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2006-06-20 Spansion, Data I/O collaborate for automated flash memory programming
Data I/O and Spansion announced a collaboration to advance the use of automated flash memory programming in the production of wireless, consumer and automotive markets.
2008-06-23 Spansion plans more tech, manufacturing tie-ups
Spansion Inc. is broadening its corporate strategy to create strategic alliances, with plans to transfer certain assets to third parties and establish manufacturing and technology partnerships.
2009-12-04 Soitec, CEA-Leti push 3D integration
The Soitec Group and CEA-Leti will offer comprehensive industrial solution beginning with process customization for prototype demonstration and will include licensing, both in 200mm and 300mm.
2009-04-21 SMIC, Dolphin develop audio converters for PMPs
China foundry Semiconductor Manufacturing International Corp. and virtual components for high resolution audio applications provider Dolphin Integration have partnered to deliver D/A audio converters that feature ultralow power consumption.
2009-06-10 SID helps boost FPD industry in Latin America
The Society for Information Display (SID) and the Government of Brazil have partnered to cooperate to bolster Brazil's growing flat-panel display (FPD) industry and encourage continued display advancements throughout Latin America.
2007-09-24 Sharp, Pioneer ink business, capital alliance
Sharp Corp. and Pioneer Corp. announced they have entered into a business and capital alliance agreement to enhance efficient differentiation of business and to preserve corporate profits.
2009-03-03 Sematech, Asahi Glass to improve EUV mask blank yield
Sematech and Asahi Glass Co. (AGC) have entered into a joint development partnership to accelerate mask blank commercialization.
2007-04-27 SanDisk, Qimonda to develop MCPs for mobile apps
SanDisk Corp. and Qimonda AG signed an agreement to jointly develop and manufacture MCPs that target the growing market for high capacity, integrated memory solutions in data-intensive mobile applications.
2007-12-13 SanDisk forms Vietnam partnerships for flash cards
SanDisk Corp. has announced that it is expanding its retail flash memory card business in Vietnam via partnerships with FPT Corp. and Ingram Micro Inc.
2008-10-22 SanDisk agrees to sell 30% of JV share amid losses
After experiencing a deep loss, SanDisk has gotten into a non-binding memorandum of understanding with Toshiba to sell around 30 percent of the present NAND fab capacity of the parties' joint ventures to Toshiba.
2009-06-26 Samsung, Numonyx tie-up on PCM
Samsung Electronics and Numonyx are cooperating on market specifications for phase change memory p change memory (PCM) products.
2009-11-06 Samsung, Microsoft tie up to boost green IT
Samsung Electronics Co. Ltd and Microsoft Corp. have partnered to promote efficient energy usage in computers.
2008-09-15 Samsung, Intrinsity join forces on low-power processors
Intrinsity Inc. and the system LSI division of Samsung Electronics Co. Ltd have partnered to develop high performance, low power processors using the Intrinsity Fast14 technology.
2008-06-27 Samsung, Hynix partner on STT-MRAM
The world's two largest memory chip makers forged an alliance Wednesday to develop next-generation semiconductors so South Korea can stay ahead of foreign rivals, according to an Agence France Presse report.
2011-04-27 Samsung fights back with countersuit against Apple
Filing its own patent suits in South Korea and Germany, Samsung accuses Apple of infringing on 10 of its mobile technology patents in the production of the iPad and iPhone.
2008-09-18 RMI fortifies partnerships with CSR, SiGe Semi
RMI Corp. has increased its partner alliance members to include CSR and SiGe Semiconductor.
2008-06-19 Report: Hynix to acquire ProMOS stake
Hynix Semiconductor announced Tuesday (June 17) that it would buy 9.5 percent of ProMOS Technologies for $168 million, according to an Reuters report.
2005-01-18 Racal publishes 3GPP Release 4 cellphone test cases
RIWS is now offering 15 of the 22 cellphone test cases outlined in Release 4 (Rel-4), approved by the GCF, and 12 for the PTCRB standards bodies.
2010-01-13 Qualcomm, TSMC unite for 28nm process
Qualcomm Inc. is working closely with foundry partner Taiwan Semiconductor Manufacturing Co. on 28nm process technology.
2006-10-16 Qimonda hands 80nm DRAM tech to Winbond
Qimonda and Winbond Electronics have extended their DRAM manufacturing partnership. The new agreement calls for Qimondato transfer its 80nm DRAM trench technology to Winbond's 300mm facility in Taichung, Taiwan.
2014-11-11 Public-private sector team-up key to smart city success
By 2025, Frost & Sullivan forecasted that there will be more than 26 smart cities featuring at least five of the eight elements, which include smart building, smart infrastructure and smart energy.
2005-12-16 Process R&D becomes 'a team sport'
IBM's recently developed dual-stress liner approach to strained-silicon technology came about through collaboration with its process development partners.
2008-01-31 Powerchip, IMEC team on sub-32nm memory processes
Taiwan's Powerchip Semiconductor has entered into an R&D partnership with European research center IMEC to develop solutions for the sub-32nm memory process generations.
2008-12-15 Peugeot, Bosch team up for diesel hybrid tech
PSA Peugeot Citro?n and Robert Bosch GmbH have signed an agreement to team up for diesel hybrid technology. The partnership agreement calls for Bosch to co-develop, industrialize and supply electric motors and power electronics for PSA Peugeot Citro?n's four-wheel-drive diesel hybrid powertrain.
2003-08-18 Partnerships are critical in 90nm road map
Strong strategic partnerships with customers can spell the difference between failure and success for foundries.
2007-12-12 Partners provide Silicon Aware IP to China, Singapore, Taiwan
Virage Logic and MIC have entered a partnership agreement for the provision of Silicon Aware IP to China, Singapore and Taiwan.
2009-02-27 Partners enhance process co-optimization
Taiwan Semiconductor Manufacturing Co. Ltd and Tela Innovations announced a strategic partnership to develop co-optimized design solutions using Tela's patented lithography-optimized design technology and TSMC's derivative processes.
2004-02-26 Olympus forms optical foundry services
Olympus has established Olympus Partnership Development Group (PDG)'s Optical Foundry Services.
2003-03-13 Oki extends collaboration ties with UMC
Oki Semiconductor has joined United Microelectronics Corp.'s Gold IP program and Design Plus partnership which will allow Oki access to UMC's 0.155m process and intellectual properties.
2005-01-17 OCP-IP upgrades core to bus validation tool
The latest version of OCP-IP's front end OCP validation tool is fully compliant with, and supports the OCP 2.0 spec.
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