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2002-02-08 TI unveils 90nm process technology
Texas Instruments Inc. has unveiled its 0.095m process technology, which will support transistor densities that allow chip-level multiprocessing, and require several techniques to manage power consumption
2004-12-16 TI op amp uses E-trim technology
Texas Instruments released a high-precision, high-speed 12V CMOS operational amplifier from its Burr-Brown product line that utilizes e-trim technology
2005-03-25 Tessera signs up Fujitsu as chip packaging licensee
Tessera Technologies Inc. has signed a technology licensing agreement with Fujitsu Ltd for packaging intellectual property.
2005-01-14 Taiwan reaffirms pledge to let some technology go to China
A Taiwanese official said the government would keep its promise to allow more technology companies to transfer manufacturing plants to China, particularly in the LCD and chip packaging industries.
2008-12-15 Surface mounting technology assembly guidelines for Fairchild’s microcouplers
Fairchild’s microcoupler products are simple to handle in the assembly area and use the same assembly process as the BGA platform. Here are surface mounting technology assembly guidelines for Fairchild's microcouplers
2005-11-11 Sumitomo backs packaging firm with $20 million
Quantum Leap Packaging Inc., a provider of electronics component packaging that uses liquid crystal polymer compounds, is to receive $20M in equity finance from Sumitomo
2003-07-29 STMicro announces new RF technology
STMicroelectronics has released details of a technology that uses MEMS techniques to integrate high performance RF switches into circuits
2012-07-16 Smart packaging electronics to be available by 2014
Thin Film and Bemis aim to produce a time-temperature sensor to be used by consumer goods by 2014.
2007-08-17 Shifting trends in packaging industry favor big players
Industry insiders agree the packaging business is getting increasingly expensive, a trend that naturally favors larger players
2005-10-03 Shaftless drive technology increases profitability of existing presses
The technology reinvents the mechanical drive system, eliminating the inconsistency while increasing flexibility and quality
2004-03-16 SEMI: Semiconductor packaging materials market to reach $11.7B
The market for semiconductor packaging materials is expected to grow from $7.9 billion in 2003 to $11.7 billion by 2008, according to SEMI and TechSearch International's latest report entitled
2006-01-25 Semi packaging materials to hit $20B in 2010
The market for semiconductor packaging materials is expected to grow from $12B in 2005 to $19.5B by 2010, according to SEMI and TechSearch International
2003-03-25 Sanmina-SCI licenses capacitance technology to Oak-Mitsui
Sanmina-SCI Corp. has announced that Oak-Mitsui Technologies has signed a licensing agreement to manufacture and market thin, film-based substrates using the company's patented Buried Capacitance technology
2007-07-06 Samsung advances technology for green electronics
Samsung announced it has succeeded in introducing more than a half dozen technological advancements that extend battery life in notebooks, MP3 players, digital cameras, video camcorders.
2014-02-07 Rise of mobile devices push market for wafer-level packaging
ReportsnReports predicted that the global wafer-level packaging equipment market will grow at a CAGR of 2.9 percent over the period from 2013-2018
2010-09-15 RCP technology manufactured in 300mm format
Nepes to manufacture Freescale technology that replaces deployed ball grid array packaging
2007-05-17 R&D center for high-end packaging opens in Singapore
STATS ChipPAC is laying the groundwork for its expansion into the high-end packaging market by building a new R&D center at its Singapore headquarters
2015-03-20 Power module packaging eases power electronics issues
The power packaging market is on the rise, pulled by the interconnection and substrate segments, respectively 14 per cent and 13 per cent between 2014 and 2020, revealed Yole
2002-09-18 Power IC uses "package-in-package" technology
ON Semiconductor's NIS3001 power management IC is packaged using PInPAK technology,enabling it to be integrated with a "packaged" analog driver and multiple MOSFETs
2007-08-15 Plastics electronic technology center rises in UK
PETeC, a plastics electronic technology center in the UK, is expected to become a national prototyping facility, offering clean rooms and laboratories, as well as production and testing equipment which will be available on an open-access basis
2014-06-10 Path Finder streamlines IC packaging across multiple PCBs
The suite features a path-finding methodology that automates optimisation and connectivity from a chip through multiple packaging variables, while targeting multiple and different PCB platforms
2013-09-23 Packaging vital for continued success of LED manufacturers
A recent market study from Yole Developpement the LED packaging market has rebounded from 2012's stagnation and will continue its growth until 2016
2005-09-01 Packaging becomes problem-solving tool
Package technology provides improved electrical and thermal performance for today's single-die power products
2006-11-13 Outsourced IC packaging to reach $13.1B
The market scale of outsourced IC packaging is estimated to hit $13.1 billion in 2006, with Taiwan gradually becoming a powerhouse in the test and packaging industry segment, according to Research and Markets
2004-10-18 Osram integrates thin-film technology in IREDs
Osram Opto Semiconductors is now using thin-film technology not only for LEDs but also for IR components
2015-06-29 OSATS: Wafer-level packaging limitations hard to dismiss
The recent SEMI Packaging Tech Seminar focused on the need, in terms of under yield and packaging cost pressures, to move from fan-out wafer-level-packaging to fan-out panel-level-packaging
2002-11-22 Oki brings environment-friendly packaging to its facilities
Oki Electric Ind. Co. Ltd has successfully developed a lead-free solder plating technology for semiconductor package terminals
2013-08-14 NTU, STATS ChipPAC work on advanced wafer level packaging
Singapore's NTU has entered a joint research programme with STATS ChipPAC to advance solutions for next generation semiconductor packaging technologies
2008-09-22 Next-generation embedded packaging solution rolls
Imbera Electronics introduces its next-generation integrated module board technology, available across the company's full range of turnkey manufacturing services
2008-01-10 New packaging tech integrates cooling, power generation
Nextreme has integrated cooling and power generation into the copper pillar bumping process used in high-volume electronic packaging
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