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2008-02-26 Yole sees increasing WLP adoption in ICs
Yole Dveloppement released an analysis on the adoption of WLP in semiconductors based on the idea that WLP technology can be implemented in the most cost sensitive applications
2006-06-09 Work begins on SemIndia fab
The foundation stone for the $3 billion SemIndia wafer fab was laid at Shamshabad in southern Andhra Pradesh state.
2010-01-06 White LED deliver over 120lm/W
SemiLEDs Corp. is offering its I-core LED that achieves over 120lm/W in an optimized white light package, as tested by two China LED packaging companies
2009-04-02 Wafer-level optics tech licensed to Qtech
Q Technology Ltd has licensed Tessera Technologies Inc.'s OptiML wafer-level optics (WLO) technology for next-generation mobile electronics. China-based Qtech will integrate the technology into its compact modules for cellphone and notebook computer applications
2003-06-20 USI SiP module achieves better RF efficiency
Universal Scientific Industrial Co. Ltd. has announced the SiP module that combines Agere Systems' Wi-Fi and Cambridge Silicon Radio's Bluetooth technology
2003-09-11 USI SiP module achieves better RF efficiency
Universal Scientific Industrial Co. Ltd. has announced the availability of an SiP module that combines Agere's Wi-Fi and CSR's Bluetooth technology
2005-12-07 USB-UART bridge integrates MCU clock generator
Future Technology Devices unveiled the FT232R, the next generation of its USB-UART bridge family. The FT232R includes onboard EEPROM, as well as a master clock generator, 3.3V LDO regulator, reset generator and USB termination resistors
2008-06-20 Unisem, FlipChip deal zeroes in on wafer technologies
Unisem and its subsidiary Unisem-Advanpack Technologies Sdn Bhd (UAT) have entered into an agreement with FlipChip International LLC (FCI) for the licensing of FCI's wafer bumping and wafer level packaging technologies
2007-07-10 Understanding flip-chip and chip-scale package technologies and their applications
This article first defines the terms "flip chip" and "chip-scale package" and explains the technical development of wafer-level packaging (WLP) technology.
2003-03-13 Uncooled DFB laser exhibits linearity up to 85C
EBookham Technology plc and Cambridge University have announced the development of a directly modulated DFB laser that exhibits wide bandwidth features
2002-07-16 TwinMOS, ACE forge alliance agreement
Taiwan memory module company TwinMOS Technologies Inc. has signed a production agreement with Advanced Chip Engineering Technology Inc
2013-10-11 TU Delft, Imec co-author test flow for 3D IC optimisation
3D-COSTAR aims to optimise the test flow of 3D stacked ICs by compiling the yields and costs of design, manufacturing packaging and logistics
2012-11-01 TSMC: Quad patterning likely alternative to EUV for 10nm
TSMC's chief technologist stated that quad patterning may be needed for 10nm process technology if extreme ultraviolet lithography is not available by 2015
2008-06-03 Toshiba develops cost-competitive MEMS
Toshiba Corp. has announced two optimized packaging technologies for MEMS semiconductor packages that achieve significant cost reductions
2013-12-20 Timing devices from Micrel aimed at PCIe market
The PL6020xxx and PL6070xxx clock generators, and the SY7557xL clock distribution family promise extremely low phase noise for PCIe reference clock signals and industry leading output-to-output skew.
2006-02-06 Tessera sues ST, ASE, SPIL, STATS, Siliconware
Tessera Technologies said that it has expanded its legal efforts by filing a patent suit against five companies: ASE, ChipMOS, STATS ChipPAC, STMicroelectronics and Siliconware.
2011-07-26 Taiwan IC industry to benefit from Apple
Many Taiwan semiconductor companies, as well as packaging companies, are set to benefit from Apple's spending cycle
2012-04-09 Suss MicroTec buys projection litho tool vendor
The new acquisition will expand Suss MicroTec's lithography segment by adding a new product line and core technology, both of which are highly complementary to the company's existing exposure capability
2009-06-26 Supercomputer gets super water-cooled
Swiss Federal Institute of Technology Zurich and IBM plan a cutting-edge water-cooled supercomputer
2008-03-26 Structured ASIC aims at military, aerospace sectors
ON Semiconductor has announced that XPressArray-II, a structured ASIC technology formerly offered by AMI Semiconductor, is now available for military specification operating temperatures
2005-10-20 STATS ChipPAC wants to be 3D king
Nearly two years after the big merger, Singapore's STATS ChipPAC Ltd is treading slightly above stormy waters in the competitive chip packaging and test market
2005-11-24 STATS ChipPAC offers copper process for passives
Singaporean test and packaging service provider STATS ChipPAC Ltd has qualified a copper process for integrated passive devices (IPD) that the company claims delivers superior performance and miniaturization in radio frequency (RF) wireless systems
2010-12-15 STATS ChipPac flip chip biz grows over 50%
Semicon test and packaging provider STATS ChipPAC announced its flip chip business grew more than 50 percent in 2010. The company shipped more than 250 million flip chip packaging units
2012-01-16 STATS ChipPAC builds new factory
Once the new building is completed, STATS ChipPAC's combined manufacturing space in Singapore will increase from 55 277.30 to 73 579.21 square meters (595,000 to 792,000 square feet).
2011-04-21 STATS ChipPAC aims TSV expansion in Singapore
STATS ChipPAC is expanding its 300mm through silicon via (TSV) offering with the addition of mid-end manufacturing capabilities in Singapore.
2003-02-25 Stacked memories to be used in Intel standard products
Intel Corp. has announced that it is shifting the emphasis in its stacked chip-scale packaging product line from custom parts to standard products
2007-07-05 ST fields capacitive sensor to simplify user interfaces
Making room for itself in the already maturing capacitive sensing market, STMicroelectronics launched the QST108, its first device under its QST portfolio of touch sensors.
2002-12-12 SST shrinks Flash package to push Bluetooth
Silicon Storage Technology Inc. has released what it claims is the industry's smallest NOR Flash package, measuring 4-by-6-by-0.52mm
2011-08-01 Sony, Audio Pixels to co-develop low-cost MEMS speakers
Sony and Audio Pixels are working on developing low-cost MEMS digital speakers to enable speaker products that are better than conventional speakers but come in a small, 1mm-thick package.
2007-04-04 Solid-state storage devices offer 1-8GB options
Silicon Storage Technology expanded its NANDrive solid-state storage product line with devices that range in capacities from 1Gbyte to 8Gbytes
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