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2007-04-18 Power Quad Flat No-Lead (PQFN) package
The PQFN is a surface mount plastic package with lead pads located on the bottom surface of the package. All PQFN packages have either been designed with a single exposed die pad (flag) or multiple exposed die pads depending on device requirements and intended application. The industry standardization committee, JEDEC, has given a registered designator of MO-251 to describe the family of single exposed pad PQFN packages.
2010-08-11 Polypropylene delivers glass-like creep resistance
The Thermylene P8 compounded polypropylene resin offers improved creep resistance at room temperature when compared to long glass filled PP.
2007-01-16 POF port brings fiber optic benefits to the home
Firecomms' Fast Ethernet fiber optic transceiver technology is now available in an easy to use, low-cost housing that provides instant termination of bare POF.
2000-03-28 Plastics for IR data transmission windows
This application note presents information on plastics used for windows through which IR data is transmitted and received by computers, printers, handheld controllers, and other equipment. Such windows are usually deep red or other colors opaque or semi-opaque to visible light.
2011-07-05 Passive array NVM targets secure docs
Thin Film has developed a passive array non-volatile printable plastic memory that is intended for secure documents.
2010-11-25 Organic processors run hardcoded program
The 2011 International Solid State Circuits Conference will host papers on a 5.2GHz processor from IBM and an Intel Itanium chip packing 54Mbytes cache.
2005-05-09 Opticom gives polymer memory research arm six more months
Opticom ASA, a company that has worked with Intel Corp. for several years on a multilayer, nonvolatile plastic memory, has decided to continue supporting its Swedish subsidiary at current levels for six months, despite a decision by Intel to cut back polymer memory activities.
2002-04-15 NRS completes acquisition of NEC's SAW device business
NRS Technologies Inc., a subsidiary of Nihon Dempa Kogyo Co. Ltd, has completed its acquisition of NEC's SAW device business.
2002-12-03 Noxtlon PLCC operates to 110C
Shenzhen Noxtlon Electronic Co. Ltd has released a DIP type PLCC that features a UL 94V-0 glass-filled thermoplastic insulator body.
2006-10-03 MDKs ease deployment of copper-to-POF converters
Firecomms said its two new MDKs will enable the rapid deployment of copper-to-POF converters and repeaters for 1394b and Fast Ethernet.
2002-05-16 Matsushita touchscreen panel is <0.5mm thick
The EMU601 series film touchscreen panels from Matsushita Electronic Components Co. Ltd are <0.5mm thick and offers a 0.82 transmission factor.
2003-06-18 Lumitex rod light guides include LED source, harness
Lumitex Inc. has released its plastic rod light guides with an LED light source and wiring harness to provide designers with a "plug n' play" solution.
2002-09-02 Jaro film capacitors fit in 0603 pack
Jaro Components Inc. has tucked its high-grade surface-mount PPC-series film capacitors in an ultramini 0603 moldless package.
2014-07-11 Ink promises shapely future for electronics
Japanese researchers developed an ink that allows charge transfer in order to facilitate printing at room temperature. This broadens options for flexible plastics that can be used to print semiconductor devices.
1999-12-08 Higher outputs, easier assembly: What's new in high-power laser diodes?
This application note deals with the new designs being developed for high power application of laser diodes for the industrial and communications sector. This note, in turn, describes a laser diode in the TO-220 package.
2003-10-02 High-k, strained Si leaving the lab
With performance improvements getting harder to wring out of CMOS by transistor shrinks, researchers are increasingly turning to strained silicon, high-k oxides, and different types of on-chip silicon-crystal orientation.
1999-12-03 Guidelines for handling and processing moisture sensitive surface mount devices (SMDs)
This application note describes the undesirable moisture in processing moisture sensitive surface mount devices manifested through rapid heating. It also enumerates some guidelines in handling such devices.
2002-05-22 Green Point announces third-phase expansion of Suzhou plant
Taiwan-based Green Point Ent. Co. Ltd, a manufacturer of housings and plastic parts for mobile phones, is implementing the third-phase expansion of its offshore factory in Suzhou, China.
2008-12-12 Get ready for affordable, flexible electronic displays
HP and the Flexible Display Center at Arizona State University have announced the first prototype of affordable, flexible electronic displays. Flexible displays are paper-like computer displays made almost entirely of plastic. This technology enables displays to become easily portable and consumes less power than today's computer displays.
2006-12-14 Fujitsu taps castor oil for new polymer
Fujitsu Ltd and Fujitsu Laboratories Ltd have developed a polymer with high bio-content that uses castor oil, enabling the new material to withstand repeated bending and feature superior flexibility.
2002-05-23 Flextronics to boost presence in China
EMS provider Flextronics Int. Singapore Pte Ltd has entered into an agreement to acquire NatSteel Broadway Ltd for about $653 million in a bid to strengthen its manufacturing presence in mainland China.
2014-09-12 Flexible display for electronics uses graphene
The Cambridge Graphene Centre, with its graphene expertise, partnered with Plastic Logic, with its extensive capabilities in transistor and display processing, to develop a graphene-based flexible display.
2013-07-18 Failure signature of electrical overstress
Here's a catalogue of failure signatures from common electrical overstress failure modes.
2003-02-25 Europe quietly forms polymer electronics project
Perhaps the best-kept secret in the electronics industry at the moment is the upcoming deadline for non-European companies to join the biggest polymer electronics R&D program ever.
2012-02-16 Escatec beefs up Malaysian facility
The electronics design and manufacturing company invested $2.5 million in its contract manufacturing facility in Johor Bahru, Malaysia.
2003-11-03 Epcos releases low-cost coil former for ferrite cores
Epcos AG has announced that it now offers a low-cost coil former for its E30 ferrite cores. Following a redesign-to-cost approach, a new tool was devised to produce a substitute for the coil former.
2006-04-24 Enclosure houses switches, controls and alarm systems
Bud Industries has expanded the Utilibox Style A product line with the addition of a 6.10-by-4.60-by-1.37-inch high plastic enclosure.
2008-01-24 Electronic contact lenses promise virtual display
Electronic contact lenses, made by depositing circuitry and LEDs on organic plastic, have been demonstrated by researchers at the University of Washington.
2011-02-28 DRAM, CPU built on organic substrates shown at ISSCC
Organic innovations include an 8bit processor handling up to six instructions per second in an averaging routine, a 64bit organic DRAM and a technique for printing CMOS structures on plastic substrate.
2002-01-28 Donghai Silicon Micropowder to expand product line
Donghai Silicon Micropowder Factory has invested $7.25 million to install a production line for the volume manufacturing of silicon micropowder, with an annual capacity of 20,000 tons.
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