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What does CSP stand for?
CSP stands for chip scale package or chip size package. It is a chip housing that is slightly larger than the chip itself.
total search10387 articles
2006-03-23 Tactile switches housed in small package
CIT Relay & Switch has introduced the STJ series of sealed tactile switches in a small 7.2-by-7.2mm package.
2006-02-15 Synopsys licenses IC package design tech to Sigrity
Sigrity announced the acquisition from Synopsys of a worldwide perpetual unrestricted license to advanced single- and multi-chip IC package design technology, including technology embodied in Synopsys' Encore products.
2005-10-11 Synchronous buck switching controller offered in SOT-23 package
The LM1770 from National Semiconductor is claimed to be the industry's first SOT-23 synchronous buck switching controller for low-voltage DC/DC conversion.
2002-10-09 Switches and attenuators metal package mounting
This application note describes the process of microstrip mounting for flat packs.
2003-07-16 Surface-mount rectifiers have low profile package
Micro Commercial Components and Zibo Micro Commercial Components have offered their MCC-08 series of surface mountable rectifiers with a package form of SMA/DO-214AC.
2005-01-26 Supertex analog switch ICs available in 26-lead TA package
Supertex announced the release of its HV220 and HV230 low charge injection 8-channel, high-voltage analog switch ICs.
2007-08-31 SuperH RISC engine C/C++ compiler package: Sample file guide for SH-3, SH-4 and SH-4A
This document explains precautions for generating files and performing initial coding in High-performance Embedded Workshop (herein as HEW), for SuperH RISC engine C/C++ compiler V.9.
2007-08-30 SuperH RISC engine C/C++ compiler package: Renesas IDE Start-up guide for SuperH
SuperH RISC engine C/C++ compiler package from Renesas Technology is the package product which the essential tools to make the high-quality program that can make use of the performance of SuperH RISC engine family are in.
2007-08-29 SuperH RISC engine C/C++ compiler package: (Reference) Data of library
This document publishes the number of execution cycles of mathematical function library and runtime for the SuperH RISC engine C/C++ compiler package from Renesas Technology Corp.
2008-05-23 SuperH RISC engine C/C++ compiler package application note: [Reference] Additional functions
This document explains features added to each version of the SuperH RISC engine C/C++ compiler, as well as provides notes on upgrading from an earlier version.
2008-05-23 SuperH RISC engine C/C++ compiler package application note: [IDE user's guide] test automation and support facilities
This application note from Renesas Technology explains the macro-recording support facility and test support facility for High-performance Embedded Workshop.
2008-05-23 SuperH RISC engine C/C++ compiler package application note: [IDE User's Guide] Simulator usage guide
Included in the series of documents for Renesas Technology SuperH RISC engine C/C++ compiler package, this document explains useful simulator functionality.
2008-05-23 SuperH RISC engine C/C++ compiler package application note: [Compiler use guide] Object usage guide
Included in the series of documents for Renesas Technology SuperH RISC engine C/C++ compiler package, this document describes how to use objects.
2008-05-23 SuperH RISC engine C/C++ compiler package application note: [Compiler use guide] Object uniting function use guide
This application note from Renesas Technology explains how to use object uniting function in version 9.2 of the SupoerH RISC engine C/C++ compiler.
2008-05-23 SuperH RISC engine C/C++ compiler package application note : Data of Library
This document publishes the number of execution cycles of mathematical function library and runtime routine (runtime library), for the SuperH RISC engine C/C++ Compiler V.9.02.
2004-04-02 Summit rolls out S9518E in UCSP package
Summit Microelectronics has released its S9518E DACPOT in an Ultra-ChipScale (UCSP) package, with a total footprint of 1.5-by-2.1mm.
2011-03-16 STMicroelectronics package enables 40% thinner power chips
STMicroelectronics is using its new three-lead surface-mount SMBflat package to house an AC switch, a silicon-controlled rectifier, and three types of Triac to meet safety specifications such as IEC 60370 and IEC 60335.
2006-09-15 STMicro unveils 8/16Mbit serial Flash in SO8N package
STMicroelectronics has introduced new high-speed 8Mbit and 16Mbit serial Flash memories in SO8N, said to be the smallest package for these densities.
2005-03-15 STMicro to license package technology from Siliconix
STMicroelectronics has agreed to license the PolarPak power MOSFET package technology from Siliconix Inc., in the hope of promoting the package as an industry standard.
2003-01-22 STMicro offers ultra-thin package for power devices
The company has introduced an ultra-thin package for power control devices used in handheld apps such as mobile phones and PDAs.
2002-09-26 STMicro memory package reduces size by 23 percent
STMicroelectronics has introduced the MSOP8 package for use in their serial nonvolatile memory product that provides about 23 percent reduction in size, compared to the TSSOP8 package.
2004-04-23 STMicro introduces MLP8 2x3 package
STMicroelectronics has disclosed that it has launched one of the smallest packages available on the market - the MLP8 2x3.
2002-07-08 STATS rolls out advanced version of EBGA package
ST Assembly Test Services Ltd has introduced its latest thermal array product, the Enhanced Ball Grid Array Build Up (EBGA-A) package, an advanced version of the traditional EBGA package.
2002-05-31 STATS PBGA package improves thermal performance
ST Assembly Test Services Ltd has introduced the Exposed Drop In Heat Spreader PBGA (XDPBGA) package that offers better thermal performance than traditional die-down packages.
2004-01-22 STATS offers FCLGA package for wireless apps
ST Assembly Test Services Ltd has qualified an environment-friendly version of its Flip-Chip Land Grid Array (FCLGA) package.
2002-08-26 STATS EBGA package offers more I/O
STATS Ltd. has launched the EBGA Multi-Tier package that offers higher I/O and multiple wire bonding zones for power, ground, and signal connection.
2005-09-13 Stackpole's power chokes deliver low losses in small package
Stackpole Electronics introduced a new series of power choke inductors with high-current saturation and operational frequencies.
2002-06-07 Stacked package trims Motorola's Bluetooth radio
While others tout the benefits of single-chip Bluetooth radio transceivers, Motorola Inc.'s Semiconductor Products Sector has turned to advanced packaging as an alternative to CMOS integration.
2005-06-23 Stacked package from Sharp allows 0.5-mm grid
Sharp Corp. has developed packaging technology that allows stacking of multiple packages with 0.5mm pitch ball grids, which the company claims is the industry's tightest pitch.
2007-03-30 ST reduces package size of serial EEPROM line
STMicroelectronics has announced that all its serial EEPROM devices are now available in the tiny 2-by-3mm MLP8 package, enabling significant space and cost savings for portable consumer and communications products.
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