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What are the steps in PCB design?
The input to the PCB design process is typically an electronic schematic and a list of parts that are to be used or the BOM. Modern PCB design is done on software or EDA tools that can be downloaded for free or bought from vendors. The output of the PCB design process is a set of files called Gerbers. These files are used by a fabricator to make the PCBs.
total search2980 articles
2008-01-24 815-1,000MHz SiGe passive mixer rolls for 2.5/3G base stations
Designed specifically for 2.5G/3G wireless-infrastructure applications, Maxim's MAX2029 815-1,000MHz SiGe passive mixer promises an unparalleled combination of linearity, noise performance and component integration.
2013-07-12 8-channel LED backlight driver enables better TV screen
The iW7019 from iWatt intends to deliver better screen performance and lower cost in next-generation 2D and 3D LCD TVs to render a more lifelike viewer experience.
2010-08-12 71M6513/71M6513H demo board quick start guide
The Teridian Semiconductor Corp. (TSC) 71M6513/71M6513H demo board is a demonstration board for evaluating the 71M6513/71M6513H device for 3-phase electronic energy metering applications.
2010-08-12 71M6511/71M6511H demo board quick start guide
The Teridian Semiconductor Corp. (TSC) 71M6511/71M6511H demo board is a demonstration board for evaluating the 71M6511/71M6511H device for single-phase electronic energy metering applications.
2007-01-15 65nm HD decoder supports HD-DVD, Blu-ray
Produced in 65nm process technology, ST's new HD decoder chip supports both HD-DVD and Blu-ray formats, in addition to high-definition satellite and cable TV standards.
2007-05-14 65nm DTV chip handles VSB, QAM signals
Samsung Electronics Co. Ltd has announced the S5H1411 chip that can enable DTVs to receive both VSB broadcasts and QAM cable signals.
2008-07-11 65nm application processors power PNDs
Samsung Electronics Co. Ltd announced the S3C2450 and the S3C2416, the newest members of its highly successful S3C24xx family of application processors.
2009-04-30 60W power supplies save space, cost
XP Power has released the VCT60 series of 60W, single output AC/DC power supplies, the first of its new V-Brand range of low-cost power supplies.
2013-02-15 60V DC/DC LED drivers target solid state lighting systems
The ILD6070/ILD6150 from Infineon offers the flexibility to produce multiple products using the same drivers, based on wide input voltage range and adjustable output current of up to 0.7A or 1.5A.
2010-06-29 600W TVS diodes come in SOD128 package
NXP Semiconductors is rolling out offering 600W transient voltage suppressor (TVS) diodes housed in two-lead FlatPower package SOD128 (3.8mm x 2.5mm x 1mm).
2007-10-19 600W clamping diode operates at up to 175C
STMicroelectronics has released a 600W peak-pulse-power clamping diode, capable of operating at up to 175C junction temperature.
2006-12-20 4W power amp rolls for W-CDMA systems
WJ Communications has announced a 4W power amp module for W-CDMA infrastructure systems.
2009-10-28 4G power amplifier boosts mobile WiMAX
It is estimated that the number of WiMAX subscribers will exceed 75 million by 2014.
2009-04-15 45nS comparators suit battery-powered apps
Microchip Technology Inc. has announced the MCP6561/2/4/6/7/9 (MCP656X) family of high-speed (45nS) comparators tailored for battery-powered applications requiring low power and high-speed operation.
2007-11-01 45nm designs demand efficient floorplans
With the migration to 45nm cores, optimized I/O planning and placement will become even more critical. These challenges beg the question: Who should take charge of a chip's I/O plan along with the considerations for the package and the rest of the system?
2013-07-05 4500V power MOSFETs prepped for high voltage apps
IXYS's latest 4500V MOSFETs boasts 200mA to 2A current ratings and are designed to address demanding, fast-switching power conversion applications requiring very high blocking voltages up to 4.5kV.
2015-03-18 40V MOSFETs flaunt industry's lowest ON-resistance
The U-MOS IX-H series from Toshiba boasts low Qoss for increased efficiency in switching-mode power supplies including servers and telecom base stations and DC-DC converters.
2006-11-15 4-PLL timing chip comes with 2-wire I?C
Cypress Semiconductor has introduced a 4-PLL timing device with a 2-wire I?C programming interface, said to be the industry's first such device.
2004-02-05 3M laminate material provides high performance
The laminate material from 3M allows designers and manufacturers of high-speed digital PCBs achieve higher speeds while simplifying design trade-offs.
2010-02-12 3G solution enables high-speed, low-cost smart phones
Broadcom's single-chip HSPA baseband processor and a RF transceiver solution integrates all key 3G mobile technologies for powering the 3G smart phone and smart feature phone product segments.
2009-12-02 3G phone springs from 2G design overhaul
Released in Q1 08, Samsung's SGH-J750 tells a less-fleeting tale of OEM sourcing decisions, ASIC development strategies and foot-in-the-door approaches behind the cellphone market.
2015-10-07 3D X-ray system brags ultra-fast inspection
The Viscom 3D AXI X7058 targets EMS companies that need to produce and inspect complex, high-value electronic assemblies at the highest quality efficiently and at low cost.
2014-02-06 3D TSV Summit underscores cost-effective production
From a maker's perspective, 3D IC production will only ramp up if the added costs for implementing TSVs and all the ensuing steps can be largely compensated by the IC performance benefits.
2008-10-22 3D PoP stacks roll as next killer tech for handsets
As part of Moore's law trend of having smaller, sleeker handheld devices, designers can leverage improved packaging and interconnect processes to achieve the miniaturization requirements.
2009-02-11 3D camera solution simplifies handset design
OmniVision Technologies Inc. has unveiled the CameraCube technology, a 3D reflowable, total camera solution that combines the full functionality of a single-chip image sensor, embedded image processor and wafer-level optics in one compact, small-footprint package.
2006-08-24 32bit SBC based on AMCC/IBM PowerPC 405GPr processor
Actis Computer SA has introduced the KSBC-0405, a 32bit PowerPC SBC based on the AMCC/IBM PowerPC 405GPr processor at 266MHz.
2010-09-06 32-bit MCU eases 8-bit app upgrade
The series of MCUs are powered by the ARM Cortex-M0 processor and operate at 50MHz or 45 Dhrystone MIPS.
2010-05-14 30V p-channel MOSFET comes in PowerPAK 1212-8
Vishay Intertechnology Inc. has introduced a 30V p-channel TrenchFET Gen III power MOSFET in the PowerPAK 1212-8 package.
2013-10-23 3-phase MOSFET bridge APM handles 2kW load
A three-phase bridge MOSFET automotive power module can be used to improve the system design for electrified automotive accessories.
2007-07-06 3-D EMF simulator handles massive, complex models
Ansoft has released a new version of its EMF simulation software that allows customers to perform massive simulations of structures that were simply too large to solve previously.
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