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2008-08-29 STATS ChipPAC, Infineon ink eWLB manufacturing deal
STATS ChipPAC Ltd has entered into an agreement with Infineon Technologies AG to provide manufacturing services for products based on Infineon's first generation embedded eWLB technology
2014-01-23 STATS ChipPAC makes IEEE patent ranking
STATS ChipPAC was recognised for patent innovations by the IEEE for the third consecutive year.
2012-04-26 SEMICON panel highlights SEA's semiconductor opportunities
Experts highlight collaboration, R&D in cutting-edge technologies, and workforce development in Southeast Asia's semiconductor industries.
2003-09-26 Sanyo expands coverage of Tessera license pact
Sanyo Electric Co. Ltd and Tessera Inc. have signed a new licensing agreement.
2008-05-01 Partition and package to miniaturize handsets
Designers are turning to system-in-package, 3D IC stacking and wafer-level packaging to enable the acute miniaturization found in handsets, particularly for RF functions
2010-10-26 P3T makes flexible ICs sustainable
The Fraunhofer Institute for Surface Engineering and Thin Films presents a process for making thin film circuits and biosensors that cuts energy and materials used.
2013-05-06 MOSIS joins push for silicon photonics tech
The firm's partnership with ePIXfab gives MOSIS customers access to Imec's modern fully integrated silicon photonics processes and Tyndall's advanced silicon photonics packaging technology.
2006-08-08 Micron betting on "innovation, execution" to manage portfolio
Micron is betting on "innovation" and "execution" to help manage its diverse product portfolio in different industry sectors.
2002-09-17 Matsushita embeds SoCs, components in substrate
Matsushita Electric Ind. Co. Ltd. has developed a 3D, multilayered module technology that connects SoCs with passive components by embedding them in substrate layers
2011-09-30 Malaysian firm makes Forbes list
The vision inspection firm is among the 14 Malaysian companies on the 2011 Forbes Asia's 200 Best Under a Billion List.
2006-10-17 Korean, U.S. companies partner on deep UV LEDs
Seoul Optodevice and Sensor Electronic Technology have completed the joint development of a new line of deep UV LEDs that double output power and lifetime than existing devices
2008-01-31 Israeli startup gets multimillion investment from Samsung
South Korea's Samsung Ventures Investment has made a multimillion dollar investment in Micro Components, its first in an Israeli technology company
2015-03-09 IoT fragmentation will aid fast-moving companies
In the third and final part of the series on the IoT market, Handel H. Jones, founder and CEO of IBS, talks about what semiconductor vendors need to do to be successful in this market.
2014-04-09 Industrial machinery market growth to double in 2014
Increasing demand from auto making to packaging will drive growth in the industrial machinery market, said IHS
2002-03-18 Fujitsu develops eight-stacked MCP
Fujitsu Ltd has developed an ultra-high density, multi-chip package (MCP) that can support up to eight chips mounted on a single MCP.
2006-02-14 FlipChip begins construction of bumping facility
FlipChip International announced that it started construction of an advanced bumping facility for a new joint venture in China with Millennium Microtech (Shanghai) Co. Ltd.
2005-06-08 Experts mull interconnect beyond 65nm
A panel at the International Interconnect Technology Conference here examined the vexing question of the IC interconnect stack at 45nm and beyond
2010-06-25 EC funds green cloud services project
The EuroCloud project, funded by the European Commission for an initial three years, aims to validate constructing data center platforms using of low-power processing and 3D chip packaging
2009-07-14 Dual MOSFET solution designed for notebooks
Fairchild Semiconductor brings designers a dual MOSFET solution that suits notebooks, netbooks, servers, telecom and other DC/DC designs. The FDMC8200 integrates an optimized control (high-side) and synchronous (low-side) 30V N-Channel MOSFET into one 3mm x 3mm MLP module.
2011-07-11 ChipMOS, CTJ ink tech transfer agreement
ChipMOS will gain IP rights from CTJ and will jointly develop cost effective packaging and LCD driver assembly solutions
2003-04-29 China's GAPT deploys Teradyne device test system
Global Advanced Packaging Technology Co. Ltd has purchased another test system from Teradyne Inc. - the Catalyst, for a wide range of device testing.
2005-08-26 Cadence solution to improve productivity, accuracy of design time
Cadence Design Systems announced the latest advances in its IC packaging technology, designed to improve productivity and accuracy for shorter design cycle time.
2008-06-23 AuthenTec offers TouchStone to waterproof cellphones
According to AuthenTec, its TouchStone fingerprint sensor packaging technology will enable future generations of waterproof cellphones.
2007-11-27 ASE places litho order with Suss MicroTec
German semiconductor equipment manufacturer Suss MicroTec AG has received multiple orders for its lithography production equipment from Taiwan-based chip packaging technology provider ASE Group.
2002-04-25 Amkor to take over Fujitsu assembly plant in Japan
Amkor Technology Inc. will take over a Fujitsu Ltd. semiconductor assembly factory as make it its second assembly operation in Japan
2006-12-21 AMD goes 'green' with Pb-free bumping tech
Advanced Micro Devices has entered into an agreement to license Amkor Technology's Pb-free electroplated wafer bumping technology
2004-03-03 Agilent filters integrate into GSM RF modules
Agilent Technologies is shipping samples of the industry's smallest filter to select manufacturers for integration into GSM RF front-end modules.
2006-10-02 3D interconnects transmit at 100Gbps
NEC Electronics has launched a wafer-level packaging technology that allows more than 1,000 3D interconnections between the logic and memory dice used in an image-processing system.
2005-05-02 ZyCube duo has big plans for 3D circuits
Two executives from Zycube Co. Ltd lay the road map for significant trends in 3D technology
2003-03-24 Zia inks manufacturing agreement with Emcore
Zia Laser Inc., and Emcore Corp. have agreed upon a sublease and contract manufacturing arrangement for high volume epitaxial growth and laser diode processing.
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