Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Advanced Search > passive component

passive component Search results

?
?
total search305 articles
2008-12-15 Understanding droop and Programmable Active Droop
Programmable Active Droop makes the amount of droop settable with a resistor, so that it can be tailored individually for each application; it is available in the RC5058 family and the FAN5091 family. This article discusses the operation of these methods in detail and shows the details of component selection, including worst-case analysis
2005-10-07 Test clip creates new probe points
Emulation Technology has introduced its new MicroClip test clip that provides new or additional test points on existing PCBs by attaching to surface-mount passive components in 0201, 0402, 0603 and 0805 packages
2005-11-24 STATS ChipPAC offers copper process for passives
Singaporean test and packaging service provider STATS ChipPAC Ltd has qualified a copper process for integrated passive devices (IPD) that the company claims delivers superior performance and miniaturization in radio frequency (RF) wireless systems
2011-01-24 Sn whisker mitigation process ups reliability
AEM Inc. introduces a hirel-qualified tin/lead conversion process for mitigating the formation of tin whiskers in surface-mount passive components
2005-07-18 SiP modules call for right blend of tech
The SiP solution offers a seemingly limitless combination of silicon, package and component technologies that simplify overall system design
2011-05-11 Sensor signal conditioner enables single IC apps
ZMDI unveils a sensor signal conditioner with integrated LIN transceiver that enables the development of a complete sensor application with a single IC and helps save component costs and board space
2012-11-07 NFC interface chip draws power from RF emissions
The AS3953 Near Field Communications interface Chip operates on energy harvested from an NFC reader's RF emissions, requiring no external power source and utilising only one external component
2014-09-11 Network analyser supports uni/bidirectional measurements
The R&S ZND allows users in RF component production to maintain high throughput while carrying out S parameter measurements on antennas and filters
2013-11-07 Myths about cooling high-power LEDs
Know the four myths about active versus passive methods
2007-04-30 Mobile TV receiver has multistandard baseband
Frontier Silicon's single-chip receiver for T-DMB and DAB-IP integrates the Paradiso multistandard baseband IC with an RF tuner and ancillary passive components
2002-11-01 MEMS eye dynamic optical products
Product based on D-MEMS has emerged as the leading optical component to control and manipulate light in optically reconfigurable networks
2010-07-01 MCUs offer enhanced motion detection capabilities
The Zilog ZMOTION microcontrollers are designed for the rapid development and deployment of products requiring control based on passive infrared motion detection
2006-01-13 LCR meter comes up to speed
Agilent Technologies' new E4980A LCR meter is a relevant piece of automated or benchtop test gear that's in lockstep with the need to test today's passive components
2009-02-09 Integrated equalizer IC simplifies 10G SFP+ design
Phyworks has released the PHY1066 equalizer, driver and retimer IC that the enables host board designers to create 10Gbit/s Ethernet SFP+ receive and transmit interfaces for 'direct attach' passive twin-ax copper cables and 10GBASE-SR optical modules
2014-07-23 IDT debuts industry's smallest 2W wireless power receiver
The IDTP9026, aimed at wearable devices, promises a high level of integration and lower external component count than competitive products, enabling designers to cut board area and BOM
2006-11-16 CDMA phone eyes India's low-tier mobile market
LG Electronics' RD3330 CDMA phone for Indian cellular markets keeps component count and feature set to a minimum to meet aggressive production cost targets
2014-10-29 Advances in power supply packaging
Here's a look at where the power industry is going in terms of component integration and thermal management. It also covers the developments in DC/DC power converter density
2011-09-12 Achieving reinforced insulation in data isolators
Here's a discussion on the requirements and mandates for electric-shock safety with respect to this common component
2012-03-15 Utilize E5061B ENA network analyzer
Learn about the operations of the custom switch box using the E5061B ENA Series network analyzer.
2006-11-01 Turning science-fiction idea into fact
David Schurig sat down with EE Times to describe how the cloaking device works and what electronic engineers can do to turn the science fiction idea into fact.
2009-12-18 TSMC unveils BCD process for LED drivers
The new technologies feature a voltage spectrum running from 12V to 60V to support multiple LED applications.
2012-09-21 The golden age of simulation-driven design
Find out what it takes to design for reliability nowadays.
2008-08-04 Taiwan ponders on 300mm fabs in China
The Taiwan government is mulling over a plan to relax its IC export control laws in China, according to a report from Forbes.
2005-02-16 SiPs offer alternative to SoCs for comms
The key to bringing the different parts together to create integrated plug-and-play system solutions lies in SiP technology.
2010-10-04 RFMD expands foundry services to include GaAs tech
RF Micro Devices Inc. has added Gallium Arsenide technology to its foundry services portfolio, and will start offering a full suite of GaAs Pseudomorphic High Electron Mobility Transistor (pHEMT) technologies to customers.
2005-10-17 Philips addresses gain requirements of RF, microwave apps
Philips introduced QUBiC4X, the latest addition to its QUBiC4 family of high-performance BiCMOS process technologies.
2002-08-20 ON Semi dc converter draws 195A
The NCP1403 dc/dc converter IC delivers 15V output while drawing 195A, allowing the device to boost the voltage of a single lithium battery or two-cell AA or AAA battery.
2007-01-18 Mini chip inductor needs less mounting space
Measuring 0.4-by-0.2-by-0.2mm, the LQP02TN series chip inductors from Muratra offer a 40 percent reduction in mounting space when compared to 0201-packaged devices.
2013-07-08 LED flash driver ups smartphone camera performance
The AS3630 can drive up to 8A current through an LED flash system, enabling mobile phone cameras to take pin-sharp images and supports substantially faster shutter speeds.
2002-12-11 IR MOSFETs target ZVS power supplies
The L-Series of 500V HEXFET power MOSFETs feature fast recovery body diodes for the reliable operation of ZVS power supplies.
Bloggers Say

Bloggers Say

See what engineers like you are posting on our pages.

?
?
Back to Top