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2014-04-07 LTE physical layer module gives savings boost to OEMs
The module combines the MIMOon PHY and CommAgility's signal processing hardware, reducing development costs and enabling OEMs to deliver projects more quickly
2014-03-05 Toshiba offers TransferJet-compatible wireless comm module
Toshiba's small module, only 4.8 x 4.8 x 1mm, and ultra-thin FPC coupler, only 0.12mm thick, achieve a maximum physical layer transmission rate of 522Mb/s (effective data transfer rate of 375Mb/s).
2004-02-18 Quake physical layer device consumes <900mW
The QT2022 integrated 10G serial-to-XAUI PHY device from Quake Technologies optimizes next-generation modules and system cards.
2004-09-09 Module makers take sides in bitter UWB battle
The race to market ultrawideband-enabled devices will accelerate this week when Freescale Semiconductor Inc. announces three companies that will develop Mini-PCI modules incorporating Freescale's UWB technology for use in TVs, media servers and storage devices.
2008-05-01 Use MSGQ module to optimize sRIO gains
Serial RapidIO overcome limitations of traditional DSP I/Os by providing a high performance, packet-switched, interconnect technology which is very beneficial for complex DSP topologies.
2007-10-18 Physical sensors drive MEMS consumerization wave (Part 1
Benedetto Vigna notes that we are living today in the commercial era of MEMS Consumerization where microphones, motion and pressure sensors are the main actors. He believes this trend will continue for the next five years.
2004-11-18 NEC, Chipcon partner on ZigBee module
NEC Engineering, with NEC and Chipcon, introduced a module developed for compatibility with IEEE 802.15.4 and ZigBee wireless network standards
2005-01-17 Controller module offers up to 800Mbps data transfer rates
Parvus rolled out its new Fast1394T PC/104-Plus FireWire card that supports the advanced features of the new IEEE-1394b (2002) serial bus.
2007-06-08 EDA platform offers faster RF module design, verification
Agilent now offers an EDA platform that provides a speedier design and verification process.
2006-01-04 Alereon, Samyoung team for WiMedia PHY modules
Alereon has teamed up with Samyoung Electronics to develop tightly integrated PHY modules based on Alereon's AL4000 range of UWB devices for WiMedia and wireless USB apps.
2003-07-15 Xilinx architecture offers to 10.3125Gbps per channel
Xilinx has unveiled its Virtex-II Pro X architecture and RocketPHY family of 10Gbps CMOS physical layer transceivers
2004-09-13 TI PCI Express 1394a IC aids PC designers
TI disclosed that they have developed the first x1 PCI Express-to-PCI Bridge and PCI Express 1394a IC samples.
2002-11-29 Telecom test project stirs interest at Ixia
Motivating a team to design a compact test module for 40Gbps networks was not the easiest thing in the world at a time when market analysts were warning that 40Gb telecommunications transport would remain mired in overcapacity for quarters, or even years, to come
2016-04-28 Tackling IoT and Industry 4.0 sensor backplane needs
Read about the configurable analogue architecture that supports the bimodality requirements of the sensor backplane for both IoT and Industry 4.0 applications.
2004-11-26 ST mobile-camera chipset complies with SMIA
ST disclosed that they have developed the first Megapixel mobile-camera chipset, compliant with the Standard Mobile Imaging Architecture.
2006-08-02 Quake unveils 'first' PHY IC for SFP+ 10GbE apps
Quake Technologies Inc. has announced the availability of the QT2035S, said to be the industry's first integrated physical layer IC for all SFP+ 10GbE applications
2005-06-16 Optical forum completes electrical interface work
Electrical interfaces for 6Gbps and 11Gbps backplanes have been firmed up by the Optical Internetworking Forum, completing work started by the High-Speed Backplane Initiative.
2002-06-11 NEI standalone 10Gb ASIC targets comms
A 10Gbps multiprotocol ASIC that was previously available only in a module from Network Elements Inc. is now available as a standalone device
2006-05-31 Mistral unveils 'highest density' PHY switch
Mistral announced the new GLX4000 series of physical layer switches, touted to have the highest density in the industry
2011-11-23 LIN slave ICs ease automotive networking
MLX80105 is a fully integrated LIN slave that claims to significantly reduce BOM cost.
2004-07-08 Dispersion compensator rides 10Gb transceivers
Big Bear Networks will offer its electronic dispersion compensation chips in a 10Gb optical transceiver Xenpak module designed for 80km links
2004-11-08 Cypress HOTLink II meets CPRI radio control link certification
Cypress Semiconductor Corp. disclosed that its HOTLink II physical layer (PHY) family meets the Common Public Radio Interface (CPRI) specification version 1.2. CPRI focuses on a 3G radio base station design that divides the radio base station into a radio and a control part by specifying one new interface
2005-06-15 Aeluros makes 'green' versions
Aeluros recently announced green variants of its Puma 10Gbps physical layer IC devices
2012-12-19 Virtual prototype for Android HW-SW dev't (Part 3)
Know how to combine the use of the Synopsys VDK with Android's Hardware Abstraction Layer to aid in integrating the sensor further up the device software stack
2004-08-09 Fast1394 card supports IEEE-1394b serial bus
Parvus release a 3-port IEEE-1394b controller module designed for high-speed data acquisition across the FireWire bus for audio, video and storage peripherals
2006-01-20 XFP transceiver IC features jitter attenuating capability
Silicon Laboratories announced what it touts as the industry's first 10Gbps XFP transceiver IC with integrated jitter attenuating capability on both transmit and receive data paths.
2002-04-02 Post acquisition spree, Intel strives for key to comms
Intel Corp. hasn't made heads or tails of the communications industry. As the company bought up startups, it was simply collecting one of everything, with no central strategy for interlocking the pieces.
2015-09-28 The lowdown on MIPI D'PHY RX
MIPI D'Phy, a physical serial communicating layer connecting the application processor to the display device or the camera, offers advantages as the physical layer. Learn more about it
2008-01-15 Test platform supports DSL triple-play service verification
EXFO Electro-Optical Engineering introduces a copper test module for the AXS-200 SharpTESTER platform, which tests the full 30MHz VDSL2 spectrum over copper access networks
2014-06-12 Semtech reveals HMC-compliant PHY IP
The Snowbush 28nm platform physical layer IP has met the interoperability requirements of the Hybrid Memory Cube standard with significant margin and passed the testing required by Micron
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