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2009-02-04 Analysis: What's in store for IBM's chip unit?
IBM Corp.'s recent move to implement job cuts within its semiconductor unit follows a dramatic slump in sales, product setbacks and numerous false starts in the sector.
2005-01-04 Analog IC design stays strong
Just when people thought that analog will slowly disappear because of the advent of the digital age, the analog IC market stays strong.
2007-06-18 AMD predicts multicore future
Dave Orton, ATI's former CEO and now AMD's executive VP for Visual and Media Business, talked with EE Times about some of the company's targets and technical hurdles with getting Fusion devices ready for market. He also elaborated on AMD's vision and its progress toward the multicore future.
2016-04-22 AMD closes $293 million deal for x86 architecture
The $293 million deal with the Chinese firm gives AMD a needed infusion of cash and a partner in China, the world's second largest and fastest growing server market.
2007-11-15 Altera, Synopsys to offer Nios II for ASIC designs
Altera and Synopsys have announced that Altera's Nios II processor core will be available for licensing through Synopsys' DesignWare Star IP Program.
2012-11-16 Altera, Huawei incorporate FPGA, memory in 2.5-D tech
The new device will significantly reduce board space while increasing performance.
2013-10-18 Altera outs low-cost dev kits based on Cyclone V FPGAs
With an entry point of just $49, the company boasts the broadest portfolio of low-cost solutions that claim to deliver optimal power and performance based on customer's unique design requirements.
2012-10-05 Altera moves from Cu to optical backplanes
Improving the I/O bandwidth to support 28Gb/s backplane links and a new DSP architecture that focuses on the bandwidth are key elements of the 20nm products that Altera will launch next year.
2015-04-08 Altera delivers UBM-free WLCSP
Altera, together with TSMC, designed an ultra-thin, UBM-free wafer-level chip scale package for Altera's MAX 10 field programmable gate arrays.
2002-10-09 Alliance SRAMs exhibit 6.5ns access speed
Alliance Semiconductor Corp. has announced the release of its 18Mb SRAMs that can be configured to operate in pipelined mode with clock rates of up to 250MHz or flow-through mode with access times up to 6.5ns.
2008-12-22 Alliance seeks funds to create Li-ion cell fab
The National Advanced Transportation Battery Cell Manufacture alliance is seeking $1 billion or more of U.S. government funding to create a fab for Li-ion cells.
2008-06-13 Alchimer picks Lenix as Korea representative for TSV
Alchimer, a provider of nanometric films for through-silicon via (TSV) metallization, has appointed Lenix as its representative in Korea.
2004-11-05 Agilent spins mixed-signal scope dynamic probe for Xilinx FPGAs
Agilent Technologies is debuting what it says is the industry's first FPGA dynamic probe application.
2012-05-10 After Elpida-Micron, then what?
When Micron and Elpida integrate, their combined market share will bring Micron's market share to nearly 24 percent, surpassing SK Hynix's 23.9 percent.
2005-06-15 Aeluros makes 'green' versions
Aeluros recently announced green variants of its Puma 10Gbps physical layer IC devices.
2004-03-30 Aehr supplies Fuji Xerox with wafer test system
Aehr Test Systems, a supplier of semiconductor test and burn-in equipment, has delivered Fuji Xerox Co. Ltd with a FOX full wafer contact test and burn-in system.
2008-05-13 Advantest eases high-volume DDR3-SDRAM testing
Advantest's T5503 memory test system was developed specifically to address the challenges of high-volume production test of next-generation high-speed DDR3-SDRAM.
2015-09-03 ADI silently snatches piezoelectric MEMS start-up
Analog Devices acquired piezoelectric MEMS resonator startup Sand 9, which hit technical issues amidst changing markets and effectively outlasted investors' patience.
2014-11-13 ADI receiver can digitise IF frequencies from 70-450MHz
The AD6676 is a single-chip wideband IF receiver subsystem that can be configured to achieve a noise figure of 13dB, IIP3=36dBM, noise spectral density (NSD) as low as -160dBFS/Hz.
2003-06-19 ADI digital isolators reduce per-channel costs
Analog Devices Inc. has announced the addition of multi-channel digital isolators to its iCoupler family of high-voltage digital isolators.
2011-08-01 Addressing signal integrity issues in high-speed flash devices
Learn what can affect signal integrity and how to model and measure it.
2015-10-08 Addressing security risks in the IoT age
Learn about the need to apply known security techniques to a new environment that operates under a set of additional constraints.
2015-09-14 Addressing PCB size limits in wearables
Wireless wearable applications call for a degree of IC, package, and board size reductions that only wafer-level chip-scale integration can solve.
2005-01-04 Addressing foundry SoC challenges associated with advanced technologies
As process technologies continue to shrink to 90nm and below, new opportunities are presented to designers that allow them to combine the functions of entire systems onto a single piece of silicon.
2015-03-10 Addressing difficult thermal analysis problems
Find out how a simple analogue ASIC can be used to solve a difficult thermal analysis problem. It allows system designers to fully model, measure and modify designs before committing to costly silicon.
2014-06-05 Address SoC routing congestion with 2.5D SiP
The best of both worlds approach that the electronics industry has come up with to solve a design dilemma is the System in Package (SiP) in a 2D package.
2003-05-16 Actel tools FPGAs for auto niche
Actel VP of Product Marketing Barry Marsh foresees that FPGAs would have a greater market on the automobile industry as manufacturers rely on programmable ICs for their telematic systems.
2005-07-13 Actel makes LGA package available to RTAX-S FPGA offering
Actel disclosed that it has expanded its package selection to include a Land Grid Array option for its RTAX-S FPGA family.
2002-07-09 Actel FPGA family delivers >500MHz operation
Actel Corp. has launched its Axcelerator family of FPGAs that range from 125,000 to 2 million system gates, delivering >500MHz operation and up to 100 percent resource utilization.
2013-07-22 AC-DC wall charger interface IC cuts smart device charge time
Power Integrations' AC-DC wall charger interface IC mobile device designers to implement the Qualcomm's Quick Charge 2.0 protocol.
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