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2010-06-01 Multimedia chipset enables bidirectional digital-video link
The MAX9249/MAX9260 chipset provides a complete bidirectional digital-video link over a single DC-balanced twisted-pair or differential line
2010-06-14 Serdes chipset enables bidirectional digital video link
When paired with a gigabit multimedia serial link serializer, Maxim's MAX9268 deserializer forms complete bidirectional digital video link over a single DC-balanced twisted-pair
2010-07-05 Evaluating a Serdes chipset for optimal performance at various coax cable lengths
This application note presents test data showing that the MAX9259/MAX9269 Serdes chipset performs well and meets the device specifications with STP cables at various lengths
2011-04-19 Chipset touts secure transmission
Maxim unveils the MAX9263/MAX9265 serializers and MAX9264 deserializer, boasting high-bandwidth digital content protection.
2004-11-26 ST mobile-camera chipset complies with SMIA
ST disclosed that they have developed the first Megapixel mobile-camera chipset, compliant with the Standard Mobile Imaging Architecture
2003-02-28 Silicon collaboration to develop next-gen RDRAM chipset
Silicon Integrated Systems Corp. has collaborated with Samsung Electronics Co. Ltd, ASUSTeK Computer Inc., and Rambus Inc., on the development of a next-generation RDRAM-based chipset - the SiSR659
2005-02-14 Parvus to release SBCs based on Intel processor, chipset
Parvus said it will soon release two additional PC/104-Plus SBCs based on the new Ultra Low Voltage Intel Celeron Tualatin processor and Intel 815E chipset
2007-11-08 Mini-ITX board features Intel Q965 Express chipset
Advansus, a joint-venture company of ASUS and Advantech, has unveiled what it claims is the first Q965 MiniITX motherboard.
2005-12-23 IGP chipset delivers 2D/3D graphics
VIA Technologies announced the VIA CN700 IGP chipset, which is designed for low-power digital media apps, including mini PCs, fanless embedded commercial systems and home entertainment centers
2002-12-02 Evalue SBC address networking multimedia apps
Evalue Technology Inc. has introduced the ECM-5613 fanless SBC that is positioned as a solution for networking multimedia apps such as POSs and STBs
2011-05-24 Multimedia chips target low-end mobile phones
Spreadtrum Communications released two new multimedia chipsets for low-end mobile phones. The chips offer a competitive cost structure for GSM/GPRS multimedia-rich mobile phones
2004-12-07 Fast multi-media platform fits 3.5-in. HDD form-factor
Evalue announced a 3.5-inch single computer board providing GHz high speed and versatile multimedia platform for the embedded apps
2005-04-26 Ampro rolls out four new Windows CE 5.0 SBCs
Providing additional proof that Microsoft's Windows CE is gaining some acceptance in the embedded market, Ampro Computers has just released four small footprint Pentium-based single board computers based on v5.0 of the OS.
2006-12-18 Mobile TV chip integrates RF, DSP
Telegent Systems Inc. unveiled a single-chip mobile TV architecture late in October that integrates RF, DSP demodulation and video post-processing.
2010-02-24 Toshiba: Mobile ICs need to keep pace with market
The biggest challenge for mobile chipset vendors is the speed at which this market is moving, said Deepak Prakash of Toshiba America Electronic Components Inc
2007-01-16 IP cores gear for competing standards
Playing both sides of the serial-interface fence for multimedia handsets, Mixel Inc. is taking the wraps off what it is calling a "silicon-proven" intellectual property (IP) core for the Mobile Display Digital Interface (MDDI) standard
2006-11-15 IGP chips support PCIe, DDR/DDR2 memory
VIA Technologies has developed the VIA CN800 digital media IGP chipset that supports PCIe and DDR/DDR2 memory
2003-01-02 Wireless ICs call on integration
Makers of ICs for Bluetooth and 802.11, or Wi-Fi, WLAN connectivity are readying a new generation of chips for volume delivery in Q1 of 2003.
2008-05-16 WiMAX delivers TV to cellphones
Executives believe that WiMAX could deliver the last mile of wireless broadband service as an alternative to cable and DSL, beginning with network deployment in 2009.
2007-09-25 Passively cooled CPU board works in tough setups
Kontron has introduced the Kontron CP6001, a 6U CompactPCI (cPCI) PICMG 2.16 compliant board that is designed to withstand even the toughest environmental conditions.
2007-10-30 Mini-ITX motherboard features Intel Core 2 Duo
Advansus launched the i945GM3-DCQI, a highly integrated Mini-ITX motherboard built around Intel Core 2 Duo, a mobile Intel 945GM Express northbridge and an ICH7-M southbridge.
2003-02-19 Interface issues loom for full-featured phones
The 3GSM World Congress is grappling with how best to connect all of non-phone peripherals with an application co-processor in handsets.
2012-01-25 Fanless computer optimized for 3G/WiFi/BT/GPS
ADLINK's MXE-5300 is based on Intel's quad-core processor geared for intelligent transportation and factory automation applications.
2008-10-30 Bluetooth modules ease integration in embedded designs
Laird Technologies Inc. has added of four new Bluetooth modules to its range of wireless products.
2008-11-20 Bluetooth modules aid medical apps
Laird Technologies Inc. has launched new range of Bluetooth modules designed to support the demands of medical equipment manufacturers.
2011-09-29 Agilent discusses Asia business, modular instruments
In conversation with EE Times-Asia, Lawrence Liu, Agilent's regional manager, talks about their measurement forum, Asian business and modular instrument strategy.
2006-06-13 AdvancedTCA board to run Intel dual-core Xeon processors
Kontron's new AdvancedTCA processor board will feature two dual-core Intel Xeon microprocessors and support for two AdvancedMC modules.
2006-08-16 6th ESC-Taiwan gathers world's leading embedded tool vendors
Design engineers in Taiwan will be treated to an array of leading-edge technologies as the world's major embedded tool suppliers gather to showcase their products at the 6th Embedded Systems Conference-Taiwan.
2005-02-01 3G integration not a linear progression
The road map toward 3G integration has been set; the tough ride to progress begins.
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