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2015-08-14 SMIC launches 28nm mobile phone chips
SMIC, China's largest semiconductor foundry, marks a new era of advanced mobile phone chip manufacturing with the successful adoption of its 28nm process technology into mainstream smartphones.
2013-02-27 Smartphones redefine cell phone chip market
In the market for application-specific mobile handset core ICs such as baseband and radio-frequency semiconductors, Qualcomm reigned with 31 per cent market revenue share, said IHS.
2009-02-18 Slowdown marks China mobile handset chip market
After a period of rapid growth over the past few years, the China mobile handset chip market has experienced a conspicuous decline in 2008, according to research firm CCID Consulting
2007-05-22 Report: Smart phones drive mobile chip market
Developments in high-end products such as smart phones are expected to drive mobile phone production upwards by the end of 2007, according to a report from CCID
2003-09-23 Renesas, Nazomi in mobile phone chip pact
Attempting to speed development of a new class of chips for mobile phones, the companies said they have agreed to share technology used to accelerate video and Java apps.
2007-11-15 Qualcomm makes first call on 45nm 3G phone chip
Qualcomm has made the first phone call on a 3G chip manufactured with 45nm process technology from TSMC.
2007-08-10 Nokia maps out new supply, chip development strategies
Nokia will discontinue its in-house mobile phone chip development and plans to use significantly more devices from outside sources.
2006-04-03 Mobile phone chip interface gets real
MIPI Alliance unveils plans to release interfaces for displays, PHY, audio and power management, and other peripherals in the next two years.
2011-07-28 Intel, Samsung, others license chip-to-chip spec
Intel, Samsung and other mobile vendors have licensed the Chip-to-Chip Link specification which was developed by Arteris and Texas Instruments
2010-07-05 Intel ventures into handset chip biz via Comsys
Intel Corp. is making its way into the cellphone chip business with its acquisition of Comsys Mobile Communication and Signal Processing Ltd for $30 million in late May
2003-04-29 Fujitsu VoIP chip eye SOHO environments
Fujitsu Microelectronics' integrated IP-Phone VoIP chip features a VoiceDSP engine designed for use in Internet telephony apps.
2008-06-11 ESL methods for optimizing a multimedia phone chip
The trend towards high-quality multimedia content and higher communication bandwidth drastically increases the complexity of the underlying SoC architecture.
2009-02-19 Duo to provide smart phone platform
Nokia and ST-Ericsson are cooperating to provide the Symbian Foundation with a reference platform based on ST-Ericsson's U8500 single chip
2005-03-01 Broadcom: Gbit IP phone won't jam up traffic
The rekindling of the VoIP market sends Broadcom to devise a solution for broadband signal traffic.
2002-03-18 Broadcom IP phone chip integrates power detection
The BCM1101 IP phone chip integrates a power detection functionality, enabling IP phones to be powered through the same UTP cable for Ethernet data.
2005-02-03 Broadcom announces world's first Gigabit Ethernet IP phone chip
Broadcom's BCM1103 enables manufacturers to build IP phones with integrated Gigabit Ethernet switching and other features to support improved voice quality.
2009-10-15 18Mpixel camera phone, anyone
It won't be long before your camera phone will turn into a real camera with a real phone. But what will it take to make that happen? And will it affect alleven the most basic phones
2002-04-03 Worldwide chip sales flat in February
Worldwide chip sales in February totaled $10.01 billion, remaining unchanged compared to January sales figures, according to the report released by the Semiconductor Industry Association
2007-03-16 Windbond chip supports P2P VoIP platforms
Winbond's W93562 DECT/WDCT digital wireless communications chip features hardware compatibility with Skype and other peer-to-peer VoIP platforms
2005-08-16 Will next iPod be a phone
Cellphones are swallowing the MP3 functionality as it did with digital cameras, leaving little room for standalone MP3 players.
2011-06-07 Voice chip enhances HD sound quality in tablets
Audience has unveiled its latest earSmart eS305 chip that enables true HD voice quality in tablets and other devices over wideband networks
2009-05-19 Vocoder chip offers three full duplex channels
Digital Voice Systems Inc. (DVSI) has introduced the AMBE-3003 multichannel vocoder chip that offers three separate encoder/decoder operations to provide the capability of up to three full duplex channels
2002-03-20 VIA sets eyes on mobile phone applications
In a bid to move into the mobile phone market, VIA, the Taiwan-based PC chipset vendor, has began to put its effort on the development of mobile phone chipsets since the second half of last year
2008-03-03 Ultralow-cost phones ring in chip opportunities
The growth of the ULC handset market is changing the dynamics of the handset business. Traditionally, a handset manufacturer would rely exclusively on one vendor to supply chips for all its phones but ULC phones are changing this model.
2006-12-18 Ultralow-cost handsets call for single chip
The market for ultralow-cost handsets is expected to grow quickly over the next three to four years, as more than two-thirds of new subscribers come from developing countries.
2007-03-30 Ultracompact LED suits mobile phone keypads
Rohm has introduced an ultracompact LED in a 0.04 x 0.02-inch footprint for devices that require ultracompact components such as mobile phone keypads, small dot-matrix units and compact seven-segment display devices
2003-08-27 TriQuint, Amkor partner on flip-chip process
TriQuint Semiconductor Inc. has teamed with Amkor Technology Inc. to commercialize a low-cost flip-chip assembly process for GaAs semiconductors
2003-07-22 TransChip rolls out a single-chip CMOS imager
TransChip is targeting mobile handset vendors seeking to upgrade cellphones to popular camera phones with a single-chip CMOS image sensor that integrates image processing and compression along with LCD controller functions
2002-05-02 Toshiba chip package is 30 percent smaller
Toshiba Corp. has announced that it has developed a stacked multi-chip package (MCP) that measures 7-by-10mm30 percent smaller than the company's current MCPs that measure 9-by-12mm
2007-02-23 Top OEMs drive global chip sales
Ten of the largest OEMs consumed a third of all semiconductors purchased in 2006, according to early results from a recent study by Gartner Inc.
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