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2015-03-05 Global inductor market logs 6.2% CAGR from 2014-2019
According to MicroMarket Monitor, the market was valued at $2.78 billion in 2014, and is estimated to reach $3.75 billion by 2019, underlining robust performance in the coming years.
2002-01-15 Vishay unveils additional package options to multilayer ferrite bead series
The company is offering four package options for the ILBB series multilayer ferrite beads, allowing designers to reduce EMI in telecommunications, computer and automotive applications
2002-06-07 Tiny inductor targets wireless comms
RCD Components Inc. says it has the industry's smallest surface-mount inductor in a 0201-size package
2002-08-27 TDK chip inductor is 80 percent smaller
The MLK0603 series of multilayer chip inductor from TDK Corp. is 80 percent smaller than the company's MLK1005 series, and is suited for use in high frequency mobile communication devices.
2012-01-25 RF inductor touts 1-32nH inductance range
The MLO 0402 devices are designed RF power amplifiers, low noise amplifiers, filter networks and MRI systems.
2005-12-02 Multilayer chip inductors mix low profile, excellent performance
J.W. Miller Magnetics' new PM1210G and PM1812G series of multilayer chip inductors feature a low profile with excellent performance characteristics to meet a wide variety of high frequency applications
2004-03-04 J.K. Multilayer chip inductors operate to 4GHz
The multilayer ceramic chip inductors from J.K. Multilayer Technology are designed for mobile phones and mother boards
2002-04-23 TDK chip inductors have 40 percent less dc resistance
The MLZ2012 series of multilayer chip inductors from TDK Corp. has a dc resistance ranging from 0.12 ohms to 0.4 ohms40 percent lower than that of the company's previous products
2010-12-27 MLCC arrays reduce footprint, speed manufacturing
AVX Corp. rolls a range of multilayer ceramic capacitor arrays in 0405, 0508 packages and 0612 packages with capacitance values ranging from 1pf to 2.2f and voltages of 6.3V to 100V
2002-08-01 J.W. Miller inductors get a shrink
J.W. Miller has designed its PM0402 Series of multilayer, surface-mount chip inductors for HF designs
2008-04-16 Class G amps key in driving ceramic speakers
Today's portable devices drive a need for smaller, thinner and more power-efficient electronic components. Cellphone form factors have become thin that the traditional dynamic speaker has become the limiting factor in how thin manufacturers can make their handsets. Ceramic or piezoelectric speakers are quickly becoming a viable alternative to dynamic speakers.
2002-08-14 BC Components ships chip inductors in 0402 casings
BC Components has announced that it is shipping its new series of multilayer ceramic chip inductors in 0402 casings that feature typical self resonant frequency (SRF) between 750MHz to 4GHz
2005-11-14 Taiyo Yuden's thin chip inductors suit ultra-thin portable devices
Taiyo Yuden Inc. claims its new CKP3216 offer the industry's lowest profile for dc/dc converter choke coil applications.
2008-04-23 Taiyo Yuden claims 'smallest' wirewound power inductors
A series of high-current, wirewound power inductors in an EIA 0603 case size has been introduced by Taiyo Yuden (U.S.A.) Inc. as the smallest power inductors available.
2007-11-15 Wire-wound inductors load 3A at 10?H rating
Taiyo Yuden has unveiled the NR6045T series of wire-wound power inductors for DC/DC converter choke coil applications in LCD/plasma TVs and other flat-panel displays.
2011-10-27 Power tip: Role of common-mode currents in non-isolated power supplies
Read about the role of this "type" of current flow as an EMI source.
2006-10-16 Defining new solutions for 3G power challenges
The handset manufacturers are packing their 3G phones with every feature possible, challenging power supply manufacturers to maintain long runtimes.
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