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2008-06-19 Fujitsu simplifies development of 32nm LSIs
Fujitsu Laboratories Ltd and Fujitsu Microelectronics Ltd today announced the development of low-power CMOS technology for 32nm-generation logic LSIs, which makes it possible to minimize the number of necessary manufacturing processes for LSIs, and without the need to use additional materials.
2014-05-02 Freeware catches on in electronics DIY projects
Free software applications have mushroomed over the Internet lately, including electronics engineering tools that prove as good as paid tools. Sourceforge's Cedar Logic Simulator, DesignSpark's PCB, Static Free Software's Electric VLSI, and TinyCAD are among those who make the top ten list.
2005-10-06 Fluorine sweeps high-k defects out of the gate
Hafnium oxide, the anointed successor to silicon dioxide in the gate stack, has a new ally: fluorine.
2008-10-23 Feature-packed BLDC motor ICs trim overall system cost
Atmel Corp. has released ATA6833 and ATA6834 highly integrated driver ICs for brushless DC (BLDC) motor applications such as fuel pumps, turbo chargers, or exhaust gas recirculation.
2012-04-16 Fairchild's gate driver ICs target hybrid EV apps
The FAN7171can drive high speed MOSFETs and IGBTs that operate up to 500V, while the FAN7190can drive MOSFETS and IGBTs that operate up to 600V.
2014-04-21 Exploring a four-quadrant DC/DC switching regulator
Find out how a four-quadrant DC/DC switching regulator can smoothly transition from positive to negative output voltages for FPGA applications.
2014-08-28 Examining Intel's embedded DRAM
With its astronomical manufacturing costs, SRAM's viability is being questioned and the industry is looking for alternatives. This article examines an intriguing option in the form of embedded DRAM.
2009-12-30 EC motor driver packs protection mechanisms
From Elmos Semiconductor AG comes the E910.87 EC motor driver that pack flexible configuration options and diverse protection mechanisms that make it suitable for a wide range of automotive and industrial applications.
2003-06-16 Early history of the DSP chip
Digital signal processing (DSP) is a technology that has become pervasive in our society, but it did not become pervasive overnight. Here's a look at how DSP developed through the years.
2008-12-16 DRAM adopts better features
Samsung Electronics Co. Ltd's 56nm DRAM is something to watch out for. Changes to the basic transistor design for both the cell access transistor in the memory array and the peripheral support transistors used to design the control logic are in the works.
2006-01-13 Design and analysis of a basic class D amplifier
Deceptively complex, Class D amplifiers have a whole series of practical problems that must be overcome to achieve an acceptable result.
2007-11-01 Dealing with IP at 65nm and below
The demand for connectivity intellectual property (IP) for high-speed serial buses is increasing. High-speed serial buses require high-performance analog/mixed-signal circuits that can be designed using standard deep sub-micron CMOS technologies.
2006-08-16 CMOS scaling: painstaking but possible
CMOS scaling is, in fact, proving to be a painstaking and humbling taskalbeit a possible one.
2006-06-08 CMOS process tech features high-density EEPROM
Atmel announced the AT35700 high-voltage process technology with double-poly, high-density EEPROM for IC foundry customers.
2009-09-11 Class D amp saves board space, cost
STMicroelectronics' 50W+50W stereo Class D amplifier IC delivers audiophile sound quality.
2009-07-14 Chartered expands 65nm foundry portfolio
Expanding its foundry portfolio, Sinsgapore's Chartered Semiconductor Manufacturing Pte. Ltd has rolled out separate low-power and RF processes, based on its 65nm technology.
2012-03-26 CFL driver ICs flaunt deep dimming down to 2%
NXP's UBA2026x and UBA2027x are based on the GreenChip technology, accelerating warm-up times to full brightness up to a factor of five.
2005-08-15 Build a differential circuit for OC-18 clock- and data-recovery
The key is understanding the tradeoffs associated with the potential modulation schemes.
2007-12-21 BLDC MOSFET controller ICs are automotive grade
Allegro has released two new automotive grade (temperature and voltage rated) three-phase BLDC motor controller ICs.
2013-08-29 BCDMOS evolves to handle broad range of UHV apps
Learn how LDMOS and JFET transistors do the heavy lifting when it comes to handling high voltages.
2005-12-28 Battery charge controller integrates SMBus interface
TI announced its first integrated battery charge controller with a System Management Bus interface aimed at multi-cell, multi-chemistry battery packs used in portable applications.
2006-08-03 austriamicro adds LVT to foundry tech portfolio
austriamicrosystems has added to its foundry technology portfolio an advanced LVT CMOS process option based on its 0.35m analog CMOS technology.
2015-11-26 ARM sees some promise in plastic electronics
ARM's CTO doesn't see plastic electronics competing with silicon, but he confirmed ARM's appetence to start all over again with plastic electronics.
2014-01-24 Apple taps Samsung 28nm HKMG process for A7
Chipworks' Sinjin Dixon-Warren dissects the front end of line transistor structure used in the A7, with comparison to advanced technologies used by both Apple and other vendors.
2007-12-19 Anxiety high as race begins for high-k 32nm
While foundries are just beginning to ramp their 45nm processes, vendors are already eyeing the next big challengethe race to develop and ship high-k dielectrics and metal gates for the 32nm node.
2008-11-19 Analog on 45 nm treated with trepidation by senior engineer at ICCAD panel
It is possible to build robust high performance analog/mixed-signal on these leading edge digital CMOS technologies. And I have production silicon to prove my point.
2003-04-03 Agere team sees improved reliability in thin gate oxides
Gate oxides are more robust than previously believed, leading to possibilities that chip designers may be able to push device speeds harder while remaining within acceptable reliability margins, said Ashraf Alam.
2012-04-09 Advantages of resistive RAM for next-gen NVM
Here's a discussion on the strengths of hafnium-oxide-based resistive RAM cells, and the main challenges ahead for this technology.
2013-07-16 Advances in raw materials enhance IC efficiency
Smartphones and tablets are driving much of the electronics supply chain so the focus is on increasing transistor performance while at the same time reducing power consumption, says Applied Materials.
2012-11-05 Address power, security issues with antifuse tech
Learn how to resolve the new constraints of battery-powered system-on-chip design.
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