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2005-09-12 TriQuint pushes into GSM, WCDMA
Seeking to expand into new markets and offset declines in others, TriQuint Semiconductor Inc. is moving full speed ahead into the GSM and WCDMA chip markets.
2015-07-08 Trends, challenges for EUV lithography
Imec said cutting costs per transistor at the next-generation, the 10nm node, will be tricky, and even more challenging will be getting extreme ultraviolet lithography ready to enable a full 7nm node.
2006-03-28 Transmitter, T&M solutions focus on mobile TV standards
The test and measuring equipment and transmitter from Rohde & Schwarz aim to address new future-oriented standards such as DVB-H, MediaFLO and T-DMB.
2002-11-12 Transmeta processor powers HP tablet PC
Hewlett-Packard has chosen to integrate Transmeta Corp.'s Crusoe TM5800 processor on its latest Compaq Tablet PC TC1000, the first computer to use the 1GHz processor.
2005-07-06 Transistor's gate stack structure uses Hf-based, high-k dielectric
NEC Corp. has announced the development of a transistor featuring a new gate stack structure using a Hf-based, high-k dielectric and a metal gate electrode
2007-07-16 Touchscreens, 3D, OLEDs drive new displays
The Society for Information Display (SID) conference played host to the upcoming technologies driving the display market.
2011-11-24 TouchPad snatches second in tablet sales
Surprising as it is, HP has beaten Samsung in tablet sales based on a U.S. market analysis by NPD.
2007-12-14 Toshiba details 32nm advancements for system LSIs
Toshiba has unveiled advancements in three basic technologies for 32nm generation system LSIs and beyond.
2004-09-22 Toshiba adopts ATI platform in latest Satellite notebooks
Toshiba Corp. has selected ATI Technologies Inc.'s RADEON IGP platform technology for its new line of Satellite notebooks.
2007-02-19 Top executives to address challenges faced by China's engineers
Top executives from leading semiconductor companies will share their views with China's industry visionaries, design innovators, media and industry analysts in next month's 12th International IC China Conference and Exhibition.
2015-12-14 Top 5 semiconductor M&As of 2015
EE Times Asia reviewed the M&A deals that were either announced or completed this year, and came up with the top five synergies in terms of dollar value.
2009-01-06 Top 15 challenges to conquer for 22nm
What are the big challenges involved at the 22nm node?
2008-01-24 Tiny HSPA multimedia baseband packs advanced features
NXP has announced a feature-packed, ultrasmall, single-core, dual-mode Nexperia Cellular Multimedia Baseband PNX6712 for HSPA and EDGE.
2011-04-25 TI's OMAP chief lists top 11 tablet features
Stressing the importance of user experience, EE Times identifies 11 features that tablets sold in 2011-2012 should offer, among them, multiple OS, HD videoconferencing and computational photography.
2011-10-25 TI touts role in Android 4.0 rollout
TI took credit for some of the more unique features of the Android 4.0 user experience, such as hardware-integrated security and enhanced memory based on a memory manager baked directly into the chip.
2007-06-15 TI to use high-k dielectrics for 45nm node
TI this week entered the high-k dielectrics arena, announcing plans to integrate this material for its high-performance chips at the 45nm node.
2011-03-08 TI perfects graphene growth methods
TI is perfecting large-domain graphene growth in hopes that new methods would lead engineers to further increase the size of the single crystal graphene and improve graphene's electrical characteristics.
2005-08-31 TI helps push VoIP growth
Texas Instruments unveiled its advanced voice-over-cable chipset and new Wideband DOCSIS reference design, which promises to help drive the continued global growth of VoIP
2004-06-07 TI Asia chief highlights commitment for wireless devices
In a keynote address delivered at IAFA 2004 Computex, Texas Instruments Inc. Asia Ltd President Terry Cheng revealed the company's plans for the wireless 2.5G and 3G mobile devices in Asia.
2012-08-02 TI adds multicore EVMs to KeyStone DSPs roster
TI extends range of low-power, high-performance processors with C665x EVMs.
2015-02-25 Thin sensors boast high-level gas, chemical detection
UC scientists have built sensors made of molybdenum disulphidesmall, thin and highly sensitive to gases and chemical vapours including ethanol, acetonitrile, toluene, chloroform.
2013-10-22 Thin film semiconductors to drive next-gen displays
NIMS researchers said the material cuts the power usage of displays, consuming about half of the power in rapidly diffusing smartphones, but also achieves higher frequencies to realise HD TVs.
2014-10-31 Thermal analyser scales down LED testing time
ITRI developed the In-Line Compact Thermal Analyser (ICTA) technology that promises to minimise LED thermal testing time by more than 90 per cent, offering a measurement speed of 12,000 LEDs per hour.
2012-12-21 Testing EPC for precise LTE/4G billing structures
Through a full EPC evaluation using test tools for all mobile network elements from layer 2-7, service providers can meet the high demands of LTE while simultaneously making profits.
2009-02-18 Testing an OFDM-based MIMO system
This article looks at a few key parameters and the tests needed to tell how an OFDM-based MIMO system is performing.
2015-12-21 Test power ICs to withstand radiation
Failure in space is to be avoided at all costs because there is no human around to make repairs. Testing can help assure that the ICs will withstand radiation.
2015-04-14 Test adapter geared for SMARC computer-on-modules
The device from Yamaichi Electronics ensures a perfect alignment of the contacts and allows for 100 per cent contacting reliability up to 50k mechanical cycles.
2010-05-26 Tesla, Toyota collaborate on electric vehicles
Tesla Motors Inc. and Toyota Motor Corp. (TMC) are teaming up to develop electric vehicles, parts, and production system and engineering support.
2010-07-21 Teo launches unified communications platform
Teo Technologies' platform is built on industry-standard SIP protocols, offering centralized admin, multi-level redundancy and a highly intuitive user experience.
2007-05-07 Telecom firms form 3GPP LTE/SAE initiative
Leading telecom manufacturers and network operators formed a joint initiative aimed at driving forward the realization of next-gen of high performance mobile broadband networks based on 3GPP LTE/SAE specifications.
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