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2015-02-26 Fan-out wafer level packaging to reach $200 million, analysts say
Market researchers predict in a new report that the Fan-Out Wafer Level Packaging (FOWLP) market is likely to reach an estimated $200 million in 2015, expects 30 per cent CAGR in the following years
2004-03-23 Fairchild to license MOSFET packaging tech to GEM
Fairchild Semiconductor has reached a licensing agreement with GEM Services Inc. under which the company is offering one of its advanced MOSFET packaging technologies as open tooling for the power semiconductor market
2002-09-20 Fairchild establishes packaging design center in Korea
Fairchild Semiconductor has launched a Package and Technology Knowledge Center in Bucheon, South Korea
2013-08-22 Embedded packaging cuts PoP height by 40
STATS ChipPAC's ultra thin embedded Wafer Level Ball Grid Array (eWLB) technology offers height reduction in the bottom PoP architecture to provide an ultra thin z-height of 0.3mm
2003-09-26 EGLS announces new automatic probing technology
Test handling solutions provider Electroglas (EGLS) showcased its EG5300 NETprober and Sidewinder equipment at the Semicon Taiwan for the first time.
2015-07-15 E-band cost, reliability concerns in MMIC packaging
Traditional semiconductor packaging approaches either cost too much or suffer from signal integrity issues. However, new techniques are becoming available that can address these problems
2009-07-14 Duo works on bonding solution for 3D packaging
SUSS MicroTec and Thin Materials AG are cooperating on a temporary bonding solution to be used for challenging thin wafer-handling technologies required for emerging 3D integration and packaging technologies
2010-03-17 DS helps improve P&G packaging, artwork process
Procter & Gamble (P&G) has extended its implementation of Dassault Systèmes' V6 PLM (product lifecycle management) to incorporate global packaging and artwork initiatives
2002-02-18 Dow Corning establishes thin-film technology platform
Dow Corning Corp. has established a thin-film technology platform that will help the company identify, develop and promote new products based on thin-film materials and processes
2013-07-10 Dow Corning boards Imec's 3D IC packaging initiative
Dow Corning has teamed up with Imec to advance enabling technologies for 3D IC semiconductor packaging
2014-01-20 Double-layer capping improves packaging for MEMS devices
Researchers from A*STAR IME developed a thin-film MEMS encapsulation that promises ambient conditions for devices to operate properly and offer protection for fragile hanging structures.
2003-02-28 CyOptics purchases CENiX automated packaging operations
CyOptics Inc. has acquired the optical component packaging capabilities of CENiX Inc
2006-07-10 Cookson, Microbonds to align technology roadmaps
Cookson Electronics and Microbonds partner to align the technology roadmaps of Microbonds' insulated wire bonding technology with Cookson's molding compounds
2003-05-21 ChipPAC PBGA packaging targets high-power ICs
ChipPAC Inc. has announced the availability of its thermally-enhanced PBGA packaging TEBGA-II and TEBGA-IIplus
2002-07-16 ChipMOS develops high-speed wafer test technology
ChipMOS Technologies (Bermuda) Ltd has developed a high-speed wafer test technology that probes 32 DDR DRAMs (200MHz, 400Mb) in parallel
2002-07-30 Chipbond, Fupo to combine package technology businesses
Chipbond Technology Corp. and Fupo Electronics Corp. have entered into a merger agreement to combine their gold bumping and TCP businesses for TFT- and STN driver ICs
2004-03-10 Chipbond buys Ultratech packaging lithography tool
Taiwan foundry Chipbond Technology Corp. has purchased Ultratech Inc.'s Saturn Spectrum 3e advanced packaging lithography tool.
2009-02-17 Chip packaging houses in red, too
Like the silicon foundries, IC-packaging houses are also seeing red ink
2003-10-06 Cadence teams with startup for packaging solution
Claiming to offer the industry's first integrated IC packaging design solution, Cadence Design Systems announced the availability of the APE-3D
2002-08-21 Cadence launches Asian symposium on nanometer technology
Cadence Design Systems Inc. has slated the first annual Asia Cadence Technology Symposium (ACTS) for its customers in the Asia-Pacific region
2003-08-11 Cadence announces second Asia technology symposium
Cadence Design Systems Inc. has announced the second Asia Cadence Technology Symposium (ACTS) for design engineers across the Asia-Pacific region
2004-01-14 Automotive sensor technology to further shine: IMS
The automotive sensor technology is expected to continue growing throughout the decade, according to a new IMS Research report
2002-05-29 August Technology acquires test equipment maker
August Technology Corp. has acquired Semiconductor Technologies and Instruments Inc., a manufacturer of automated micro-defect inspection equipment formerly owned by ASTI Holdings Ltd of Singapore
2006-02-23 ATMI, TEL partner in photoresist packaging system
ATMI Packaging, a provider of high quality materials-handling solutions, unveiled a packaging system designed for direct pressure dispensing of advanced photoresist chemicals
2005-05-31 Athlon dual-core processor fits in 939-pin micro PGA packaging
AMD says its new Athlon 64 X2 dual-core processor delivers the performance of a multi-core processor with the same 939-pin micro PGA type packaging as the single-core Athlon 64 CPU
2009-10-27 Assembly guidelines for MicroFET-6 packaging
This application note focuses on the soldering and back end processing of the MicroFET-6.
2009-10-26 Assembly guidelines for Dual Power56 Packaging
This application note focuses on the soldering and back end processing of the Dual Power56.
2002-07-09 ASM receives patents for PECVD low-k dielectric technology
ASM Int. N.V. has been granted patents no. 6,352,945, 6,383,955 and 6,410,463 by the U.S. Patent & Trademark Office.
2011-04-18 Applied announces packaging, display forays
Applied Materials has teamed up with IME to build a center for advanced packaging in Singapore
2007-07-19 Amkor, IMEC sign 3D wafer-level packaging pact
Amkor has agreed to develop 3D integration technology with IMEC based on its wafer-level processing techniques
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