Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Advanced Search > multi chip package

multi chip package Search results

?
?
total search490 articles
2000-07-01 Trends in multi-chip package integration
Wafer level packaging (WLP) technologies have recently attracted much development activity, innovation and investment. Here are some of the opportunities and obstacles for WLP and multi-chip package integration approaches.
2004-01-28 Toshiba package achieve thinner chips
With a 1.4mm height, the Multi Chip Package (MCP) from Toshiba Corp. stacks a total of nine layers of components.
2002-05-02 Toshiba chip package is 30 percent smaller
Toshiba Corp. has announced that it has developed a stacked multi-chip package (MCP) that measures 7-by-10mm30 percent smaller than the company's current MCPs that measure 9-by-12mm.
2005-03-25 Tessera signs up Fujitsu as chip packaging licensee
Tessera Technologies Inc. has signed a technology licensing agreement with Fujitsu Ltd for packaging intellectual property.
2005-01-18 Samsung to supply multi-chip packages to Sony PSP
Samsung Electronics Co. Ltd will supply multi-functional multi-chip package (MCP) solutions for Sony Corp.'s PlayStation portable (PSP) game system and to manufacturers of digital cameras.
2006-11-03 Samsung announces 16-chip MCP technology
Samsung Electronics announced that it has developed the industry's 'first' process to enable the manufacture of a 16-chip multi-chip package of memory.
2005-05-17 Philips Semiconductor CTO outlines system-in-package challenges
The next step forward in integration has to address system-in-package (SIP) issues and needs EDA tools with broader scope and greater standardization of approach, according to Rene Penning de Vries, chief technology officer of Philips Semiconductors
2004-05-06 NxGen to make microZ package from Tessera
Tessera Technologies Inc. and NxGen Electronics Inc. have signed a new licensing agreement.
2012-09-10 MediaTek's reference chip to boost eMCP shipments
DRAMeXchange said the company's duo core MT6577 chipsets are being incorporated with eMMC + Multi Chip Package function as a part of its standard memory chip design.
2015-03-09 IoT drives chip packaging innovation
The need for high performance multi-functional devices in a single package is pushing the industry to innovate in multi-chip packaging. This high level of integration has presented huge challenge.
2014-08-22 Infineon buys IR to reposition itself in chip industry
The German company is paying $3 billion in cash for Internal Rectifier, an acquisition that will expand its expertise in compound semiconductors, as well as facilitate a stronger market presence.
2010-05-04 512Mbit PRAM comes in multi-chip package
Samsung Electronics Co. Ltd has begun shipping what it claims is the first multi-chip package (MCP) with phase-change RAM (PRAM) for use in mobile handsets beginning later this quarter.
2005-04-07 Tessera, Hynix sign package license agreement
Packaging IP supplier Tessera Technologies has signed a new technology licensing agreement with Korea-based DRAM supplier Hynix Semiconductor.
2006-02-15 Synopsys licenses IC package design tech to Sigrity
Sigrity announced the acquisition from Synopsys of a worldwide perpetual unrestricted license to advanced single- and multi-chip IC package design technology, including technology embodied in Synopsys' Encore products.
2010-11-26 Single-chip PROFIBUS solution cuts a third off power use and cost
TI has just announced its AM1810 Sitara ARM microprocessor, a single-chip ARM9 solution with an integrated PROFIBUS interface. This low-power chip does away with an external PROFIBUS, ASIC or FPGA, saving development time while enhancing system performance
2008-10-17 Single-chip DSP integrates three 1GHz cores
Texas Instruments Inc. has developed a new high performance multicore DSP that offers significant cost, power and board space savings.
2009-11-10 Samsung slims down multi-die memory package
Samsung claims the thinnest multi-die memory package measuring 0.6mm in height, just half the thickness of a conventional memory package of eight stacked chips or dies
2010-09-02 Multi-chip power module for portable devices
Torex module combines a 3A step-down DC/DC controller and a P-ch Power MOSFET
2013-08-16 Multi-chip LED boasts luminous flux of 500lm at 200mA
The Duris S 8 achieves very good colour consistency by using closely grouped LEDs and can be used in directional and omnidirectional retrofits, as well as in LED spots in indoor lighting.
2005-02-16 Harvard Thermal tool integrates with Cadence package designer
Harvard Thermal announced the direct integration of Package Thermal Designer V2.0 with Allegro Package Designer from Cadence
2006-09-05 Chip resistors target demanding high-power apps
TT electronics IRC Advanced Film Division has introduced pulse-withstanding chip resistors that combine extended surge values with high voltage ratings, promising design engineers a stable resistive device for demanding high power applications
2008-08-27 Cadence tool steps up IC package, SiP designs
The release of SPB 16.2, due in November of this year, from Cadence Design Systems, delivers advanced IC package/system-in-package miniaturization, design cycle reduction and DFM-driven design, along with a new power integrity modeling solution
2002-11-21 Yageo releases multi-value capacitor array
Yageo Corp. has released a range of multi-value capacitor array that provides multiple capacitance values within a single 0602 surface-mount package
2014-09-01 White-chip scale packages offer up to 80% cost reduction
Rated for input power up to 3W, the the ReadyMount Enhanced CSP from SemiLEDs is a fully packaged white emitter SMD component, ready for surface mounting on any board level module or COB application.
2004-11-29 Upgraded tool speeds IC package analysis
Fluent's new offering may help prevent some of the packaging problems that have come to plague PCB designers.
2005-02-10 Toshiba, SanDisk to enable 8Gbit of storage on a chip
Toshiba Corp. and SanDisk Corp. on Monday (Feb. 7) announced an 8Gb NAND flash memory chip fabricated with 70nm process technology
2005-10-27 TI unveils 'most integrated' multi-channel signal processor
TI introduced what it touts as the industry's most integrated, highest performance diversity mixed signal receive processor for 3G base stations and fixed wireless communication devices.
2005-08-08 Taiyo Yuden debuts industry first 100nH chip inductor in 0201 package
Taiyo Yuden unveiled two significant performance improvements with the launch of its expanding series of high-frequency multi-layer chip inductors
2005-06-23 Stacked package from Sharp allows 0.5-mm grid
Sharp Corp. has developed packaging technology that allows stacking of multiple packages with 0.5mm pitch ball grids, which the company claims is the industry's tightest pitch.
2005-03-04 ST flash memory chip tailored for 3G mobile phones
ST rolled out a 256Mb NOR flash memory chip that uses a 2bit/cell architecture to provide increased memory density in a small-sized die
Bloggers Say

Bloggers Say

See what engineers like you are posting on our pages.

?
?
Back to Top