others.
2012-09-27 The iPhone 5 inside out
Apple's iPhone 5 A1428 model, torn apart for a closer inspection
2008-12-05 The Future of Display Technology
While wandering the isles at our local department store, I had to pause in the home electronics section and admire the collection of large format LCD and plasma HDTV systems on display. I slipped back in time to when I was a young engineer and could only imagine displays that large and thin.
2010-11-08 Tessera opens Seoul office, stages tech symposium
Tessera aims to provide better support for regional OEMs and industry partners
2011-03-29 STMicroelectronics engine expands motion sensing in CE
STMicroelectronics' iNEMO filtering and predictive software engine integrates the output from a 3-axis accelerometer, 3-axis gyroscope and 3-axis magnetometer to deliver accurate and reliable sensor performance as required by motion-based apps in smart consumer devices.
2011-02-16 ST, bTendo partner on smartphone pico projector
STMicroelectronics and bTendo Ltd have inked a development and license agreement for what is billed as the "the world's smallest pico projector" for smartphones and other portable consumer-electronics devices.
2005-10-04 ST's latest acceleration sensors
STMicroelectronics extended its range of dual-axis acceleration sensors with the introduction of two new devices housed in the tiny, lead-free LGA (Land Grid Array) package measuring 5-by-5-by-1.5mm.
2011-05-24 ST hinges future on 'big-chip-in-the-middle' strategy
Anticipating a great recovery soon, STMicro is using the wireless "big-chips-in-the-middle" strategy and a complete platform approach, while banking on its involvement with seven leading handset vendors.
2013-10-23 SMIC opens R&D, manufacturing facility for 3D ICs
By rolling out a centre dedicated to vision, sensors, and 3D IC, SMIC is hoping to let the world know of its ability to extend its manufacturing and R&D capabilities.
2009-02-10 Smart phones keep IC suppliers afloat
With the crisis bleeding out the electronics markets and suppliers, the relative strength of the smart phone market is helping some companies to keep their heads above water and propelling others to impressive growth.
2015-01-06 Smart gadgets rule CES Unveiled
If some of the products demonstrated at the pandemonium of CES Unveiled are any indication, this is a generation of gadgets designed to compete on simplicity, ease of use, accuracy and security.
2014-10-08 Smart DIY: Why do companies design their own sensors?
There are many reasons why several big companies brew their own sensors and sensor hubs. For some, especially in Asia, it's about vertical integration, while others want to add products to their catalogue.
2015-08-27 Small RF filters handle multiple bands in single die
RF filter specialist Resonant claims to have developed multi-band techniques that allow two or three filters to share the same die, as well as creating tunable models that can change their frequency.
2012-02-09 SIA reveals tech roadmap
The roadmap lays out what SIA sees as the path for semiconductor design and manufacturing through 2026, taking into account near and long-term challenges, as well as potential innovations.
2012-12-07 Sharp expects continued growth in Malaysia
Sharp projects LCD TV demand in Malaysia will continue to increase with 16,000 sold units of its Aquos line in 2013.
2014-10-17 Sensor overload: Wearables boost shipments
The worldwide market for sensors in wearables will expand to 466 million units in 2019with 4.1 sensor elements in every device, up from 1.4 in 2013driven by rising demand for fitness and health monitoring features, as well as by improved user interfaces.
2016-01-22 Sensor hub market bolstered by iPhone 6S
The overall market for all types of sensor hubs will exceed one billion units in 2015, rising to nearly two billion in 2018, according to IHS, with iPhone 6S paving the way.
2012-04-26 SEMICON panel highlights SEA's semiconductor opportunities
Experts highlight collaboration, R&D in cutting-edge technologies, and workforce development in Southeast Asia's semiconductor industries.
2004-05-07 SANYO extends reach with PartnerAlliances partnership
PartnerAlliances has formed a technology licensing partnership with SANYO Electric Co. Ltd's U.S.-based R&D division in a bid to help the company in integrating their expertise and technologies with other U.S. advanced technology companies.
2013-03-22 Readers' top product picks of 2012
The top ten most read product announcements of EE Times Asia's engineering community.
2012-12-06 Qualcomm takes 3rd spot in 2012 global IC market
The company is set to end the year with 27.2 per cent growth in IC revenue, representing the highest rate of growth of any top 20 semiconductor supplier, said IHS.
2011-01-11 Qualcomm pushes forward in chips, displays, power
The fabless chip vendor has announced several developments for 2011, including deals with Taiwan's Ministry of Economic Affairs, Verizon Wireless, Duracell and Powermat.
2011-03-29 Quake leaves digital compass fabs undamaged
While digital compass fabs in Japan were left undamaged by the March 11 earthquake, analysts fear supplies could be constrained due to rapidly rising global demand for the device.
2014-05-02 Project Ara oils the works for standardisation
While Google's platform has gotten a wave of attention and support for reasons involving design empowerment and ecosystem expansion, Project Ara Head Paul Emerenko emphasised that the platform pursues the increasing standardisation of electronics design.
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