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2008-04-10 VI bricks feature advanced modular power platform
The VI BRICK, from Vicor's brick business unit, touts an advanced modular power platform incorporating the technical attributes of the company's V?I Chip technology and robust packaging that facilitates enhanced thermal management and through-hole assembly.
2003-12-09 TI, STMicro offer modular CDMA 1x chipset
Texas Instruments and STMicroelectronics have jointly announced an open, modular cdma2000 1x chipset that they believe will drive innovation and differentiation in what has to date been a relatively closed market dominated by Qualcomm
2008-09-16 Single-chip multiprocessing steps up
SoC design options for software-friendly multiprocessing have been limited. Now, SoC design components, such as the MIPS32 1004K coherent processing system, mean on-chip symmetric multiprocessing (SMP) under a single OS is a real option
2010-10-20 Single-chip 4G basestation solution 'eNodeB' enables picocell designs
Mindspeed. collaborated with ArrayComm LLC and Continuous Computing Corporation to deliver a complete commercial eNodeB solution for LTE-FDD and LTE-TDD networks.
2010-10-12 Shrink licenses Corning's modular microfluidic system
Shrink Nanotechnologies intends to sublicense plug and play modular microfluidics system
2004-09-17 Samsung selects Microtune single-chip tuner for RF modules
Samsung Electro-Mechanics Co. Ltd has deployed Microtune Inc.'s MicroTuner MT2111 analog/digital single-chip tuner in four different Samsung tuner modules targeted for set-top box markets in Europe, South Korea, Japan and U.S
2007-09-12 Radisys acquires Intel's modular comms biz
Radisys is buying Intel's modular communications platform business in a transaction including a $25 million purchase price along with $6.75 million of inventory and other considerations
2014-04-29 Project Ara modular smartphones promote differentiation
Google's open-source modular smartphone concept could drive a shift from selling stand-alone products to simplified swappable modules performing the same functionalities that meet a user's end requirements
2005-02-16 OTG controller core 'saves chip cost, power
Synopsys unveiled its DesignWare Hi-Speed USB On-The-Go controller core, which is touted to be the lowest gate count IP available on the market .
2013-09-20 NXP, TTTech to co-develop automotive Ethernet switch chip
The jointly developed switch chip will enable applications with unshielded twisted pair cabling with BroadR-Reach PHY technology and will also come with three incorporated traffic classes
2002-11-20 Kamaya ships chip fuses with 0.4mm profile
The FCC10 series of 0402 chip fuses from Kamaya Electric Co. Ltd occupy a footprint of 1-by-0.5mm and come with a profile of 0.4mm
2009-06-10 Interfacing the ispPAC-POWR1208 with modular DC/DC converters
This application note describes several problems associated with controlling modular DC/DC converters and presents several example circuits for interfacing the ispPAC-POWR1208's digital outputs to these devices
2002-11-25 Chip Express offers lower cost verifications thru ARM cores
Chip Express Corp. has licensed ARM Ltd's ARM7TDMI-S processor core
2005-11-07 Cal-Chip's wirewound inductors target high-density designs
Cal-Chip Electronics released its NL series of molded chip wirewound inductors suitable for high-density boards
2003-03-18 Arca utilizes Agilent testing for CPU chip
Arca Technology Corp. has announced that it will utilize Agilent Technologies Inc.'s 93000 SOC Series test system on its first mass-produced 400MHz, 32-bit CPU chip known as the Arca II
2004-08-18 TI chip simplifies power issues in next-gen PCs
The new PCMCIA and PC card power switch IC from TI supports all power management requirements for the new ExpressCard standard.
2015-04-21 Multitest delivers first shaker for MT9928 chip tester
The MT9928 has a kitable and modular architecture and therefore can be converted to different package types and configured with loading and unloading options
2015-03-19 Marvell pushes for FLC-MoChi approach
Marvell President Weili Dai explained that the FLC-MoChi approach will significantly reduce the cost, power and size of electronics systemswhether PC, server, smartphone or wearable.
2007-11-15 Infineon-Intel team eyes high-density SIM cards
Infineon Technologies and Intel are working together for the development of optimized chip solutions for high-density SIM cards
2004-06-16 Xilinx unveils multiplatform FPGAs
The new FPGA platforms from Xilinx are based on the company's Advanced Silicon Modular Block architecture launched last year and offers up to 200,000 logic cells
2003-06-03 UMC, Artisan co-develop PCI-Express PHY core
Semiconductor foundry UMC and Artisan Components Inc. have agreed upon a long-term IP collaboration focused on the development of a PCI-Express PHY IP core for UMC's 0.13?m chip designs
2007-07-19 Startup brews 'perfect storm' for R&D
Intermolecular has unveiled a new platform of "fab in a lab" technologies, which it claims will facilitate R&D of IC materials, processes and device structures.
2005-09-27 Staktek, SMART ink licensing pact for ArctiCore, stacking tech
Staktek Holdings Inc. and SMART Modular Technologies Inc. have signed a license agreement that provides SMART with access to Staktek's latest ArctiCore module technology, as well as Staktek's Value Stakpak, Performance Stakpak and High Performance Stakpak package stacking technologies
2006-12-06 ST completes NAND flash transition to 70nm
STMicroelectronics announced full availability of its entire NAND Flash memory family in 70nm process technology.
2002-06-10 SMART adopts CSR's Bluetooth solution for its USB dongle
Cambridge Silicon Radio's single-chip Bluetooth solution, the BlueCore2, has been selected by SMART Modular Technologies Inc. for its latest Bluetooth USB dongle product.
2005-12-14 Samsung develops 8GB memory module
Samsung Electronics has developed a technology that allows it to modularize 32 pieces of a 2Gb DDR2 DRAM chip together with a logic chip to create a 8GB memory module for a server computer
2014-11-18 Reducing SoC power: Where should the focus be?
Typically, efforts to manage power consumption in SoC design are focused on the CPU and GPU. The SoC interconnect is one area that needs to be re-evaluated.
2014-12-09 Reduce power SoC consumption in the interconnect
Here's a modular approach to SoC interconnect for reducing power consumption. The modular concept is different because it consists of a distributed architecture of various components
2014-04-14 Overcome challenges in FPGA-based prototyping
Here's a look at FPGA-based prototyping challenges and an innovative methodology unifying the benefits of gate-level partitioning and RTL partitioning, providing a short, automated, and predictable path to prototype.
2005-02-02 Osram Opto lights up new LEDs in market
Osram Opto Semiconductors recently welcomed the New Year with a line up of new products that promise to light up a dimming display market.
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