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2016-05-04 Software brings novel features to conventional dry etching
CORIAL said the COSMA Pulse can control and pulse simultaneously from each other all process parameters, including gas flow rate, working pressure, RF power, LF power, or virtual process parameters.
2013-07-11 Imec demos damage-free cryogenic etching of ultra low-k mat'l
By applying very low temperatures during etching, a condensation of etch products in the pores of the low-k material results in a protection of the dielectrics' surface
2002-07-24 Tegal develops plasma etch process for FeRAM materials
Tegal Corp. has developed plasma etch processes for ferroelectric RAM (FeRAM) materials by implementing patented technologies for the closed-loop control and monitoring of wafer temperatures during etching.
2016-05-09 Shadow mask eases graphene etching at room temp
University of Illinois (Urbana-Champaign) researchers came up with a one-step process for quickly patterning and transferring graphene circuits to flexible substrates using a simple shadow mask.
2016-03-09 Corial touts novel etching process for device deprocessing
In the failure analysis flow, the Corial 200I ICP system features etching processes targeted specifically at deprocessing of electronic devices down to 20nm
2005-05-27 U.K. etch equipment company opens Singapore office
Surface Technology Systems plc, a supplier of plasma etching equipment for silicon and MEMS applications, has opened an office in Singapore.
2004-06-30 Philips opens R&D rent-a-lab
Seeking to change the way high-tech companies conduct corporate research, Philips Research has opened a multipurpose clean room here available for rent to internal R&D teams as wells as outside customers.
2001-05-08 Laser processing of flex
This article explains the use lasers for machining (cutting and excising), skiving, and drilling holes during the manufacture of flexible circuits.
2007-09-13 Firms collaborate on etch process for nanoimprint litho
Nanoimprint lithography stamp provider NIL Technology A/S and Oxford Instruments have partnered to develop etch processes targeted at nanoimprint lithography.
2002-08-19 Tegal to acquire sputtering equipment company
Tegal Corp. has signed a definitive agreement to acquire privately held Sputtered Films Inc.
2002-04-04 Tegal gets etch system order from auto electronics supplier
Tegal Corp. has received an order for a Tegal 901e diode plasma etch system from an undisclosed supplier of automotive electronics devices
2011-04-25 IMEC bares new bulk FinFET fabrication process
IMEC introduces a new process flow to fabricate bulk finFETs using a plasma-free dry oxide removal process that shows good morphological and electrical characteristics
2002-04-18 CEO develops 1.5kW laser module for EUV lithography
Cutting Edge Optronics Inc. has demonstrated a 1.5kW laser module as a plasma source for extreme ultraviolet semiconductor lithography
2013-09-09 ITRI shows atmospheric pressure process for GZO
ITRI's aePlasma offers thin-film deposition and organic film etching at atmospheric pressure for touch panel and transparent solar cell manufacturing. An alternative to ITO processes
2012-11-22 German team develops photonic crystal production method
The SPRIE (Sequential Passivation and Reactive Ion Etching) method is applied to structure the silicon on large areas in a simple and three-dimensional manner
2014-07-08 Deposition, etch equipment revs up 3D NAND ramp-up
The equipment from Lam Research addresses the need for three of the most critical steps in forming 3D NAND memory cells: stack deposition, vertical channel etching, and tungsten wordline deposition
2002-03-11 Tru-Si, OSE-USA codevelop high-yield stacked die chips
Tru-Si Technologies Inc. has formed a joint development agreement with IC package provider OSE-USA to create an ultra-thin microchip die that can be stacked and interconnected with up to four die per package for volume manufacturing.
2005-03-22 Trikon expands market focus amid Aviza merger
Troubled Trikon Technologies Inc., which is in the process of being acquired, plans to expand its focus in the chip-equipment business.
2007-05-17 R&D center for high-end packaging opens in Singapore
STATS ChipPAC is laying the groundwork for its expansion into the high-end packaging market by building a new R&D center at its Singapore headquarters.
2002-11-14 Infineon demonstrates breakthrough in chip structures
Infineon Technologies has announced that its researchers have demonstrated the patterning of thin dielectric films on silicon wafers utilizing a resist mask patterned by Extreme Ultraviolet Lithography.
2002-01-09 ChipPAC qualifies 300mm wafer packaging
ChipPAC Inc., a provider of semiconductor assembly and test services, has qualified all of its front-end assembly operations in the 300mm wafer packaging.
2005-06-20 Sony, Toshiba co-develop 45nm embedded DRAM
Sony Corp. and Toshiba Corp. have reported they developed the first 45nm embedded DRAM cell by scaling embedded DRAM cells down to 0.069 square microns.
2004-06-23 NEC devises low-k film for 2G 65nm process
NEC Corp. announced it has developed a 2G, 65nm process with multilevel copper and low-k dielectric interconnects.
2007-04-16 Litho woes weigh down semicon industry
The lithography world has suddenly turned upside-down as the industry gets socked by a double whammy: The window of opportunity is slowly closing on EUV lithography for IC production, but the most likely alternativea version of 193nm immersionis proving expensive.
2010-12-17 Laser etches finer lines for smaller ICs
An intense 13.5nm extreme UV light source that can etch finer features reduces semiconductor feature size by an order of magnitude, according to researchers from Purdue University who have developed the laser.
2004-12-01 Japanese companies strengthen low-k materials
Mitsubishi says its product is 6x stronger; Zeon claims a 2x hit over current materials.
2011-11-11 Graphene beats ITO in UV LED current spreading
Researchers from South Korea and U.S. said graphene-based transparent contact to a GaN-based UV LED shows superior transmission in UV.
2011-01-28 GaN purification process could boost LED, transistor output
The new purification process introduces voids into the GaN film near its interface with a sapphire substrate, causing thousands of defects to be sucked into the voids, thus boosting GaN devices' output.
2015-07-03 Examining 3D embedded substrate power packaging
Here is a look at 3D embedded substrate power packaging technologies, which will be increasingly deployed in everything from cell phones to hybrid electric vehicles.
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