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2009-07-24 AAC opens Singapore R&D center
The office offers training, technical support services and sales, marketing control and planning.
2008-02-19 A/V, memory glitz and glam at IIC-China
This year's IIC-China will gather over 240 international IC tycoons and local manufacturers to showcase their latest and offerings to satisfy the increasing demand for high-quality and high-definition consumer electronics.
2013-02-04 A*STAR, Petroleum Geo-Services join for MEMS sensors
Targeting oil and gas applications, the MEMS sensor is to be incorporated into a PGS commercial streamer system to acquire more precise seismic data during seismic survey.
2013-06-25 A*STAR IME, IC firms team up to tackle industry issues
A*STAR Institute of Microelectronics launched the 2.5D Through-Silicon Interposer Consortium to speed market adoption of TSI tech, which is driven by demands in computer infrastructure and CEs.
2012-05-08 A primer on JESD204 standard for ADCs
Learn about this digital interface standard and its design implications.
2013-03-04 A primer on FRAM (Part 2)
Understand charge thresholds, bit line capacitance ratios, and why retention is a bigger problem than fatigue.
2011-09-27 A primer on 3D-IC design challenges
Know the 3D-IC design challenges such as system exploration, floorplanning, analysis, and design for test (DFT), and learn how designs will evolve as 3D-IC goes on to become a necessity for managing power, performance, form factor, and cost goals.
2004-03-29 A new sun rises in the East
Sunpower Philippines Mfg Ltd recently held its formal inauguration rites for its new manufacturing facility in Laguna Technopark located South of Manila in the Philippines.
2015-07-28 A closer look inside SK Hynix's 1st high bandwidth memory
SK Hynix's HBM has a 1,024-wide bus. It employs a base logic die as an interface between the four DRAM die stack and an interposer that supports both the HBM modules and the AMD GPU.
2003-03-27 90nm design flow is seen as a community effort
Yields for ICs with geometries below 100nm may not exceed 50 or 60 percent, according to Pallab Chatterjee, president of tool integrator SiliconMap and organizer of a panel at the International Symposium on Quality in Electronic Design (iSQED).
2014-10-21 8 awesome gifts for your family
We put together some awesome gift ideas for family and friends. The catch? Everything's electronics-related, of course.
2006-08-16 6th ESC-Taiwan gathers world's leading embedded tool vendors
Design engineers in Taiwan will be treated to an array of leading-edge technologies as the world's major embedded tool suppliers gather to showcase their products at the 6th Embedded Systems Conference-Taiwan.
2015-09-10 60 start-up companies to watch in 2015
EE Times has selected 30 start-up companies to come on to version 16.1 of its list of 60 firms that are worth keeping an eye on. Readers are welcome to nominate their own emerging companies.
2010-06-09 5Mpixel sensor brings 1080p HD video to handsets
From OmniVision Technologies Inc. comes a complete 5Mpixel SoC camera solution aimed at penetrating the high-volume autofocus camera phone market.
2007-05-25 5mm round LEDs target solid-state lighting apps
Avago Technologies has released a series of high-brightness warm white through-hole (TH) LEDs in a 5mm round package for use in a wide range of solid-state lighting and illumination applications.
2010-05-04 512Mbit PRAM comes in multi-chip package
Samsung Electronics Co. Ltd has begun shipping what it claims is the first multi-chip package (MCP) with phase-change RAM (PRAM) for use in mobile handsets beginning later this quarter.
2007-11-01 45nm designs demand efficient floorplans
With the migration to 45nm cores, optimized I/O planning and placement will become even more critical. These challenges beg the question: Who should take charge of a chip's I/O plan along with the considerations for the package and the rest of the system?
2013-11-21 3M, Allied Control uncloak immersion cooling data center
Using 3M Novec Engineered Fluids as the primary coolant, Allied Control completed the data center project that aims to reduce energy use in data centers.
2003-10-28 3M signs Fiberguide as OEM reseller
The 3M Optical Component business and Fiberguide Ind. Inc. have entered into a reseller agreement for Fiberguide to become an authorized OEM reseller.
2011-06-28 3M opens innovation center in Taiwan
3M's application laboratory in Yangmei, Taiwan will provide support for 3D ICs and ultra-thin wafer handling for the semiconductor industry.
2014-02-06 3D TSV Summit underscores cost-effective production
From a maker's perspective, 3D IC production will only ramp up if the added costs for implementing TSVs and all the ensuing steps can be largely compensated by the IC performance benefits.
2014-05-08 3D chip-making technique utilises metallisation layers
The technique fabricates active devices interleaved between the metallisation layers atop a standard CMOS die, eliminating the expense of vertically stacked transistors or of stacking dies with TSVs.
2010-07-16 3D chip standard talks start at Semicon West
Participants of a Semicon West 2010 workshop took the first crack at outlining standards for 3D silicon chips to address design, yield and cost problems.
2013-10-23 3-phase MOSFET bridge APM handles 2kW load
A three-phase bridge MOSFET automotive power module can be used to improve the system design for electrified automotive accessories.
2010-06-23 28nm FPGAs handle over two million logic cells
Xilinx Inc.'s 28nm series 7 FPGAS will feature 50 percent power reduction compared to the company's 40nm devices and offer capacity of up to 2 million logic cells
2011-01-03 2011: Convergence, content everywhere tests innovation cycle
2010 saw significant innovation and 2011 promises a more aggressive pace. Many of the challenges will come from the trend towards convergence in the consumer electronics market.
2009-01-22 2009: year of green FPD implementation
DisplaySearch reports that 20 percent of flat-panel display (FPD) shipments in 2008 had green features, making it the year of green FPD development, and dubs 2009 as the year of green implementation.
2009-01-06 2009 IC fearless forecasts
2009 is just beginning to unfold in the electronics industry and there is already a looming uncertainty based on recent industry data.
2010-01-18 200/250V MOSFETs claim lowest figure of merit
Infineon has launched a family of 200V and 250V power MOSFETs for synchronous rectification in 48V systems, DC/DC converters, UPS and inverters for DC motor drives.
2008-12-19 200 Gbps silicon photonic integrated chip
To fully exploit the computing power of multi-core and many-core computers, there is a need of high-speed and high-capacity communication network that can manage enormous data transport among the cores and memories.
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