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2011-09-26 Graphene succeeds CMOS tech
James D. Meindl of Georgia Institute of Technology believes that graphene is the leading candidate to replace CMOS semiconductor technology.
2016-02-12 GlobalFoundries, SUNY Poly open advanced patterning centre
The $500 million, five-year programme will accelerate the introduction of EUV lithography technologies into manufacturing to expedite next generation chip technology.
2009-04-02 Globalfoundries assures commitment to Dresden
Globalfoundries has promised to continue its commitment for its Dresden manufacturing location and its existing R&D network in the region.
2012-03-05 Global temperature (sensors market) rises
According to MarketsandMarkets, the market size of temperature sensors is expected to reach $4.51 billion units by 2016, at an estimated CAGR of 5.6 percent.
2012-11-22 German team develops photonic crystal production method
The SPRIE (Sequential Passivation and Reactive Ion Etching) method is applied to structure the silicon on large areas in a simple and three-dimensional manner.
2005-07-18 Futuristic interconnects for ICs proposed
At the IITC, researchers presented futuristic technologies to solve the interconnect bottleneck in chip design.
2010-10-05 Future chips may run on heat emitted by semiconductors
Researchers working on technology that would allow semiconductors to turn heat into power
2008-02-29 France acquires 2.85% stake in STMicroelectronics
The French government has bought a 2.85-percent stake in STMicroelectronics NV from Finmeccanica SpA for about $386 million so as to preserve ST's independence, reported French President Nicolas Sarkozy's office.
2007-07-26 Foxconn to invest $1B in China industrial park
Taiwan electronics firm Foxconn disclosed plans to invest $1 billion over the next three years to produce electronic products in Qinhuangdao, China, according to Xinhua.net.
2008-10-06 For now, CMOS is still irreplaceable
Dennis Buss, chief scientist at TI, gave a retrospective look and a prospective analysis of the semiconductor industry as Moore's law is expected to stagnate toward the end of the next decade.
2012-12-06 Flicker-free bulb designed to resist shattering
Researchers at the Wake Forest University have developed a new bulb won't shatter and contaminate a home like CFLs or emit a bluish light like LED counterparts.
2013-07-11 Flexible sensor key to 'electronic skin'
Scientists at the Technion-Israel Institute of Technology discovered how to make a kind of flexible sensor that could be integrated into e-skin to allow a person to feel changes in their environments.
2002-12-17 Flash gets a quantum makeover at IEDM
Research at the University of Tokyo and at Advanced Micro Devices Inc. dangles the possibility of using quantum-well technology to breathe new life into Flash memory.
2003-10-15 Five "core" partners join IMEC 45nm project
Intel Corp. and Samsung Electronics Co. are among the five " core" partners of a research effort here aimed at developing 45-nm-and-beyond process technologies.
2004-06-30 FEI launches European NanoPort
FEI Co. has opened its enhanced Eindhoven campus and NanoPort product and applications center.
2014-02-13 Faster battery charging with novel anode
Yissum, the R&D company of the Hebrew University of Jerusalem, introduced a novel anode for sodium-ion batteries that claims to enable the production of high capacity and rate capability batteries.
2012-10-17 Exploring split-gate thin-film storage
Based on nanocrystals, SG-TFS is touted to provide fast, efficient read/write operation in a reliable, economical and scalable technology.
2002-07-25 Expanded conference aims to attract designers
The 2002 ICCAD will try to attract designers by featuring design-related papers and panels, as well as a workshop on open-source and open standards, organizers said.
2008-08-12 Exec stresses need for antenna, backhaul upgrades in cellular nets
Cellular networks need better antennas and backhaul upgrades if they are going to optimize the performance of next-generation technologies, said an engineering manager who has helped build many such nets.
2004-08-10 Exec says IBM won't use Linux patents as weapon
Nick Donofrio, IBM's senior VP of technology and manufacturing, pledged on August 5, 2004 not to use his company's extensive patent portfolio against Linux, a line that drew applause from attendees at the LinuxWorld conference.
2015-07-16 Ex-CEO of GlobalFoundries joins battery startup
Doug Grose joined BessTech as its CTO, where he hopes to leverage his experience in the semiconductor industry to make strategic connections and partnerships.
2014-12-03 EVG unlocks nanoimprint lithography hub for photonics apps
The Nanoimprint Lithography NILPhotonics Competence Centre aims to help customers assess the technology and equipment for nanoimprint lithography (NIL) in the field of photonics.
2003-12-17 Europe's Medea+ faces cash crunch
Medea+, an industry-initiated pan-European program for microelectronics R&D, faces the cancellation or drastic curtailment of newly selected projects as deficit-squeezed European national governments threaten to choke off funding.
2004-01-14 Europe plans mega funding for nano CMOS
The European Commission (EC) has approved the first phase of a proposed multiyear collaborative research program to advance CMOS beyond the 45nm node.
2012-09-26 Erbium-silicon chip acts as optical amplifier
Silicon and erbium integrated on a single chip has the ability to amplify light up to 170 gigabits per second.
2004-08-30 Ener1, Delphi to form joint venture for lithium batteries
Ener1 Inc. and Delphi Corp. have signed a non-binding letter of intent to create a joint venture to leverage their combined expertise in lithium batteries.
2009-05-29 E-beam litho tool tailored for 8nm
Vistec Lithography Inc. has launched the out its EBPG5200 electron-beam lithography tool to generate and devise structures at less than 8nm on any substrate.
2010-01-15 Downturn, low support further delay 450mm
Despite rumblings about possible delays for the next-generation wafer size, leading fab tool companies still resist to support 450mm technology.
2007-02-22 Dongbu forms 'bio-semiconductor' group
Dongbu Group has merged its silicon foundry and electronic materials units into a single entity with its "bio-semiconductor" enterprise.
2013-08-02 Develop a voltage regulator general purpose board
Read about the development and implementation of a voltage regulator GPB for lab automation characterisation.
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