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2005-06-23 Stacked package from Sharp allows 0.5-mm grid
Sharp Corp. has developed packaging technology that allows stacking of multiple packages with 0.5mm pitch ball grids, which the company claims is the industry's tightest pitch
2014-09-18 Understanding plastic ball grid array
Learn about the Plastic Ball Grid Array or PBGA package, a cavity up laminate based substrate package in which the die is attached to the substrate in the normal die up manner
2014-04-22 Altera adopts fine-pitch copper packaging for Arria FPGAs
TSMC's flip chip ball grid array package technology utilises fine-pitch copper bumps measuring less than 150?m, providing excellent bump joint fatigue life, improved performance in electro-migration current and low stress on the ELK layers.
2005-03-04 SigmaTel ramps up production in ASAT's Dongguan facility
SigmaTel Inc. has completed qualification and is ramping production on lead-free and green fine pitch ball grid array in ASAT Holdings Ltd's manufacturing facility in Dongguan, mainland China.
2005-10-17 Implement stacked package-on-package designs
Companies must adopt PoP standards to better plan product road maps and facilitate the adoption of new applications
2014-11-12 GQFN package shrinks devices by up to 60%
Aside from reducing package size, the grid array flat no-lead package also enables improved electrical performance through lower inductance and capacitance
2015-01-28 Preventing embedded PCB design defects
Printed circuit board defects can remain unnoticed until failure occurs, so it is important to implement disciplined practices even at the early stages of design.
2015-02-02 Optimising BGA signal routing in PCB designs
BGA packaging technology for embedded designs is steadily advancing, but signal escape routing is difficult. Know the strategies to ensure that a product is correct in terms of form, fit and function.
2015-05-12 Impact of piling on package manufacturing
To accomplish various performance enhancements, packaging engineers should consider intriguing combinations being constructed at the chip to package level.
2014-12-22 Experimental methods for PCB design and manufacturing
EMS providers are being called upon to take on the task of design of experiments, also known as experimental designs, requiring them to work with OEMS to do the necessary research and development.
2014-05-26 Assembly handling, thermal mgmt for lidless FC-PBGA
Here are recommendations on the assembly handling and application of thermal management solutions for lidless Flip Chip Plastic Ball Grid Array components
2002-06-20 TAB tape carrier with micro plating bumps for burn-in testing socket
This application note describes the use of a new contact substrate for the burn-in testing socket for 0.5mm-pitch BGA package
2002-08-26 STATS EBGA package offers more I/O
STATS Ltd. has launched the EBGA Multi-Tier package that offers higher I/O and multiple wire bonding zones for power, ground, and signal connection.
2003-05-16 Actel tools FPGAs for auto niche
Actel VP of Product Marketing Barry Marsh foresees that FPGAs would have a greater market on the automobile industry as manufacturers rely on programmable ICs for their telematic systems.
2007-09-17 Programmable bridge offers low power, small footprint
When implemented in a LatticeSCM-15E FPGA packaged in a space-saving 256 fine pitch Ball Grid Array (fpBGA) package, the new programmable bridge from Lattice Semiconductor requires 17mm x 17mm on a PCB while consuming 2.5W of power.
2013-11-22 Novel dielectric material to enhance eWLB packages
Nanium released an improved dielectric material and process solution for its fan-out wafer-level packaging (FOWLP) technology, embedded wafer-level ball grid array (eWLB
2005-10-05 Ironwood's microBGA prototyping adapter simplifies device test
Ironwood Electronics offers a new prototyping adapter for 0.5mm pitch, 84-position, microBGA (?BGA) ICs
2006-03-13 USB 2.0 transceiver targets Intel processor
Cypress Semiconductor introduced a high-speed USB 2.0 transceiver that is designed for Intel's Monahans processor family based on the third generation Intel XScale architecture.
2004-03-22 TI serdes offers error-free transmission
The discrete serializer/deserializer (serdes) from TI is capable of error-free transmission over 80 inches of standard backplane trace in LAN, MAN, and WAN apps.
2005-03-04 ST flash memory chip tailored for 3G mobile phones
ST rolled out a 256Mb NOR flash memory chip that uses a 2bit/cell architecture to provide increased memory density in a small-sized die.
2003-09-01 Infineon SDRAM offers high-density unbuffered modules
Infineon Technologies AG has released its 1Gb DDR SDRAM that is fabricated using the company's 110nm CMOS process.
2005-05-11 Flash MCU targets comm apps
Cyan Technology's new 16-bit flash MCU contains a full range of peripherals which can be very quickly configured using the Peripheral Configuration Tool, which is part of the company's free CyanIDE Integrated Development Environment.
2005-10-17 Cypress' USB 2.0 programmable MCU measures 5-by-5mm
Cypress Semiconductor unveiled what it touts as the world's smallest high-speed USB 2.0 programmable microcontroller.
2005-07-19 Chipmos receives SOC packaging patent from MOEA
Chipmos Technologies Inc. (Chipmos Taiwan) has been granted a patent entitled "substrate-on-chip (SOC) packaging process" (Invention No. 207525) by the Intellectual Property Office of the Ministry of Economic Affairs (MOEA) of Taiwan.
2003-08-20 ASAT Holdings completes phase one of new China plant
ASAT Holdings Ltd has announced the completion of phase one of its China manufacturing facility
2010-04-15 A/V decoders handle up to eight video streams
Conexant Systems has released a new family of multichannel A/V decoders targeted at video surveillance systems with digital video recording capabilities, video capture cards and motion sensors.
2011-02-08 TPD12S015 PCB layout guidelines
The TPD12S015 is a multifunction ESD protection device targeting portable High Definition Multimedia Interface applications.
2016-04-01 There's more to IC design than just circuits
It takes a village to get complex semiconductors out to market, from design, packaging, test and manufacture. It benefits everyone in the team to know where a product is headed.
2014-07-07 The cost of overlooking design-for-test
To prevent costly printed circuit board rework, it is important to have an effective DFT strategy based on a close partnership and working relationship between PCB design and test engineering.
2011-10-03 SoCs drive high-end automotive displays
The SH7769 enables 3D graphics meter displays and enhances video input and display output.
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