Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Advanced Search > packaging technology

packaging technology Search results

?
?
total search1723 articles
2002-06-26 Nanometrics rolls out 300mm wafer inspection technology
Nanometrics Inc. has launched the NanoUDI technology for 300mm wafer processing, which meets requirements for yield management
2003-10-30 Micron releases DDR2 SDRAMS in FBGA packaging
Micron Technology Inc. has shipped what it claims is the industry's first 1Gb DDR2 SDRAM components
2004-11-11 Microchip offers lead-free product packaging
Microchip Technology Inc., a provider of microcontroller and analog semiconductors, disclosed the conversion of its product packaging to environmentally friendly lead (Pb)-free plating, beginning January 2005.
2013-07-26 Metrology system configured for advanced packaging
Rudolph Technologies' metrology suite includes specially-designed configurations for wafer level packaging, 2.5D (interposer) and 3D ICs using through-silicon via (TSV) as interconnects
2003-06-12 Mentor PCB acquisition boosts packaging design
The ongoing consolidation of the PCB CAD marketplace has resumed, as Mentor Graphics announced its purchase of the assets of Dansk Data Electronik-EDA A/S.
2007-08-16 MEMS pioneer draws up technology's course
MEMS pioneer Kurt Petersen of SiTime shares MEMS' development since the 1980s as well as his thoughts on where it is headed in the future.
2002-04-29 Maxwell IC packaging protects against nuclear radiation
Maxwell Technologies Inc. has announced the availability of the Xray-Pak packaging solution that is intended to shield ICs that process and store data in military satellites from the radiation effects of nuclear blasts
2016-04-01 Marvell to use SerDes technology for multi-die products
The Glasswing chip-to-chip technology from Swiss startup, Kandou, is based on the Chord signaling method, which produces an energy efficiency that enables architectural innovation
2005-04-28 Mainland China, Taiwan tighten LED packaging race
LED packaging companies based in Taiwan may suffer temporary revenue setbacks this year as the industry faces tight competition with rival firms based in mainland China
2002-05-15 Logic offered in no-lead QFN packaging
Texas Instruments, Integrated Device Technology, and Hitachi Semiconductor are launching 20-, 16- and 14-pin QFN packaging for gate- and octal-bit-width logic devices for PDAs, cell phones, and other handheld consumer electronics.
2013-01-16 LED packaging to experience year upswing, says Yole
According to Yole Dveloppement's latest report, the LED packaging materials market will enjoy a 20 per cent CAGR during the period 2012-2017, with its growth driven by package substrate and phosphors
2009-05-27 ITC favors Tessera in packaging patent suit
The U.S. International Trade Commission (ITC) has issued a limited exclusion order blocking the import of chips from six companies it has determined infringed two packaging patents of Tessera Technologies Inc
2004-12-10 Intel bullish on technology direction at analysts' meeting
Sounding anything other than a company that has had its share of missteps in recent months, outgoing Intel chief executive Craig Barrett expressed confidence and even a bit of cockiness at the company's Fall analysts' conference in New York on Tuesday (Dec. 7), predicting Intel's technology strengths would distance the semiconductor giant from its competitors
2007-10-18 Industrial affiliation program tackles 32nm IC packaging
Two research centers are inviting industry partners to participate in an advanced research program on next-generation flip-chip and substrate technologies.
2004-09-16 Indonesians worry about technology brain drain
Top engineering university in Indonesia is being privatized as one step toward stemming brain-drain trend.
2003-10-22 IMEC, EVG partner on packaging, bonding techniques
Inter-university MicroElectronics Center (IMEC) and EV Group (EVG) have signed a joint development agreement on wafer-level packaging and MEMS wafer bonding
2014-01-16 Imec modelling tool estimates cost of chip technology nodes
Imec and AlixPartners are co-developing a cost modelling solution to assess the cost of advanced semiconductor technology options. This modelling will assess the cost of various patterning options for N10/N7 nodes, advanced packaging solutions, and 3D NAND memory.
2013-04-02 IME, UTAC team up for 2.5D TSI packaging solutions
United Test and Assembly Center will collaborate with A*STAR's IME to develop a 2.5D Through-Silicon-Interposer (TSI) platform for packaging solutions
2007-11-16 Image sensor packaging slims down for CE, cars
Solid-state image sensors must be packaged to protect against corrosion, mechanical damage and obscuration by dust particles. Current wafer-level packages provide a low-cost, chip-size solution with a total thickness of less than 500m that will also pass stringent automotive reliability standards.
2005-09-21 IDT offers network engines in RoHS-compliant flip-chip packaging
Integrated Device Technology Inc. (IDT) has begun volume production of its RoHS (Restriction on Hazardous Substances)-compliant flip-chip packaged monolithic 512Kx36 (18Mbit) and 256Kx36 (9Mbit) network search engines (NSEs) with dual Network Processor Forum (NPF) Look Aside (LA-1) interfaces
2005-12-27 IC packaging providers upbeat
Continued strength in the IC packaging and test sector during the fourth quarter and possibly beyond has prompted an investment banking firm to raise its estimates for Amkor, Siliconware and STATS ChipPAC
2009-10-23 IC packaging becomes more challenging
Analog design remains challenging but IC packaging is becoming an issue in the arena
2005-07-08 IC packaging and testing companies expect high revenues in Q3
Most IC packaging and testing companies in Taiwan are anticipating significantly higher revenues in the second half of the year, as increasing demand has shown signs of market potential in June
2012-01-19 IC market to tug chip packaging, testing sales
For Q1, testing and packaging firms forecast a dip in sales from 5-10 percent, although a rebound is forecast for Q3
2006-05-02 IC design companies press for lower testing, packaging quotes
Despite strong demand for foundry services by IC design companies, they are withholding orders for testing and packaging services in a bid to pull down prices, according to industry sources
2004-05-21 IBM jettisons IC-packaging units, sells plants to Amkor
IBM Corp. has moved to jettison its chip assembly and packaging operations, announcing a major deal with Amkor Technology Inc.
2007-04-17 IBM advances through-silicon via packaging tech
IBM Corp. announced it has made advances in through-silicon via packaging that will allow it to ship production chips using the new interconnect in 2008
2004-04-14 HKSTP, ASAT to promote chip packaging in HK, China
The Hong Kong Science and Technology Parks Corp. (HKSTP) has formed a strategic alliance with ASAT Holdings Ltd, a provider of semiconductor package design, assembly, and test services, to cooperatively promote IC packaging and test related services in Hong Kong and mainland China.
2006-07-17 Green IC packaging addresses environmental concerns
As new environmental regulations are enacted and a universal recognition of the benefits of Green design and manufacturing practices percolates, adherence to manufacturing regulations will become a basic requirement for participation in world markets.
2004-04-01 GEM Services to offer Fairchild MOSFET packaging tech
Fairchild Semiconductor has reached a licensing agreement with GEM Services Inc.
Bloggers Say

Bloggers Say

See what engineers like you are posting on our pages.

?
?
Back to Top