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2015-10-05 MEMS design, manufacturing on the microscale
The microelectromechnical system is a source of wonder in this modern world, so too is its design and manufacturing. Find out why.
2014-10-21 Should your company move to 3D printing?
Moving from machining, injection moulding and other manufacturing processes to 3D printing requires analysis of the business case; manufacturers need a cost-benefit analysis.
2012-12-24 Tough UTL power connector handles up to 600V
Souriau's UTL power connector is suited for the most demanding climates, withstanding all weather conditions, and UV radiation thanks to the use of a new moulded polyamide.
2013-10-09 Stratasys seeks wider reach in Asia with SG facility
3D printing firm Stratasys opens seventh Asia-Pacific office in Singapore in a bid to tap the country's engineering talent and facilities for additive manufacturing.
2013-08-26 Spatial, Geometric reveals DFX validation application
The Geometric DFX leverages modelling capabilities of CGM and provides data reuse through 3D InterOp from Spatial.
2014-04-01 Selecting housing materials for DDR4 memory module
The design and type of connector determines the set of materials that can be considered for the housing.
2013-10-28 Real-time energy audit cuts power use of factories
Researchers from A*STAR's Institute of Manufacturing Technology developed an approach to track the daily energy usage of individual machines and monitors the operational state of a machine in

A team of scientists at A*STAR's Singapore Institute of Manufacturing Technology, together with researchers at the National University of Singapore and The University of Texas, United States, has developed an approach to track the daily energy usage of individual machines. According to them, the approach monitors the operational state of a machine in real time.

2012-10-12 Photonic gels boast numerous applications
The thin colour-changing films may serve as part of inexpensive sensors for food spoilage or security, multi-band optical elements in laser-driven systems and in high-contrast displays.
2009-05-12 Over-moulded connectors are waterproof to IP68
Bulgin Components has expanded the use of its 400 Series Buccaneer waterproof connectors with the introduction of fully assembled cables using over-moulded cable connectors.
2015-06-29 OSATS: Wafer-level packaging limitations hard to dismiss
The recent SEMI Packaging Tech Seminar focused on the need, in terms of under yield and packaging cost pressures, to move from fan-out wafer-level-packaging to fan-out panel-level-packaging.
2012-10-24 Multi-channel connectors tout onboard sensor, mould ID
Kistler's Types 1708A01 and 1710A01 are designed with onboard sensor and mould identification capabilities to increase mould start-up efficiencies and facilitate mould cavity pressure measurements.
2014-10-07 MindStream unveils world's smallest wearable mouse
The ThumbTrack offers an incredibly responsive 1200DPI, with a single charge of the onboard battery lasting up to 15 hours; seven days on standby.
2014-08-28 MEMS plus piezoelectric equates to greater miniaturisation
ROHM established a process for MEMS that utilises thin-film piezoelectric elements. This combination is said to streamline design and reduce the size of processing controllers.
2014-06-18 MEMS mic enables contact-free gesture recognition
The device receives ultrasonic sound waves up to 80kHz, above the audible range of humans, and employs these waves to triangulate an object's location and movement similar to a radar.
2014-03-20 Layered sensors up to 12?m drive process optimisation
The non-wearing thin-film sensor developed by Fraunhofer researchers for extracting relevant production data is insulated by layers of material including hydrocarbon, SiCON and chromium.
2014-06-30 IoT triggers outburst of new ideas
The Internet of Things is the next "big thing" in electronics. This is an explosion of new ideas that will add sensing and controls to literally billions of everyday situations.
2013-04-25 Infrared heating for microfluidic chips avoids polymer damage
Infrared treatment instead of a high-temperature processing technique will allow for production of tiny devices without damaging the polymer components.
2014-09-03 IMI eyes new EMS model to fuel growth
When EMS company IMI posted its first half 2014 net income at 5 times over that during the same period last year, EE Times Asia discussed with them markets, trends and their EMS plus business model.
2013-10-07 Fraunhofer team finds way to mass produce lab-on-chips
LOCs, or pocket labs, can automatically perform a complete analysis of even the tiniest liquid samples, integrating all the required functions onto a chip that's just a few centimeters long.
2014-03-31 Exploring next generation optical bonding
Here's a look at the bonding technologies available for TFT display enhancement.
2015-07-03 Examining 3D embedded substrate power packaging
Here is a look at 3D embedded substrate power packaging technologies, which will be increasingly deployed in everything from cell phones to hybrid electric vehicles.
2013-05-14 Everlight reveals ITR photo interrupter
The ITR1205ST11A/TR touts a low profile of only 2.7mm and is geared for optical switches, digital cameras and printers.
2013-10-10 Develop touch electrodes for non-uniform surfaces
Know how to accomplish touch detection on non-uniform surfaces, such as discrete keys with overlays of varying thickness and curved surfaces.
2014-01-22 Develop sense electrodes for 3D touchpad surfaces
Know the most important design choices that need to be made when designing a touchpad for a 3D surface.
2013-04-09 Choosing medical device interconnects
Biocompatibilty, durability and reliability are key attributes to consider when selecting the right interconnects for remotely connecting healthcare professionals and patients.
2014-11-25 Carbon nano buds boast better conductivity than ITO
The NanoBud films from Canatu Oy, a Finnish startup, could find applications in car centre consoles and dashboards, home appliance control panels, remote controls, smartwatches and flexible displays.
2014-10-17 Boost thermal management of electronic systems
Find out how accurate compact thermal models of three-die power packages can be used to improve the thermal management of electronic systems.
2014-10-29 Advances in power supply packaging
Here's a look at where the power industry is going in terms of component integration and thermal management. It also covers the developments in DC/DC power converter density.
2013-07-05 4500V power MOSFETs prepped for high voltage apps
IXYS's latest 4500V MOSFETs boasts 200mA to 2A current ratings and are designed to address demanding, fast-switching power conversion applications requiring very high blocking voltages up to 4.5kV.
2014-09-02 3D printing: Unleashing its real potential
3D printing is a powerful tool in the hands of professionals that can do jobs that no other manufacturing technology can touch, and it allows economic production of small runs.
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