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2004-05-05 TDK embedded modem offers cost, footprint reduction
TDK's latest embedded modem solution offers a 25 percent cost and 35 percent footprint reduction compared to other transformer or silicon DAA solutions
2005-04-05 TDK AFE supports software selectable PSTN terminations
TDK's 73M1903C is targeted at the emerging MFP/Fax architectures and features worldwide PSTN compliance with programmable line terminations.
2004-02-02 What does a VDSL modem consist of
With the tremendous market potential of VDSL, a close examination of VDSL technical solutions would seem in order.
2002-12-09 TDK modem front-end supports V.22bis, V.92
TDK Semiconductor has unveiled the 73M1901 soft modem analog front-end that supports V.22bis and V.92
2002-08-14 LSI Logic offers ADSL modem chipset
LSI Logic Corp. is moving into the standard-chips business for ADSL modems with the introduction of a three-piece chipset.
2001-10-02 Low power, low voltage modem analog front-end STLC7550
This application note describes a low-power host processing modem application using the STLC7550 single-chip AFE. It also describes the features and functions of the STLC7550 that are relevant to host processing systems.
2014-07-15 EnVerv rolls combined dual-modem PLC, RF SoC
The EV8600 combines the company's power line communications technology operating at 10-500KHz and an RF modem operating in the range of 142-1050MHz
2003-03-25 Embedded modem eliminates dedicated crystal oscillator
The 73M1903 embedded modem analog front-end from TDK Semiconductor Corp. eliminates the need for a dedicated crystal oscillator
2004-07-01 Comms rides power lines via optical AFE
A new approach to the analog front end used in BPL applications is built on optical coupling technology.
2006-06-06 AFE device targets VDSL2, ADSL2+ CPE
PMC-Sierra has unveiled the PM4380 analog front end for VDSL2 and ADSL2+ customer premises equipment.
1999-06-29 Software modem and audio/modem riser (AMR) design
The highly integrated design on PCI single chip AFE and AC-Link '97 codec silicon DAA yields great benefits for on-board design. As a result, the power consumption is reduced to as low as 390mW on PCI solution and 160mW on AC-L solution
2010-09-13 PLC development kit jumpstarts smart grid development
Texas Instruments Inc. releases a PLC development kit based on the company's PLC modem solution that can support multiple modulation and protocol standards on a single hardware platform
2005-04-01 Memec offers Asian EEs one-stop communication solutions
Specializing in demand creation Memec Impact intend to help Asian design engineers shorten their product development cycle and improve time-to-market by exhibiting total solutions for communication applications at the IIC-China/ESC-China Conference & Exhibition 2005.
2003-12-01 Meeting test challenges for ADSL
Advanced instrumentation used in mixed-signal testers provides dedicated resources to support complex single-tone, multitone and IMD measurements for multi-site test of complex ADSL devices.
2002-06-18 Broadcom unveils BladeRunner chipset
Broadcom Corp. has introduced both its BladeRunner chipset, for DSL CO equipment, and a single-chip ADSL customer-premises router.
2003-03-13 STMicro VDSL chipset delivers >100Mbps data rate
The company has introduced the ZipperWire VDSL chipset that delivers an aggregate data rate in excess of 100Mbps in short loops.
2011-05-12 PLC chipset complies with IEEE(R) P1901.2 standard
Maxim's G3-PLC(TM) chipset provides prestandard compliance and claims to substantially reduce infrastructure costs over other narrowband approaches.
2012-10-11 ASMgrid2 Reference Designs enable smart meter BOM reduction
Accent plans to unveil three new designs that will showcase the full communication capabilities of ASMgrid2's integration in complete system configurations required for wired and wireless smart meters.
2012-06-26 ADI, TSMC team up to develop analog process tech
The development of the analog process platform aims to significantly improve analog performance for a number of devices.
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