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2008-08-11 Trio seeks to cut costs in chip packaging
Infineon has granted licenses for its embedded Wafer-Level BGA chip packaging technology to competitor STMicroelectronics as well as STATS ChipPAC to lower costs and achieve higher market acceptance.
2004-01-23 Toshiba develops nine-layered packaging technology
Toshiba Corp. said it has developed a multichip package that can stack up to nine chips in its 1.4-mm high package.
2002-06-21 Tomorrow's technology points to present-day solutions
Off-key subjects were at the heart of several emerging technology sessions at the DAC that examined the challenges of next-gen designs while suggesting possible approaches to existing problems
2010-02-23 Tessera, Nanium ink packaging license deal
Tessera Inc. has signed a technology licensing agreement with Nanium, S.A, formerly known as Qimonda Portugal
2006-07-26 Tessera, Micron enter technology license agreement
Tessera Technologies Inc. announced a definitive technology license agreement with Micron Technology
2004-11-12 Tessera, Matsushita sign packaging agreement
Tessera Technologies Inc. has signed a technology licensing agreement with Matsushita Electric Ind. Co. Ltd (MEI), giving the Japanese consumer electronic supplier access to its IP portfolio of multi-chip and chip-scale packages
2009-11-26 Terepac, IMEC unite for flexible packaging
Terepac's patented photochemical printing process places thinned silicon dies and passive components on flexible substrates.
2015-09-28 SiP, PVS tech enabled for TSMC InFO packaging
Cadence said the Allegro SiP design tools and PVS allow TSMC customers to cut the InFO design and verification cycle by offering an integrated solution that automates the design-rule checking (DRC) flow.
2002-03-14 Shellcase expands Jerusalem wafer packaging facility
Israel's Shellcase, a developer of wafer level chip size packaging (WLCSP), has opened its $8 million expanded production facility in Jerusalem, Israel with 15,000-square-feet clean room space
2004-08-05 Sharp and Tessera expand packaging agreement
Seeking to broaden its exposure to the consumer electronics market, Tessera Technologies Inc. has expanded an existing agreement to license semiconductor packaging technology to Sharp Corp.
2006-07-07 SDRAM-DDR memory unit touts multichip plastic packaging
Austin Semiconductor has launched its 1.2Gbit, SDRAM-DDR memory family in a 219-pin BGA.
2011-12-20 Rambus, ITRI team up for 3D packaging
According to the two organizations, they will work together as members of Ad-STAC to push system integration using silicon interposer technology
2001-03-30 Portable Applications Drive Packaging Evolution
This paper gives an overview about the Micro SMD chip-scale packaging technology. It describes Micro SMD's advantages over traditional leaded plastic packages and explains mounting and handling considerations.
2006-01-25 PMDs offer low packaging profiles
NEC Electronics' new low-voltage power management devices promise to deliver very low packaging profiles that enable designers to realize a smaller design footprint
2006-01-30 Pillars replace balls in Intel processor packaging
Intel's Presler and Yonah processors make use of copper pillar bumping as an alternative to lead-tin solder balls, according to Chipworks.
2011-04-28 Packaging tool offers advanced miniaturization
Cadence has unveiled the Allegro 16.5 PCB and IC packaging technology, offering capabilities that increase both productivity and predictability across silicon, SoC and system development.
2004-10-27 New packaging technology solves design challenges in EHPS, EPS
IR introduced a new power packaging technology to solve design challenges found in EHPS, EPS and automotive motion control apps.
2004-09-21 Molex acquires packaging supplier INCEP Technologies
Interconnection components supplier Molex Inc. has acquired INCEP Technologies Inc., in an attempt to penetrate the market for power delivery interconnect solutions.
2003-01-24 Microsemi uses Powermite packaging on voltage suppression apps
Microsemi Corp. has applied its patented Powermite packaging technology on its latest line of low-profile surface mount transient voltage suppression products.
2003-09-03 Maxwell rolls hermetic die-based stack-packaging
Maxwell Technologies has introduced Rad-Stak, a radiation shielding technology that utilizes stacked packaging to create fully space-qualified components.
2002-05-23 ISSI ships MCPs in Fujitsu's FBGA technology
Integrated Silicon Solution Inc. has announced the shipment of a family of stacked multichip packaged (MCP) modules that uses Fujitsu Ltd's FBGA packaging technology.
2015-03-09 IoT drives chip packaging innovation
The need for high performance multi-functional devices in a single package is pushing the industry to innovate in multi-chip packaging. This high level of integration has presented huge challenge
2002-07-02 Infineon, Delta enter technology transfer agreement
Infineon Technologies AG and Delta Electronics Inc. have entered into an agreement for the licensing and transfer of MegaDIP, Infineon's transfer mold packaging technology, to Delta subsidiary Cyntec.
2007-11-14 Infineon reveals new packaging technology
Infineon Technologies unveils a new package technology, and has tapped Advanced Semiconductor Engineering as its IC packaging partner.
2007-10-02 Infineon licenses DirectFET technology from IR
Infineon will license from International Rectifier the latter's patented advanced power management packaging technology, DirectFET.
2007-11-08 IBM-led alliance ups investment in 32nm packaging
The Common Platform alliance led by IBM plans to increase its investment in semiconductor packaging technology to pave the way to 32nm devices.
2007-06-01 IBM gets on the road to 3D packaging
News that IBM Corp. this year will sample its first commercial devices to make direct metal connections between chips marks a small but significant milestone on the road to 3D packaging
2006-08-03 Freescale cuts die area, thickness with new chip packaging tech
Freescale's proprietary redistributed chip packaging technique delivers about a 30 percent reduction in packaged-die area and thickness
2011-03-10 Flip chip packaging boasts 40% lower cost
STATS ChipPAC releases a flip chip packaging technology, fcCUBE, that boasts high input/output density, high performance and reliability in advanced silicon nodes.
2011-06-17 FCI, Fujikura team up for IC packaging tech
FlipChip International and Fujikura Ltd are collaborating in innovating advanced semiconductor packaging technology.
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