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2002-07-11 Silicon Labs modem chipsets enable single-sided MDC modem
Silicon Laboratory Inc. has announced the availability of the Si3052 and Si3054 modem chipsets that enable the implementation of a single-sided Mobile Daughter Card modem.
2011-01-27 Silicon Image designs 'connectivity co-processor' for smarter TVs
Silicon Image will launch a connectivity co-processor for TV to help TV makers' turn today's "not-so-intelligent TVs to smart TVs." The solution could also stimulate more SoC competition on the consumer market for OEMs.
2014-12-02 Significance of partitioning for date centres (Part 1)
In this two-part series, we will consider some of the key places where we see partitioning technology utilised, and explore some of its impact and implications within the data centre.
2011-11-14 Shift to SSDs fueled by Thai floods
The shortage of HDDs due to floods in Thailand is seen to benefit the SSD market despite the expensive price tag.
2011-01-11 Shift in computing seen as Windows starts running on ARM
Announcements that Microsoft's next version of Windows will run on ARM together and Nvidia will deliver a complete range of ARM chips for computing portend a major change in computing.
2003-03-10 Sharp, Amkor to develop unified stacked package design
Sharp Corp. and Amkor Technology Inc. have agreed to unify the design for 3D system in package assembly that enables the stacking of very thin packages.
2008-09-05 Sharp catches up on 'cool' handset craze
A look inside Sharp's 922SH mobile phone yields insights into whether the Japanese remain ahead of their global counterparts.
2002-02-19 ServerWorks' core logic doubles memory of Pentium servers
Developed with IBM Research, the ServerWorks MXT SystemI/O core logic doubles the effective memory capacity of Intel Pentium III-based servers and halves the number of DIMMs required for system operation.
2011-11-16 Server processors geared for cloud apps
AMD's Opteron processors have up to four memory channels with up to 1.6GHz memory and promise up to 73 percent more memory bandwidth
2005-06-27 Semiconductor technologies for power management (Part 3)
Understand better why ICs and discrete transistors require very different methods of fabrication.
2010-12-20 Self-powered DisplayPort-to-HDMI/DVI translators for dongle, embedded apps
IDT's VLX2000 and VMM1402 are DisplayPort to multi-output HDMI/DVI translators that enable convenient dongle and embedded solutions with multi-monitor support.
2012-11-12 Seeing beneath Microsoft Surface
In this teardown, iFixit has exposed the innards of Microsoft's run at the iPad.
2015-04-02 Secure encryption systems against side-channel attacks
Vendors must now look into the process of designing and testing to guard their systems against side-channel attacks. This process begins with understanding how such threats operate.
2002-07-25 SBS 3910 interface card targets avionics apps
SBS Technologies Inc.'s ABI-3910 6U VME interface card is designed for simulation, test, data-acquisition, and avionics apps that need fast data transfers.
2014-06-02 SBCs make for cheaper access to supercomputer
Single-board computers including Raspberry Pi, Parallela, Renderfarm, and Nvidia's TK1 have made high-performance computing accessible to everyone, being bank- and power-friendly.
2013-01-08 SATA-IO ready to ratify SATA Express specification
SATA Express, a new specification that standardizes PCI Express as an interface for client storage, has moved into the member review stage, the final step before its release to SATA-IO members.
2004-10-29 SATA bridge chip offers 150MBps transfer rate
The new AT78C5010 from Atmel is an IDE PATA to Serial ATA chip, targeted at PC, network and storage connectivity.
2001-04-15 Same-die tactic eases DDR transition
The industry consensus is clear: DDR's time has come. Now what design issues must engineers consider, and what can DRAM suppliers do to make this memory transition happen smoothly and seamlessly?
2007-08-01 Roads diverge on the way to thinner PCs
Engineers are forging ahead on two fronts to define lower-power, lower-cost devices that deliver the full capabilities of a desktop PC.
2008-06-23 Reports point to bleak IC, fab-tool markets
The mid-year data from market research firms indicate gloomy IC and fab-tool industries for 2008.
2007-12-04 Regulators simplify embedded power designs
International Rectifier has introduced the SupIRBuck family of synchronous buck voltage regulators for high density, high performance data center applications.
2006-04-18 Receptacles fit most electronic applications
Tyco Electronics has introduced a line of AMPMODU horizontal and vertical receptacles.
2008-01-30 Ready for gaming battle: AMD intros two-chip graphics card
AMD this week introduced for PC gamers a two-chip graphics card that it hopes will give it a lead in price and performance over rival Nvidia.
2002-05-03 Rambus memory module delivers 4.2GBps bandwidth
The RIMM 4200 memory module from Rambus Inc. integrates two RDRAM memory channels to deliver 4.2GBps of memory bandwidth from a single module.
2003-01-02 Rabbit analog core module provides Ethernet connectivity
The company has announced the release of the RCM3400 analog core module that provides a 10/100Base-T reference design and features a Rabbit 3000 microprocessor.
2013-06-05 Qualcomm tails Intel as top embedded processor vendor in 2012
Embedded processing is a vast market, estimated to have been worth about $90 billion in 2012, or nearly one-third of the semiconductor total available market, noted Semicast.
2013-07-18 QSFP+ solution enables data rates of 4x10Gb/s
Tektronix new QSFP+ solution includes all the necessary components to design, test and validate QSFP+ designs including HCB fixtures and test automation and debug software tools.
2006-06-19 Programmable chips rev critical algorithms
DRC and XtremeData deliver programmable coprocessors that can accelerate time-critical algorithms run on AMD64 processor.
2007-03-01 Prioritize effective execution, customers
Pat Gelsinger, senior VP and general manager of the digital enterprise group at Intel discussed Intel's relationship and involvement with Microsoft, Xen and system builders in this interview.
2006-11-28 Pressures tip wireless apps toward SiP
System-in-Package technology has begun to challenge SoC implementations as a high-level design strategy for selected wireless applications because of lengthening SoC design cycles and other factors.
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