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2011-03-30 Limited BT resin restart to affect tablet production
Mitsubishi Gas Chemical is aiming to regain just 25 percent of its pre-earthquake capacity for BT resin by April, which could affect the manufacture of tablets and smartphones.
2014-08-28 Examining Intel's embedded DRAM
With its astronomical manufacturing costs, SRAM's viability is being questioned and the industry is looking for alternatives. This article examines an intriguing option in the form of embedded DRAM.
2007-06-25 Designing in the age of 3D systems
The optimal utilization of the third dimension requires a careful design of the overall 3D system architecture.
2007-12-28 Commentary: A few fabless fables
As the fabless companies jostle and compete for market positioning and market share, they are subject to the larger trends that transact in the fabless supply-chain world.
2012-02-03 Advances in 3D-IC testing
Read about the design-for-3D-test architecture and implementation flow developed by researchers at Industrial Technology Research Institute based on the Synopsys test solution.
2015-03-10 Addressing difficult thermal analysis problems
Find out how a simple analogue ASIC can be used to solve a difficult thermal analysis problem. It allows system designers to fully model, measure and modify designs before committing to costly silicon.
2013-06-25 A*STAR IME, IC firms team up to tackle industry issues
A*STAR Institute of Microelectronics launched the 2.5D Through-Silicon Interposer Consortium to speed market adoption of TSI tech, which is driven by demands in computer infrastructure and CEs.
2015-09-15 80A encapsulated digital power module offers POL conversions
The ISL8273M from Intersil is a complete step-down regulated power supply that promises up to 80A output current and operates from industry standard 5V or 12V input power rails.
2009-02-10 Z-Foil resistors boast fast thermal stabilization
Vishay Intertechnology Inc. has launched two new ultrahigh-precision Z-Foil voltage divider resistors that feature a low typical TCR and a load-life stability ratio of 0.005 percent.
2008-06-06 XO-1 teardown reveals why they can't sell for $100
The OLPC XO-1's displays, batteries, CPUs, fancy enclosures and the rest all add up to a BOM that sits uncomfortably far from the $100 target.
2013-10-24 Xilinx, TSMC announce CoWoS 3D IC volume production
The programmable Virtex-7 HT family claims to be the industry's first heterogeneous 3D ICs in production that feature up to sixteen, 28Gb/s and seventyCtwo, 13.1Gb/s transceivers.
2006-06-08 Wireless USB SiP includes development kit
Staccato Communications is debuting a reference design kit for developers of Certified Wireless USB HWA and DWA designs.
2007-11-21 White LEDs outshine light bulbs
An international team of researchers demonstrated the first white LEDs to achieve a high CRI that could pave way to the adoption of white LEDs to replace incandescent bulbs and fluorescent tubes.
2005-08-17 Welwyn precision voltage divider offers stability, accuracy
TT Electronics Welwyn Components has developed a military voltage divider that provides two matched resistors with precision absolute and ratio tolerances on a single chip.
2007-09-17 Weigh power, heat factors in new resistors
Resistor manufacturers are now addressing demanding requirements by beefing up their power lines to offer more power and better heat dissipation in same-size or smaller packages.
2004-04-20 WED module targets memory system apps
The 2GB DDR SDRAM registered ECC memory module from White Electronic Designs is claimed by the company to provide maximum performance for memory system apps.
2012-12-20 Vishay's MPMA series boasts tight ratio tolerance
MPMA series of precision matched-pair resistors provides a resistance range from 250 to 50 k with divider ratios from 1:1 to 50:1.
2004-09-24 Vishay resistor chips in new cases0402, 0603, 0502
Vishay Intertechnology released its E/H MIL-qualified resistor chips in three new sizes (0402, 0603 and 0502 cases).
2004-09-16 Unified data model brings signal integrity
Separate EDA environments and databases prevent analyzing signal integrity early in the design cycle, where it is most critical.
2005-01-17 Ultrasonic reverse sensing/backup warning aid system
The number of electronic control modules within the vehicle continues to increase. Convenience and safety are continuing to drive the growth of body control electronics within the vehicle.
2009-03-12 Ultra-thin chips flex to fit into garments
Chips with a thickness of below 60?m could enable manufacturers to design garment with integrated electronic circuits for applications such as health and comfort monitoring.
2005-04-19 Ultra-mini acceleration sensor protects portables
Featuring ultra-fast response and high sensitivity, HDK's new micro-size, piezo-resistive three-axis acceleration sensor can detect minute amounts of dynamic acceleration in the X, Y and Z axis.
2003-01-27 TT Electronics tightens up resistor tolerances
TT Electronics plc's IRC Advanced Film Division has introduced a UPN series of high-precision resistor networks for process control apps.
2012-10-11 TSMC releases 20nm, CoWoS design reference
The silicon-validated CoWoS Reference Flow enables multi-die integration to support high bandwidth, low power and can achieve fast time-to-market for 3D IC designs.
2012-10-17 TSMC names EDA partners for CoWoS, 20nm
TSMC has validated technologies from Cadence, Mentor and ANSYS for use in its 20nm and CoWoS design infrastructure.
2014-04-25 TSMC fleshes out IC line-up with shrunk TSVs
Based on its work on chip stacks, TSMC will launch in July an enhanced version of the 16nm FinFET technology with up to 18 per cent faster data rates and lower leakage, in addition to a planned 10mm and 7mm processes.
2014-03-13 Transistors claim to reduce PCB space by half
ROHM Semiconductor's VML0604 measures just 0.6 x 0.4 x 0.36mm and is suitable for smartphones and other devices requiring smaller, thinner form factors.
2010-03-24 Transistors boast low VCEsat, high-switching speed
NXP Semiconductors has launched its 4th generation low VCEsat Breakthrough In Small-Signal (BISS) transistors in ultralow VCEsat and high-speed switching branches.
2015-04-02 Toshiba flexes muscle in 3D NAND arena
The transition to 3D NAND is picking up speed as Toshiba announced in late March that it was shipping samples of its 48-layer 3D Bit Cost Scalable (BiCS) stacked cell structure flash.
2014-02-19 Tips for cost-effective 3D IC production
Know how to distribute the cost-of-ownership across the supply chain.
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