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2008-05-30 QuickLogic's platform offers compact mobile packaging
To meet the needs of the mobile device market, QuickLogic Corp. has brought its customer specific standard product platform in a tiny WLCSP, which helps reduce design size to support processor interface and functionality
2012-09-17 A*STAR, Hitachi Chemical team up on 3D IC packaging tech
Hitachi Chemical hopes to leverage IME's advanced 3D IC process capabilities to enhance material technologies that can support the demanding requirements of thin wafer processing.
2004-01-06 Winbond codec chip targets mobile voice apps
Winbond Electronics Corp. America has expanded its family of voice codec chip solutions with the release of the W681310 voiceband chip.
2008-02-18 Win the mobile TV design challenge
According to Lionel Federspiel of Infineon Technologies: in reviewing mobile TV technology trends, one needs to differentiate between product feature set, packaging, performance, semiconductor processes used and most importantly, the RF receiver performance.
2011-11-22 Wafer packaging fab opens in Taiwan
STATS ChipPAC has increased production capacity with the completion of its 300mm wafer bump and WLCSP facility.
2011-02-25 Vendors keen on pushing mobile DRAM to higher speeds
While 800- or 1,066MHz LPDDR2 devices could serve as a bridge to next-gen technologies, they could also push out other next-gen candidates.
2011-04-11 TSMC enters chip-packaging arena
TSMC will soon open a bumping facility and offer silicon interposers and TSV technologies for 3D chips, but will remain focused on the foundry market and will not compete against subcontractors.
2008-08-11 Trio seeks to cut costs in chip packaging
Infineon has granted licenses for its embedded Wafer-Level BGA chip packaging technology to competitor STMicroelectronics as well as STATS ChipPAC to lower costs and achieve higher market acceptance
2005-06-06 Tri-color LEDs target mobile devices
Featuring one of the industry's smallest package sizes, Agilent has introduced two side-firing, tri-color, surface-mount LEDs housed in a miniature 2.5-by-1-by-1mm package
2012-04-02 TI expands IC packaging options with bare die
The bare die program allows customers to order small quantities as low as 10 pieces for initial prototyping purposes, and larger quantities of full waffle trays for production purposes.
2005-09-21 Spansion, Atheros packaging solution reduces size of mobile phones
Spansion LLC and Atheros Communications Inc. have developed an innovative packaging solution that is designed to reduce the size of dual-mode cellular/wireless LAN (WLAN) mobile phones.
2010-01-11 Solving the Rubik's Cube of mobile broadband
Huawei's Robert Fox urges the exploration of new business models and the adoption of intelligent systems and future technologies to help telecom operators to translate the growth of mobile broadband traffic into a proportionate increase in revenue
2005-02-14 Solutions for Mobile Phones- National Semiconductor
Consumers want high-quality displays for mobile phones, PDAs, and other handheld devices to play back high-quality video such as news clips, music videos, and movie previews for long periods of time
2015-09-28 SiP, PVS tech enabled for TSMC InFO packaging
Cadence said the Allegro SiP design tools and PVS allow TSMC customers to cut the InFO design and verification cycle by offering an integrated solution that automates the design-rule checking (DRC) flow.
2004-08-05 Sharp and Tessera expand packaging agreement
Seeking to broaden its exposure to the consumer electronics market, Tessera Technologies Inc. has expanded an existing agreement to license semiconductor packaging technology to Sharp Corp
2004-03-16 SEMI: Semiconductor packaging materials market to reach $11.7B
The market for semiconductor packaging materials is expected to grow from $7.9 billion in 2003 to $11.7 billion by 2008, according to SEMI and TechSearch International's latest report entitled
2007-01-02 Samsung touts industry's 'first' 1Gbit mobile DRAM
Samsung Electronics Co. Ltd has developed the industry's 'first' 1Gbit Mobile DRAM using 80nm process technology
2015-01-12 Samsung reveals advanced mobile memory
While the LPDDR4 chip received an honorary innovation award at CES, it won't make its way to flagship phones until later this year when Samsung partners ship devices now in development.
2007-01-04 Samsung makes 'first' 1Gbit mobile DRAM
Samsung Electronics Co. Ltd has developed what it touts as the industry's first 1Gbit mobile DRAM for mobile products, using 80nm process technology
2014-02-07 Rise of mobile devices push market for wafer-level packaging
ReportsnReports predicted that the global wafer-level packaging equipment market will grow at a CAGR of 2.9 percent over the period from 2013-2018
2005-04-29 RichTek LED driver chips target mobile handsets
Chip maker RichTek Technology Corp. announced it has developed four new white LED driver ICs that are suitable for mobile handset backlights
2007-07-24 Qimonda ships samples of 75nm Mobile DRAM
Qimonda is sampling its first 512Mbit Mobile DRAMs in 75nm geometries
2007-01-16 QFN packaging guidelines for RF designers
It seems such an irrelevant detail, but the component package is a strong determinant factor over layout flexibility.
2006-01-25 PMDs offer low packaging profiles
NEC Electronics' new low-voltage power management devices promise to deliver very low packaging profiles that enable designers to realize a smaller design footprint
2004-11-24 Philips announces world's smallest FM radio for mobile devices
Philips announced the world's smallest FM radio solution for mobile devices, one of three new additions to its portfolio
2006-06-27 Pericom introduces four analog switches for mobile terminals
Pericom Semiconductor introduced a new family of advanced analog switches created for mobile terminal applications which feature Chip Scale Packaging, very low On-Resistance and wide voltage ranges.
2014-12-17 Packaging and testing industry trends from 2013 to 2014
In 2014, the output value of OSAT industry is seen to grow by 8.4 per cent and the advanced packaging industry is expected to increase by 10 per cent
2015-06-29 OSATS: Wafer-level packaging limitations hard to dismiss
The recent SEMI Packaging Tech Seminar focused on the need, in terms of under yield and packaging cost pressures, to move from fan-out wafer-level-packaging to fan-out panel-level-packaging
2007-02-06 NXP, ASE to build testing and packaging center in China
NXP Semiconductors and Advanced Semiconductor Engineering will form a joint venture in Suzhou, China focused on semiconductor testing and packaging for mobile communications, consumer electronics and automotive products.
2013-08-14 NTU, STATS ChipPAC work on advanced wafer level packaging
Singapore's NTU has entered a joint research programme with STATS ChipPAC to advance solutions for next generation semiconductor packaging technologies
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