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2014-04-10 Advances in power converter packaging
Find out how packaging advances are matching semiconductor progress in power converter miniaturisation.
2002-07-19 Advanced Energy adopts PSI sensors into its EPM system
Advanced Energy Ind. Inc. has successfully integrated Pacific Scientific Instruments' HYT PM-450 sensor bus controller into its Symphony Equipment Productivity Manager system.
2015-10-08 Addressing security risks in the IoT age
Learn about the need to apply known security techniques to a new environment that operates under a set of additional constraints.
2008-01-21 Address power management issues in mobiles
Increasing focus towards system aspects of cellphones forces designers to take a holistic and dynamic approach to power management to effectively decrease power consumption without degrading performance.
2014-10-14 Address M-PHY issues to boost test efficiency
Learn about the requirements of the M-PHY standard relevant to oscilloscope probing, and the tests required in the M-PHY Physical Layer Conformance Test Suite.
2011-11-17 Address challenges in 40G/100G SerDes design, implementation
Read about the various aspects of SerDes design such as transmit/receive portions.
2011-12-23 Address 4G issues with SystemVue
A number of EDA tools available on the market today can be used for LTE-based design; however, creating systems designs for the emerging LTE-A standard requires an entirely new set of functionality.
2011-11-24 Add graphics without employing dedicated graphics controller
Learn about the ways by which integrated peripherals on MCU along with graphics libraries enable embedded designers to cut costs by driving an LCD display without a graphics controller.
2007-01-01 Achieving high-performance DAQ via USB
Properly implemented, a DAQ module can use the PC's USB 2.0 port to pump data into a PC as fast as PCI-based cards.
2007-12-03 Achieve processor energy savings with AVS
Processing large amounts of data at fast speeds rapidly drains the power of a mobile device battery. Maximizing energy savings can be achieved with an AVS technique to reduce energy consumption in digital processors by up to 70 percent.
2014-12-01 Accelerator programme backs Asian tech start-ups
The programme will provide funding, mentorship, office space and access to a network of industry partners, investors and venture capital firms for up to 10 selected Singapore-based FinTech start-ups.
2008-05-09 AAT4297 Eval: Dual RGB controller
The AAT4297 evaluation board demonstrates the operation of AnalogicTech's AAT4297 SmartSwitch, which has six low side n-channel load switches that are serially controlled.
2008-05-09 AAT4295 Eval: Single RGB controller
The AAT4295 evaluation board demonstrates the operation of AnalogicTech's AAT4295 SmartSwitch that has three low side n-channel load switches that are serially controlled.
2011-09-27 A primer on 3D-IC design challenges
Know the 3D-IC design challenges such as system exploration, floorplanning, analysis, and design for test (DFT), and learn how designs will evolve as 3D-IC goes on to become a necessity for managing power, performance, form factor, and cost goals.
2015-08-19 A look inside GlobalFoundries' Fab 8
A tour of the plant and an affiliated research centre in nearby Albany provided a look inside an operation that now carries the DNA of chip giants such as AMD, IBM and Samsung.
2005-09-01 A fast, accurate, LC compliant dc-dc boost regulator Is it possible?
Since the values of LC filter parameters can vary significantly, integration of a fixed compensation circuit implies low bandwidth, which is vital in portable apps with fast switching loads.
2007-09-12 8bit MCUs rev up automotive designs
Freescale Semiconductor has launched a cost-effective 8bit MCU, dubbed the S08QD MCU family, to reduce board space, system cost and power consumption for entry-level automotive applications.
2014-05-26 7nm, 5nm scaling compels adoption of new materials
Shifting advanced nodes involve exploring alternativesfrom silicon to graphene, FinFET to SOIand considering how to apply the strengths associated with 3D device architectures to new technologies.
2005-08-10 4Gbps Fiber Channel-to-SAS controller to support massive scalability
Serial I/O vendor ARIO Data Networks is pre-announcing its SANARIO FS, a redundant array of inexpensive disks controller.
2014-02-06 3D TSV Summit underscores cost-effective production
From a maker's perspective, 3D IC production will only ramp up if the added costs for implementing TSVs and all the ensuing steps can be largely compensated by the IC performance benefits.
2008-06-19 32bit MCUs enable improved performance in automotive apps
STMicroelectronics has released four MCUs in four new Power Architecture families enabling integrators to use the 32bit MCU core throughout powertrain, car body, chassis and safety, and instrumentation systems.
2012-06-13 20nm is a different playing field, says exec
According to Synopsys Inc.'s Saleem Haider, the requirement for lithography double patterning on many layers makes moving to the 20nm node a major undertaking that will require customers to invest in new design tool sets.
2008-12-19 200 Gbps silicon photonic integrated chip
To fully exploit the computing power of multi-core and many-core computers, there is a need of high-speed and high-capacity communication network that can manage enormous data transport among the cores and memories.
2014-08-18 15nm process design kit spurs innovation
The FreePDK released by North Carolina State University includes a more complete set of tools that anyone can download to design state-of-the-art chips and tools.
2013-02-12 10GBase-T SR PHY chips to push affordable 10G switches
The so-called 10GBase-T short reach physical layer chips could cut power consumption from 4W to 1.5W per port, opening the door to 60W 10G top-of-rack switches for data centres.
2010-03-17 1000mA flash driver handles single/double LEDs
austriamicrosystems offers an inductive, ultrasmall, high-efficiency single/dual LED flash driver that claims to offer 25 percent higher output current than existing equivalents.
2015-04-01 10 tips for dealing with contract manufacturers
George Henning, president of OCM Manufacturing, gives the readers five don'ts and five do's when working with a contract electronics manufacturer.
2015-02-24 10 IoT-related trends in manufacturing, supply chain
The year 2015 will see innovative manufacturers leap ahead and use more and better sensors, add more comprehensive automation and increasingly choose local fabrication.
2011-01-21 'First' accelerated processing unit launched
AMD has made available the new AMD Embedded G-Series processor, which the company claims is the world's first and only accelerated processing unit (APU) for embedded systems.
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