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What does CSP stand for?
CSP stands for chip scale package or chip size package. It is a chip housing that is slightly larger than the chip itself.
total search10387 articles
2004-12-08 ST MCU with CAN, LIN interfaces in TQFP32 package
ST announced volume production of its ST72F561 8bit MCU, which integrates CAN and LIN bus interfaces, plus 60KB of flash memory.
2004-03-26 ST combines set-top ICs into single package
STMicroelectronics unveiled two low-cost, set-top box chips: one for digital terrestrial and another for digital cable STBs.
2002-12-12 SST shrinks Flash package to push Bluetooth
Silicon Storage Technology Inc. has released what it claims is the industry's smallest NOR Flash package, measuring 4-by-6-by-0.52mm.
2006-02-24 South Korean firm offers T-DMB system-in-package
Integrant Technologies said it has developed a package-level decoder chipset that operates to Korea's mobile TV broadcasting standard called DMB.
2009-02-25 SOT-963 527AD dual MOSFET package board level application and thermal performance
ON Semiconductor dual small signal MOSFETs offered in the ultrasmall SOT-963 527AD package are optimized for power management in space-constrained portable electronics.
2011-05-12 SOT package for portable devices gets upgrade
Central Semiconductor announces the inclusion of 20V, 100mA N-Channel and P-Channel MOSFETs in their SOT-953 package.
2010-07-15 Soldering recommendations for the ceramic vertical mount package
This application note describes soldering recommendations for the ceramic vertical mount package (CVMP). The CVMP can be mounted either vertically or lying flat.
2007-09-06 Software eases PCB, package designs
Simberian has updated its Simbeor software tool for PCB and package designs by synthesizing differential via-holes geometry for impedance-controlled high-speed channels.
2007-08-01 SoC is housed in DIL32 module package
With its pluggable DIL32 housing, Beck IPC's SC23 SoC is designed for applications that benefit from the use of a pluggable embedded module for optimum convenience in manufacturing and service.
2011-10-11 SMT package designed for transistors, diodes
Microsemi's hermetic surface mount package is made from aluminum nitride ceramic and touts a power rating of 5-15W.
2005-09-05 SMD fuses offer high current ratings in 1206 package
Raychem Circuit Protection, a business unit of Tyco Electronics, has expanded its line of overcurrent protection devices with its RoHS-compliant slow blow surface-mount fuses.
2013-06-24 SIPLACE compiles package for change overs, line operations
The SIPLACE team's newly compiled package also includes support for innovative setup concepts like Random Setup and Split Table.
2006-08-03 SiP tech stacks logic, gigabit-class memory in one package
NEC Corp., NEC Electronics Corp. and NEC Electronics America Inc. unveiled a new system-in-package technology capable of stacking logic and gigabit-class memory in a single package.
2006-10-26 Sigrity unveils new IC package characterization suite
Promising a new suite of tools that will enable 'fast, easy, accurate and complete' IC package characterization, Sigrity Inc. this week is releasing its SpeedPKG Suite.
2010-08-02 Shorten test time with package-based MBIST strategy
Test time is a significant component of ASIC cost. It needs to be minimized and yet has to have maximum coverage to ensure zero-defect scenario for an automotive application.
2003-03-10 Sharp, Amkor to develop unified stacked package design
Sharp Corp. and Amkor Technology Inc. have agreed to unify the design for 3D system in package assembly that enables the stacking of very thin packages.
2014-05-09 Sensor integrates proximity, illuminance in tiny package
The surface mounted sensor uses two photoreceptors to measure the distance to an object based on the amount of returned light, and to detect the amount of ambient brightness.
2011-12-13 Sensor integrates amplifier IC in SO8 package
NXP's KMZ60 analog AMR angle sensor saves system level costs for brushless DC motors in automotive and industrial applications.
2000-06-16 Semiconductor kit package for power factor corrector
This application note presents a new line of PFC-dedicated products. Both silicon and packaging have been optimized to reduce system costs, including filtering. The products shown here are offered as a kit for power factor correction.
2006-04-25 Schottky, ESD diodes come in SOD-723 package
ON Semiconductor targets portable products with the introduction of three Schottky diodes and three ESD diodes in a 1.4-by-0.6-by-0.5mm SOD-723 package.
2007-05-09 Schottky rectifiers, TVS come in MicroSMP package
Vishay has launched a new MicroSMP miniature package type for Schottky rectifiers and transient voltage suppressors that provides high current power density and low thermal resistance for space savings and improved reliability.
2006-04-04 Schottky rectifier housed in SOD-123F package
Central Semiconductor has released the CMMSH1 series of 1A Schottky rectifiers in a flat lead SOD-123F surface-mount package.
2006-04-26 Schottky bridge rectifiers tout small package
Central Semiconductor said the CBRHDSH1-40L and CBRHDSH2-40 devices are the industry's smallest Schottky bridge rectifiers.
2009-11-10 Samsung slims down multi-die memory package
Samsung claims the thinnest multi-die memory package measuring 0.6mm in height, just half the thickness of a conventional memory package of eight stacked chips or dies.
2005-06-06 Samsung Electronics to package NeroLINUX with DVD recorders
Samsung Electronics will bundle NeroLINUX with a DVD/CD burner, called TS-H552U WriteMaster
2007-04-25 Samsung develops 'first' all-DRAM stacked package using TSV tech
Samsung claims to develop the 'first' all-DRAM stacked memory package using 'through silicon via' technology, which will result in memory packages that are faster, smaller and consume less power.
2013-11-27 Safety software package aimed at industrial automation
Renesas safety software package for its 32bit RX631 and RX63N MCU Groups claims to offer a detailed safety manual to significantly reduce development time for designs
2011-10-07 RF IDIC claims smallest low-frequency package
Atmel has released what it claims as the smallest RF IDIC packagethe IDIC ATA5577M1, a transponder with increased reliability, robustness and extended read/write distance.
2004-09-03 RF detector offers exceptional performance in 2-by-2mm package
Linear Tech unveiled a new high performance logarithmic type RF detector that can accurately detect RF signals up to 3GHz.
2009-08-26 Resistor networks come in space-saving package
Vishay has announced that its precision thin film surface-mount resistor networks and dividers now feature a 4mm x 4mm dual flat no-lead package with a 0.65mm pitch and low 1mm profile.
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