Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Advanced Search > pep

pep Search results

?
?
total search10 articles
2001-04-03 Two-stage wideband HF linear amplifier for 400W PEP using BLW96 and BLW50F
This application note presents a wideband power amplifier design that provides up to 400W peak envelope power (PEP) using two BLW96 transistors. It also describes a suitable drive amplifier using two BLW50F transistors in class A operation.
2002-02-05 PEP system board integrates Kontron SBCs
Integrating one of two possible Kontron PICMG SBCs, the PxV414 provides a scalable 4U open-architecture system solution designed for industrial automation, telecommunications, security, and transport applications.
2002-01-30 PEP SBC integrates 700MHz-PowerPC processor
The CP620-PM features a 700MHz IBM PPC 750CXE PowerPC processor and a directly-soldered SDRAM with an ECC of up to 1GB for the management of memory-intensive tasks in harsh-environment applications.
2002-12-06 A wideband linear power amplifier (1.6-28 MHz) for 300W PEP with 2 MOS transistors BLF177
This application note gives a description of a wideband push-pull amplifier for the frequency range 1.6MHz to 28MHz.
2002-12-11 A linear amplifier (1.6 - 2.8 MHz) for 8 W PEP in class-A with the BLF175
This application note describes a wideband linear amplifier intended for driver applications in SSB transmitters for the frequency range 1.6MHz to 28 MHz.
2008-06-24 Transistors remit high peak power for wireless net
Infineon Technologies AG recently launched a new family of RF power transistors specifically targeted at wireless infrastructure applications in the 700MHz frequency band.
2006-03-02 PCI-X board runs parallel TI DSPs
Signatec launched the PMP1000, a real-time parallel processing solution that uses Texas Instruments DSPs.
2008-09-19 DTV SoCs allow versatile connectivity design system
Broadcom has released a pair of SoC devices for the U.S. DTV market that include multiformat decoding, Ethernet network connectivity, a 3D GUI and 3D color management.
2003-07-15 Down and almost out, but came back a winner
Shi Lei, GM of Shanghai Fudan Microelectronics Co. Ltd, made a name for himself as one of the most prominent figures in China's chip design community for his remarkable work in turning an IC laboratory into a well-respected design company.
2008-09-01 Broadcom DTV solution touts global connectivity
Broadcom Corp. unveils its next generation of DTV SoC solutions designed for DVB-based platforms to address European and Asian markets.
Bloggers Say

Bloggers Say

See what engineers like you are posting on our pages.

?
?
Back to Top