Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Advanced Search > os

os What is an OS? Search results

?
?
What is an OS?
Operating system, or simply OS, pertains to the computer's master control program. It is a collection of software, firmware and hardware elements that controls the execution of computer programs.
total search2549 articles
2005-12-16 8051-based MCU line targets data acquisition apps
Ramtron launched its Versa Mix 8051 family of mixed-signal microcontrollers that are targeted at signal conditioning, data acquisition, processing and control apps in the industrial, medical, consumer, instrumentation and automotive markets.
2007-04-09 802.15.4 module targets embedded wireless apps
Cirronet has introduced enhanced I/O capabilities for its LPR2400/ER family of cost-optimized, low-power 802.15.4 modules.
2010-08-04 73S12xxF USB-CCID Linux DFU host application user's guide
The Linux DFU host application program, dfu-util, is an open source user space program that provides the host-side ability to upgrade firmware in a compatible device over a standard USB connection.
2010-08-10 73S12xxF software user guide
This application note describes the Toolkit's hierarchical layers and how to use them.
2006-08-16 6th ESC-Taiwan gathers world's leading embedded tool vendors
Design engineers in Taiwan will be treated to an array of leading-edge technologies as the world's major embedded tool suppliers gather to showcase their products at the 6th Embedded Systems Conference-Taiwan.
2008-03-27 65nm Cyclone III FPGAs come in tiny package
Altera has announced the availability of new 8mm x 8mm packaging (M164) for its family of 65nm Cyclone III FPGAs, targeting space-constrained, high-volume applications.
2010-01-22 64bit simulator handles larger designs
SynaptiCAD is offering the first 64bit Linux version of VeriLogger Extreme, a Verilog simulation and debug environment.
2010-04-26 64bit processors operate from 800MHz to 1.8GHz
Taiwan's Via Technologies Inc. has launched the VIA Nano E-Series processor line of x86-based, 64bit devices for the embedded markets.
2014-02-25 64bit mobile chips catch on at MWC
Chip manufacturers have announced 64bit plans, but the question about smartphones being ready for the 64bit code remains.
2014-11-19 64bit 5-mode 4G LTE SoC aimed at tablets, smartphones
The PXA1936 from Marvell supports up to 1.5GHz clock speed, 1080p display, and video encoding and decoding, and flaunts improved image processor to support 13-16MP cameras.
2005-04-20 50MHz IF signal analyzer is Windows-based
Interactive Circuits and Systems is rolling out an FPGA-based product called the ICS SignIFy that works as a portable low-cost IF signal analyzer.
2005-09-30 5-port device puts high-bandwidth switching into storage systems
PLX Technology has expanded its ExpressLane PCI Express chip portfolio with the PEX 8518, a five port, 16-lane switching device that is housed in a 23-by-23mm, 324-pin PBGA package.
2009-08-25 4Gbyte DDR3 offers improved heat dissipation
Strontium's new DDR3, DDR2 memory modules tout lower energy consumption, better heat dissipation.
2009-12-09 4GB DDR3 modules enable high-density installations
Lexar Media has released the Crucial 4Gbyte DDR3-1333MHz (PC3-10600) non-ECC UDIMM memory modules, enabling power users to max out their systems with 16Gbyte of RAM.
2008-08-07 45nm structured ASICs boast zero mask charge
The Nextreme-2 Family delivers on eASIC's promise of affordable silicon customization, enabling the design of custom chips using state-of-the-art 45 nm technology and the delivery of working devices in only six-weeks.
2007-11-01 45nm designs demand efficient floorplans
With the migration to 45nm cores, optimized I/O planning and placement will become even more critical. These challenges beg the question: Who should take charge of a chip's I/O plan along with the considerations for the package and the rest of the system?
2009-09-16 40nm Stratix FPGA amps up 820K LEs
Altera Corp. has beefed up the high-end density range of its 40nm Stratix IV E FPGAs to 820K logic elements (LEs).
2009-08-03 400MHz ARM9-based MPUs support DDR2
Atmel Corp. has unveiled the first member of a series of 400MHz ARM926 embedded microprocessors that support second generation DDR2.
2008-05-15 3U VPX SBC fits space-constrained embedded apps
GE Fanuc Intelligent Platforms announced the VPXcel3 SBC320, the first 3U VPX SBC to feature Core2 Duo processing technology combined with a server class memory controller.
2003-09-05 3rd annual ESC-Asia to open September 30 in Hsinchu
The 3rd annual Embedded Systems Conferences - Asia (ESC-Asia) is set to take place from September 30 to October 1, 2003 at the Lakeshore Hotel in Hsinchu, Taiwan.
2014-02-28 3MP camera supports optical zoom up to 10x
Equipped with a built-in ISP and 3.0MP image sensor, e-con's camera supports 720p and 1080p streaming at 60fps and 30fps respectively.
2011-02-15 3G/4G demo runs on MIPS
4M Wireless will port its protocol stack on the MIPS-based platform to show a seamless bi-directional handover between a 3G WCDMA protocol stack and 4M Wireless' proven 4G LTE protocol stack.
2010-02-12 3G solution enables high-speed, low-cost smart phones
Broadcom's single-chip HSPA baseband processor and a RF transceiver solution integrates all key 3G mobile technologies for powering the 3G smart phone and smart feature phone product segments.
2010-05-05 3G handset shipments to reach 1.3B this year
ABI Research VP for forecasting, Jake Saunders disclosed that despite ash clouds over Europe, worldwide handset shipments for Q1 hit 303 million, up 19 percent y-on-y.
2011-02-16 3G chip combines UMTS, China's TD-SCDMA
Marvell's world phone platform based on its PXA978 communications processor with HSPA modem features 3G UMTS and China's TD-SCDMA.
2008-09-01 3D-TSVs spark packaging revolution
Chips face the so-called "More-than-Moore" 3D integration route in order to pursue the continued aggressive scaling demanded by the historical law. 3D integration with through-silicon vias (3D-TSV) will accelerate the consolidation happening in CMOS wafer fabs and the shift toward the fabless foundry model.
2010-06-18 3D TSV chips not ready for prime time
Some experts at the International Interconnect Technology Conference (IITC) concluded that 3D chips based on through-silicon-vias (TVS) are not ready for prime time.
2014-04-16 3D smartphone thrusts Amazon into Samsung's playing field
As part of its broader push into hardware, Amazon is releasing a smartphone with four front-facing sensors that has people debating how it will pit the ecommerce giant against established smartphone players in what appears to be a saturated and well-served market.
2014-12-12 3D IC adoption crucial to the entire TSV roadmap
Yole Developpement forecasted that the adoption of 3D IC technology, due to its many advantages, as well as its ability to enable heterogeneous integration, is being considered for many applications.
2011-01-24 3D gesture recognition sheds "child's play" image
From its simple beginnings as a gaming interface for Nintendo's Wii, 3D gesture recognition will soon figure prominently in smartphones and the TV remote. Proponents predict that the hardware for gesture recognition will become as ubiquitous in smartphones as the camera module.
Bloggers Say

Bloggers Say

See what engineers like you are posting on our pages.

?
?
Back to Top