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2004-03-16 SEMI: Semiconductor packaging materials market to reach $11.7B
The market for semiconductor packaging materials is expected to grow from $7.9 billion in 2003 to $11.7 billion by 2008, according to SEMI and TechSearch International's latest report entitled
2006-01-25 Semi packaging materials to hit $20B in 2010
The market for semiconductor packaging materials is expected to grow from $12B in 2005 to $19.5B by 2010, according to SEMI and TechSearch International
2013-01-16 LED packaging to experience year upswing, says Yole
According to Yole Dveloppement's latest report, the LED packaging materials market will enjoy a 20 per cent CAGR during the period 2012-2017, with its growth driven by package substrate and phosphors
2002-02-01 Actel introduces lead-free packaging for FPGAs
The company announced the availability of lead-free packaging options for its ProASIC 500K, eX and SX-A FPGA families as an alternative to standard lead-based packages
2004-07-14 Two firms apply carbon nanotubes to chip packaging
Carbon Nanotechnologies Inc. (CNI) has agreed with Kostat Inc. to develop and commercialize conductive polymers for module trays, carrier tapes and other semiconductor packaging and chip and die delivery applications
2002-07-19 Tegal joins the IC packaging alliance
Tegal's membership is expected to strengthen APiA's position in the IC packaging and interconnect industry
2003-08-07 Resistor networks feature high-density packaging
The RA and RB series of resistor networks from Hosonic Electronic (Zhuhai) Co. Ltd feature miniature and high-density packaging
2015-03-20 Power module packaging eases power electronics issues
The power packaging market is on the rise, pulled by the interconnection and substrate segments, respectively 14 per cent and 13 per cent between 2014 and 2020, revealed Yole
2005-09-01 Packaging becomes problem-solving tool
Package technology provides improved electrical and thermal performance for today's single-die power products.
2015-06-29 OSATS: Wafer-level packaging limitations hard to dismiss
The recent SEMI Packaging Tech Seminar focused on the need, in terms of under yield and packaging cost pressures, to move from fan-out wafer-level-packaging to fan-out panel-level-packaging
2013-11-22 Novel dielectric material to enhance eWLB packages
Nanium released an improved dielectric material and process solution for its fan-out wafer-level packaging (FOWLP) technology, embedded wafer-level ball grid array (eWLB).
2004-10-27 New packaging technology solves design challenges in EHPS, EPS
IR introduced a new power packaging technology to solve design challenges found in EHPS, EPS and automotive motion control apps
2006-03-22 New material eases thermal management
Honeywell Electronic Materials has announced the release of a new screen-printable phase-change material that aims to provide semiconductor chip manufacturers flexibility in thermal management
2004-11-11 Microchip offers lead-free product packaging
Microchip Technology Inc., a provider of microcontroller and analog semiconductors, disclosed the conversion of its product packaging to environmentally friendly lead (Pb)-free plating, beginning January 2005
2002-10-24 LSI Logic extends reach of wirebond packaging
LSI Logic Corp. has developed a form of wirebond packaging that places bonding pads directly on top of a chip's active I/O circuitry
2015-03-09 IoT drives chip packaging innovation
The need for high performance multi-functional devices in a single package is pushing the industry to innovate in multi-chip packaging. This high level of integration has presented huge challenge
2006-04-10 IMEC presents 'bendy' packaging for ICs
Leading European research institute IMEC and the Intec laboratory at the University of Ghent have developed a process to produce ultra-thin flexible packaging for ICs
2007-06-01 IBM gets on the road to 3D packaging
News that IBM Corp. this year will sample its first commercial devices to make direct metal connections between chips marks a small but significant milestone on the road to 3D packaging
2011-03-10 Flip chip packaging boasts 40% lower cost
STATS ChipPAC releases a flip chip packaging technology, fcCUBE, that boasts high input/output density, high performance and reliability in advanced silicon nodes
2015-02-26 Fan-out wafer level packaging to reach $200 million, analysts say
Market researchers predict in a new report that the Fan-Out Wafer Level Packaging (FOWLP) market is likely to reach an estimated $200 million in 2015, expects 30 per cent CAGR in the following years
2015-07-15 E-band cost, reliability concerns in MMIC packaging
Traditional semiconductor packaging approaches either cost too much or suffer from signal integrity issues. However, new techniques are becoming available that can address these problems
2009-07-14 Duo works on bonding solution for 3D packaging
SUSS MicroTec and Thin Materials AG are cooperating on a temporary bonding solution to be used for challenging thin wafer-handling technologies required for emerging 3D integration and packaging technologies
2014-01-20 Double-layer capping improves packaging for MEMS devices
Researchers from A*STAR IME developed a thin-film MEMS encapsulation that promises ambient conditions for devices to operate properly and offer protection for fragile hanging structures.
2006-02-23 ATMI, TEL partner in photoresist packaging system
ATMI Packaging, a provider of high quality materials-handling solutions, unveiled a packaging system designed for direct pressure dispensing of advanced photoresist chemicals
2003-01-09 Amkor memory card packaging cuts cost in half
Amkor Technology Inc. has developed what it claims to be the industry's first leadframe-based memory for use in portable, handheld apps.
2004-03-31 Agere devices reduce RF transistor packaging costs
Agere Systems has announced five RF overmolded plastic packaged transistor products that will lower the overall costs of wireless basestation amplifier equipment.
2014-10-29 Advances in power supply packaging
Here's a look at where the power industry is going in terms of component integration and thermal management. It also covers the developments in DC/DC power converter density.
2014-04-10 Advances in power converter packaging
Find out how packaging advances are matching semiconductor progress in power converter miniaturisation
2012-09-17 A*STAR, Hitachi Chemical team up on 3D IC packaging tech
Hitachi Chemical hopes to leverage IME's advanced 3D IC process capabilities to enhance material technologies that can support the demanding requirements of thin wafer processing
2013-07-10 A*STAR IME consortium delve into advanced packaging
A*STAR IME and a group of semiconductor firms have teamed up to address reliability and performance issues in packaging solutions for compact sized consumer electronics and high power electronics
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