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2004-06-14 Fairchild MOSFETs offer benefits of improved fast-switching technology
Fairchild's PowerTrench MOSFET process technology yields low values for Miller Charge, RDS(on) and total gate charge
2015-07-03 Examining 3D embedded substrate power packaging
Here is a look at 3D embedded substrate power packaging technologies, which will be increasingly deployed in everything from cell phones to hybrid electric vehicles
2003-04-28 Epson licenses Tessera packaging technology
Seiko Epson Corp. has entered a technology license agreement with Tessera Inc. to utilize the latter's semiconductor packaging technology in ASICs and specialty memory products.
2005-05-19 Discrete devices sport new packaging platform
Diodes launched its DFN packaging platform with a new line of discrete devices
2002-08-14 Cyntec licenses Infineon packaging technology
Infineon has licensed its MegaDIP transfer mold packaging technology to Cyntec Co. Ltd.
2005-07-19 Chipmos receives SOC packaging patent from MOEA
Chipmos Technologies Inc. (Chipmos Taiwan) has been granted a patent entitled "substrate-on-chip (SOC) packaging process" (Invention No. 207525) by the Intellectual Property Office of the Ministry of Economic Affairs (MOEA) of Taiwan
2005-01-20 Casio licenses packaging technology to Renesas
Casio Computer Co. Ltd has licensed its wafer level packaging (WLP) technology to Renesas Technology Corp. in an attempt to create an industry de facto packaging standard.
2003-07-17 ATMI, Air Liquide to promote packaging technology
ATMI and Air Liquide have formed an alliance to promote the productivity and safety benefits of the SAGE gas packaging process
2010-04-30 Assembly guidelines for Power33 packaging
This application note focuses on the soldering and back end processing of the Power33.
2007-09-10 ASE, Mitsui collaborate on HMT packaging tech
ASE and Mitsui have entered into a cross-licensing agreement and technical collaboration for Mitsui's Hybrid Manufacturing Technologies (HMT) packaging technology.
2005-05-03 ASE, FCI ink wafer level packaging deal
Advanced Semiconductor Engineering Inc. (ASE) and FlipChip International LLC (FCI) have signed an expanded technology licensing agreement
2002-12-06 ASE rolls out packaging technology for RFICs
Advanced Semiconductor Engineering Inc. has introduced a QFN packaging solution
2014-04-22 Altera adopts fine-pitch copper packaging for Arria FPGAs
TSMC's flip chip ball grid array package technology utilises fine-pitch copper bumps measuring less than 150?m, providing excellent bump joint fatigue life, improved performance in electro-migration current and low stress on the ELK layers
2005-04-19 All-quartz crystal packaging offers smaller size
Fox Electronics has expanded its FQ series of all-quartz crystal packaging technology to include a 5-by-3.2mm package size.
2014-10-29 Advances in power supply packaging
Here's a look at where the power industry is going in terms of component integration and thermal management. It also covers the developments in DC/DC power converter density.
2014-04-10 Advances in power converter packaging
Find out how packaging advances are matching semiconductor progress in power converter miniaturisation
2012-07-11 Advanced flip chip packaging tech unveiled
STATS ChipPAC's fcCuBE technology features copper column bumps, bond-on-lead (BOL) interconnection and enhanced assembly processes for high volume production
2012-03-09 A*STAR, Applied Materials unveil 3D chip packaging R&D center
The new facility positions Singapore as a global leader in semiconductor R&D and is expected to help accelerate the development and adoption of 3D packaging technology globally.
2015-11-12 A*STAR set-ups high density, low-cost packaging consortium
Together with industry partners, A*STAR's IME has set-up a high-density FOWLP consortium to extend FOWLP capabilities for applications such as smartphones, tablets, navigation tools and gaming consoles.
2007-08-21 A $60M funding for TSMC's packaging tech
Capital appropriations totaling $59.8 million will be set aside by Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) for use in establishing 300mm, wafer-level packaging technology.
2008-11-21 Wafer-level packaging achieves prominence
Wafer-level packaging, the fabrication of the IC package directly on the wafer, is finally getting exposure after many years of promises, according to an expert in the field
2011-11-22 Wafer packaging fab opens in Taiwan
STATS ChipPAC has increased production capacity with the completion of its 300mm wafer bump and WLCSP facility.
2003-09-22 Wafer bumping technology qualified at Chartered
Unitive Semiconductor Taiwan Corp. (UST) has announced that its electroplated wafer bumping technology has been qualified at Chartered Semiconductor
2004-04-21 Vate Technology to beef up its mini-BGA output
Vate Technology Corp., a testing and packaging house, is set to expand its monthly capacity for mini BGAs.
2007-01-22 UTAC: China testing, packaging industry yet to mature
Singapore's United Test and Assembly Center said that mainland China's IC testing and packaging industry still lacks market potential despite having Taiwan-based companies transfer their business to the region
2002-07-05 Unitive adopts Semitool's packaging platform
Semitool Inc. has announced the delivery of its electroplating system product, the Advanced Packaging Platform (APx), to Unitive Inc
2003-07-07 TSMC, Amkor partner on flip-chip packaging
Amkor Technology has developed and qualified wirebond and flip-chip packaging for devices manufactured on TSMC's advanced low-k process technologies.
2011-04-11 TSMC enters chip-packaging arena
TSMC will soon open a bumping facility and offer silicon interposers and TSV technologies for 3D chips, but will remain focused on the foundry market and will not compete against subcontractors.
2007-08-14 Torque sensor uses non-contacting technology
BI Technologies has developed a torque sensor based on its Magnetorque non-contacting sensor technology for power steering applications
2005-03-07 TI's VP outlines strategy to drive apps for RFID technology
With the RFID market poised to surge from millions to tens of billions of tags over the next five years, a critical mass of the technology will spur innovation and new applications across the enterprise value chain, according to Julie England, VP of Texas Instruments and general manager of the company's RFID business
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