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2002-09-18 Assemblon component mounter features 9?m accuracy
The D-9, a new flip chip placement system from Assemblon BV, provides a placement throughput of 2,700 flip-chips per hour with 9?m at 3 sigma.
2003-06-11 Yageo delays production in Suzhou plant
Passive component maker Yageo Corp. has postponed its production operations in Suzhou, mainland China to Q4 this year instead of last month.
2005-07-04 Yageo begins construction of second plant in Suzhou
A large passive component maker, Yageo Corp., recently started the first-phase construction of its second plant in Suzhou, mainland China.
2010-07-28 Wraparound thin-film chip resistors withstand high temperatures
Vishay Intertechnology, Inc. has added to its passive component portfolio offering a new series of SMD wraparound thin-film chip resistors optimized for use in extreme high-temperature environments.
2006-02-03 Walsin acquires 85% stake at Kamaya Electric
Walsin Technology recently announced its acquisition of 85.84 percent of Japan-based Kamaya Electric, a subsidiary of Mitsubishi Materials Corp.
2008-07-29 Vishay, Yosun ink distribution deal
Vishay Intertechnology Inc. has signed a distribution agreement with Yosun, a major Asian distributor of electronic components.
2003-02-20 Vishay acquires BCcomponents
Vishay Intertechnology Inc. has acquired BCcomponents Holdings BV.
2003-02-20 Vishay acquires BCcomponents
Vishay Intertechnology Inc. has acquired BCcomponents Holdings BV.
2003-06-19 TTI acquires Capsco Materials
TTI Inc., a distributor of passive, interconnect, and electromechanical components, has agreed to acquire Capsco Materials Management. Capsco is an authorized distributor primarily serving the passive component market.
2002-04-05 Three Taiwan firms establish offshore R&D centers in Wuhan
Taiwan-based Hon Hai Precision Ind. Co. Ltd, Delta Electronics Inc. and Acer Group have established their respective R&D centers in Wuhan, China.
2008-10-29 Test option rolls for capacitors in aviation apps
Passive components manufacturer AVX Corp. now offers a DO 160 test option for capacitors intended for use in flight applications
2005-09-16 SiP: a window of opportunity for passives
In the great debate of SoC vs. SiP, design engineers usually get tangled in the delicate technical intricacies while missing an important pointthe implications on the passive component industry.
2002-01-22 R&D consortium eyes system-in-package substrates
Five Japanese companies have formed an R&D association to develop materials and technologies for high-density substrates that will be used in system-in-package devices.
2002-04-29 Pacific Electric develops optotronic business group
Pacific Wire Electric Wire & Cable Co. Ltd, a Taiwan-based wire and cable manufacturer, has developed an optotronic business group focusing on R&D activities.
2009-01-28 Network, spectrum analyzer simplifies TV design
From Rohde & Schwarz comes the R&S ZVL3 75 network and spectrum analyzer that offers a wide range of functions, compact design, low weight (7kg) and optional battery-powered operation.
2002-09-17 Matsushita embeds SoCs, components in substrate
Matsushita Electric Ind. Co. Ltd. has developed a 3D, multilayered module technology that connects SoCs with passive components by embedding them in substrate layers
2008-09-02 IR turns down Vishay's takeover offer
Fighting to stay independent, International Rectifier Corp. has dismissed the unsolicited takeover bid by rival Vishay Intertechnology Inc.
2007-06-14 High efficiency eight output, 60W STB power supply design
The reference design presented in this application note demonstrates that a multi-output STB power supply can be designed with efficiencies up to 80 percent utilizing low cost On Semiconductor power management ICs.
2002-06-22 GSI Lumonics laser trimmer performs in-line device adjustment
The TrimSmart LT1100 laser trim system from GSI Lumonics Inc. provides real-time adjustment and test of resistors, capacitors, and inductors on RF modules, VCOs, and other hybrid circuits in SMEMA-compatible PCB production lines.
2003-01-09 Electronic industries: On the road to recovery
The global electronic equipment and semiconductor markets are expected to return to robust growth in 2003, after two years of downturn and depression, iSuppli Corp. said.
2003-02-07 Agilent tunable laser outputs 13dBm
The company's 819xxA compact tunable laser source offers an optical power output of 13dBm.
2002-01-23 3i Group invests $30M in DenseLight
International venture capital group 3i Group plc has invested about $30 million in DenseLight Semiconductors Private Ltd, a Singapore-based photonics solution provider.
2012-06-07 Why active probes are worth buying
Although active probes are more expensive than passive ones, they offer a superior level of performance that may be essential in certain circumstances
2013-10-08 Uses of copper barrier capacitors in medical field
Read about the growing demand for capacitors for use in a various medical devices.
2010-12-10 Tektronix adds low-price, enhanced oscilloscope series
Tektronix has expanded its oscilloscope offerings with a mixed-signal oscilloscope series and high-bandwidth and low capacitance passive voltage probes
2005-05-25 Taming power inductors for SoC integration
How can we discard power inductors from our designs?
2009-11-20 SiGe mixer enables cost-effective filter designs
The MAX2042 mixer delivers a combination of linearity, noise performance and component integration
2002-05-29 Richardson to distribute AVX RF products
Richardson Electronics Ltd has signed an agreement with AVX, a supplier of passive electronic components, to become its specialty distributor in North America
2015-01-28 Preventing embedded PCB design defects
Printed circuit board defects can remain unnoticed until failure occurs, so it is important to implement disciplined practices even at the early stages of design.
2002-04-02 Post acquisition spree, Intel strives for key to comms
Intel Corp. hasn't made heads or tails of the communications industry. As the company bought up startups, it was simply collecting one of everything, with no central strategy for interlocking the pieces.
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