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2012-04-02 TI expands IC packaging options with bare die
The bare die program allows customers to order small quantities as low as 10 pieces for initial prototyping purposes, and larger quantities of full waffle trays for production purposes.
2005-09-21 Spansion, Atheros packaging solution reduces size of mobile phones
Spansion LLC and Atheros Communications Inc. have developed an innovative packaging solution that is designed to reduce the size of dual-mode cellular/wireless LAN (WLAN) mobile phones.
2008-09-22 Next-generation embedded packaging solution rolls
Imbera Electronics introduces its next-generation integrated module board technology, available across the company's full range of turnkey manufacturing services.
2002-04-29 Maxwell IC packaging protects against nuclear radiation
Maxwell Technologies Inc. has announced the availability of the Xray-Pak packaging solution that is intended to shield ICs that process and store data in military satellites from the radiation effects of nuclear blasts.
2003-10-06 Cadence teams with startup for packaging solution
Claiming to offer the industry's first integrated IC packaging design solution, Cadence Design Systems announced the availability of the APE-3D.
2005-08-26 Cadence solution to improve productivity, accuracy of design time
Cadence Design Systems announced the latest advances in its IC packaging technology, designed to improve productivity and accuracy for shorter design cycle time
2002-12-06 ASE rolls out packaging technology for RFICs
Advanced Semiconductor Engineering Inc. has introduced a QFN packaging solution.
2003-01-09 Amkor memory card packaging cuts cost in half
Amkor Technology Inc. has developed what it claims to be the industry's first leadframe-based memory for use in portable, handheld apps.
2013-07-10 A*STAR IME consortium delve into advanced packaging
A*STAR IME and a group of semiconductor firms have teamed up to address reliability and performance issues in packaging solutions for compact sized consumer electronics and high power electronics
2009-04-28 Wi-Fi/HSPA solution powers Classmate PCs
Huawei Technologies has developed the Huawei EM772, claimed to be first module to integrate two network standards, Wi-Fi and HSPA for Classmate PCs.
2008-11-21 Wafer-level packaging achieves prominence
Wafer-level packaging, the fabrication of the IC package directly on the wafer, is finally getting exposure after many years of promises, according to an expert in the field
2011-06-09 Test solution automates 3D IC deployment
Imec and Cadence has released a test solution that automates 3D stacked ICs deployment
2005-09-23 Synopsys unveils its latest floorplanning, analysis solution
Synopsys extended its floorplanning solution with the introduction of JupiterIOan enabling technology for concurrent die and package floorplanning and analysis that targets flip chip design flows
2015-09-28 SiP, PVS tech enabled for TSMC InFO packaging
Cadence said the Allegro SiP design tools and PVS allow TSMC customers to cut the InFO design and verification cycle by offering an integrated solution that automates the design-rule checking (DRC) flow
2015-02-05 Rudolph sends JetStep for fan-out packaging apps
The JetStep Advanced Packaging Lithography System handles both warped wafers and flexible substrates. It offers 52mm x 66mm field view and 30-reticle library
2009-08-14 Regulator offers complete DC/DC solution
The LTM8025 includes controller, power switches, inductor, compensation, input and output bypass capacitors.
2007-05-17 R&D center for high-end packaging opens in Singapore
STATS ChipPAC is laying the groundwork for its expansion into the high-end packaging market by building a new R&D center at its Singapore headquarters
2007-01-16 QFN packaging guidelines for RF designers
It seems such an irrelevant detail, but the component package is a strong determinant factor over layout flexibility.
2010-02-02 Power modules enable customer-specific solution
National's power modules simplify power supply design for FPGAs, microprocessors, DSPs and other POL conversions for medical, broadcast video, communications, industrial and military applications.
2006-01-25 PMDs offer low packaging profiles
NEC Electronics' new low-voltage power management devices promise to deliver very low packaging profiles that enable designers to realize a smaller design footprint
2004-06-01 Picking the best solution for glue logic
Make a better product by choosing higher integration logic solutions in a single reprogrammable chip that help you make a better product.
2012-07-05 Paintable batteries offer potential form-factor solution
Researchers from Rice University develop method that can turn any surface into a lithium-ion battery that may be combined with solar cells.
2011-04-28 Packaging tool offers advanced miniaturization
Cadence has unveiled the Allegro 16.5 PCB and IC packaging technology, offering capabilities that increase both productivity and predictability across silicon, SoC and system development
2004-04-28 Optimal design tools suit IC, packaging, PCB
Optimal has released its O-Wave series of products for 3D, full-wave signal integrity simulation, analysis and verification for high-speed IC, packaging and PCB
2007-05-29 On-wafer solution brings power devices to market faster
Cascade Microtech's Tesla system touts a complete on-wafer solution for overtemperature, low contact resistance measurements of power semiconductors of up to 60A (current in pulsed mode) and 3,000V (coaxial measurement
2008-06-20 NXP-Bibliotheca RFID solution powers German library
NXP Semiconductors has announced that the Max Planck Institute for European History of Law Library has chosen the Longlife RFID labels from Bibliotheca RFID Library Systems, based on the recently launched NXP ICODE SLI-SY chip.
2008-01-10 New packaging tech integrates cooling, power generation
Nextreme has integrated cooling and power generation into the copper pillar bumping process used in high-volume electronic packaging
2004-10-15 National's new solution simplifies design of PoE systems
National said it has released the first single-chip PD solution to feature the high performance and tiny package footprint needed to simplify PoE system design
2004-09-21 Molex acquires packaging supplier INCEP Technologies
Interconnection components supplier Molex Inc. has acquired INCEP Technologies Inc., in an attempt to penetrate the market for power delivery interconnect solutions.
2004-08-13 MKS, Umetrics to provide process control solution
MKS Instruments Inc. and Umetrics AB have collaborated to offer semiconductor manufacturers a turn-key solution for advanced process control (APC) and e-diagnostics
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