Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Advanced Search > Photomask

Photomask What is a photomask? Search results

?
?
What is a photomask?
A photomask is an opaque image on a translucent plate that is used as a light filter to transfer an image from one device to another.
total search144 articles
2009-10-05 TI 300mm fab puts pressure on analog rivals
Texas Instruments Inc. is putting its analog rivals on notice with its latest a 300mm fab in the United States.
2004-01-09 Technology allows enhanced accuracy of IC exposure systems
Toshiba Corp. has bared plans to market a focus measurement technology that greatly improves the focal measurement performance of semiconductor exposure systems.
2006-05-01 Synopsys adding to its DFM lineup
Included in Synopsys' yearend agenda is the addition of a dual-domain simulation product and a next-generation yield analysis tool to its DFM product family.
2008-03-17 Succeed at 65nm design
A true DFM-aware environment accounts for process variability and lithographic effects in the context of timing, power, noise and yield at every stage of the flow. This begins with the characterization of the cell library, continues through implementation, analysis and optimization, and ends with sign-off verification.
2002-10-03 SEMI's Oasis provides respite from GDSII
SEMI has rolled out the Open Artwork System Interchange Standard as a replacement for the GDSII file format, and said it promises a tenfold reduction in design data compared to GDSII.
2008-12-16 Practical aspects of touchscreen systems
The need for innovative user interface solutions becomes more essential to device design. Projected-capacitance touchscreens can help designers face this challenge.
2002-02-26 Photronics recticle manufacturing software cuts lead time
The CyberMask software suite facilitates a seamless interface among semiconductor manufacturers, allowing them to receive and prepare IC design data for recticle manufacturing.
2009-03-02 Panelists skeptical on next-gen litho
Experts debated and sparred over the future of patterning during a panel discussion at the SPIE Advanced Lithography conference.
2012-04-19 Open source parametric design environment for photonic ICs
Ghent University and Imec released the IPKISS that is a generic and modular software framework for photonics design.
2006-09-18 OPC tool has mask 3-D imaging effects
Brion Technologies introduced Tachyon M3D that promises more accurate OPC implementation and verification by incorporating mask three-dimensional imaging effects.
2002-09-30 Numerical Technologies: Subwavelength - An opportunity for Taiwan's semiconductor industry?
Over the past 10 years, the emergence of Taiwan's contract semiconductor manufacturers, TSMC and UMC, as leaders in manufacturing have enabled many fabless companies to deliver these innovations cost-effectively to the market.
2007-07-23 New R&D labs promise know-how, jobs in Korea
South Korea has established cooperatives ties with eight companies to set up R&D labs in the country, a deal that could boost local technological know-how and provide jobs.
2007-06-01 Micron CEO: Of memories and foundry models
Micron Technology Inc. has grabbed its share of headlines. What will Micron do next? To get a handle on the company, EE Times caught up with Steve Appleton, its president, CEO and chairman, who talked about the IC industry, foundry/fab-lite models, private-equity buyouts, its diversification strategy and universal memory.
2001-05-01 Mentor CEO argues FPGAs will drive platforms
This article describes how FPGA platforms will innovate designs and how engineers can make the most out of it.
2008-06-03 Maskless tools to boost ASIC throughputs
E-Shuttle Inc. is set to improve its direct-write e-beam capabilities and explore the future use of next-generation maskless tools from Mapper Lithography NV and other startups in the arena, making e-beam tools a probative technology in mainstream production fabs.
2009-03-06 Litho woes: R&D gap, downturn
It was a triple-whammy for lithographers at the SPIE Advanced Lithography conference as the industry continues to be plagued by an R&D gap, technology delays, and, of course, the lousy economy.
2008-08-06 KLA-Tencor to buy microelectronic biz of Vistec
KLA-Tencor has entered into an agreement to acquire the Microelectronic Inspection Equipment business unit of Vistec Semiconductor Systems.
2008-10-15 Keep track of these 6 fab tech, too
Keep an eye on these fab technologies, too. They're not on the hot seat, but they're not far from it, either.
2011-11-22 Issues of EUV lithography
Chip makers need EUV to be ready well in advance of when they plan to use it in volume manufacturing so they can establish chip design rules and tweak their manufacturing processes.
2005-06-10 Intel tips high-speed 3D imaging for SEMs
Intel Corp. is developing a scanning electron microscope (SEM) technology that claims to be 100,000 times faster than current systems in the marketplace
2007-08-16 Intel pulls ahead in processor capex race
Advanced Micro Devices Inc. and Intel Corp. are taking different paths in IC manufacturing, but the traditional capital-spending race appears to be over in the x86-based processor arena.
2008-09-19 IBM pushes 'computational scaling' for 22nm
Amid probable delays with extreme ultraviolet (EUV) lithography, IBM Corp. plans to extend 193nm immersion and move towards what the company calls "computational scaling" technology for the 22nm node and perhaps beyond.
2009-04-20 IBM 'fab club' tips 28nm high-k process
Despite the downturn, the silicon foundry business is heating up as IBM Corp.'s "fab club" has officially rolled out its 28nm process based on high-k dielectrics and metal gates.
2010-12-23 German IC energy cutting project progresses
The Dresden Cool Silicon project which aims to cut energy consumption by ICs and IT is moving into its second phase.
2005-08-19 Freescale RET project approaches first anniversary
Freescale Semiconductor and Photronics teamed up in the fourth quarter of 2004 to assess the technical and commercial merit of certain specific resolution enhancement technologies.
2007-05-16 Foundries face obstacle course in 45nm race
The starting gun sounded on the 45nm foundry race when the world's largest foundry service provider announced in April it is accelerating ramp of its 45nm process.
2008-11-17 Fab tech roll call: survival of the fittest
Manufacturers are rolling out 45nm ICs, with 32nm designs in the works; 22nm and even smaller devices are in R&D. But delivery of chips at 32nm and beyond won't be a cool breeze.
2011-02-04 Fab firms' focus on 450mm could disrupt supply chain
Analysts fear there is not enough 300mm capacity today and 450mm plants under construction may not start mass production until 2017 or 2018, a scenario that could trigger disruptions in the IC supply chain.
2003-05-05 Experts seek to expand, redefine EDA
The EDA industry needs to expand its boundaries, and could use a more descriptive term than "electronic design automation,".
2006-02-20 EUVL achieves 'cleaning milestone'
Sematech North researchers working on extreme ultraviolet lithography (EUVL) claims to have achieved an important breakthrough in the complex process of cleaning mask blanks.
Bloggers Say

Bloggers Say

See what engineers like you are posting on our pages.

?
?
Back to Top