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2003-03-24 Deswell expands molding operation in Dongguan
Deswell Ind. Inc. has announced the expansion of its plastic injection molding operation in Dongguan, China.
2003-03-25 Deswell expands molding facility in Dongguan
Deswell Ind. Inc. has announced the expansion of its plastic injection molding operation in Dongguan, China.
2002-11-05 Collaboration to push for display technology advancement
As part of a federally sponsored R&D initiative, DuPont and Sarnoff Corp. have agreed to develop an organic-TFT technology on plastic substrates.
2005-04-25 Circular connector available with coax, power contacts
Hypertronics' D series of high reliability circular plastic connectors is now available with coax and power contacts.
2002-03-01 Chomerics phase-change material simplifies heatsink removal
The T766 phase-change features a thermal impedance of 0.04C-inch?/W, providing a low thermal resistance interface path between hot components and heat inks, while allowing easy removal of sinks for rework operations.
2002-04-02 Chomerics coating process can apply 12.55m-thick coating
Chomerics has introduced the Ecoplate metallic conformal coating process, which applies a pure metal coating as thin as 12.5?m over plastic or metal electronic housings.
2010-07-26 China XD Plastics, HD team for electric car batteries
As part of an exclusive product development agreement, China XD Plastics has supplied Hafei Dongyang with a supply of specialized plastics for use in electric vehicles.
2003-02-13 Changbao shrinkable tubes are flame-retardant
The CB-DWT series of heat-shrinkable, dual-wall tubes from Shanghai Changbao Special Plastic Products Co. Ltd is flame-retardant and is designed to operate over the -55C to 125C temperature range.
2002-07-30 CDT receives grant form U.S. DTI to develop solar cells, light detectors
Cambridge Display Technology has received a grant from the U.K. Government's Department of Trade and Industry for the R&D of plastic solar cells.
2007-10-16 Boost networks with Ethernet-over-POF
Plastic optical fiber technology offers an attractive alternative to traditional glass optical fiber and copper wire for industrial, office, home and automotive networks. However, to become a mainstream alternative, POF needs to support Ethernet. Despite a lack of standards, interfacing POF to Ethernet can be a straightforward task.
2004-06-17 BivarOpto rolls out cutter for POF, FLP cables
BivarOpto released a palm-sized fiber cutter that is designed exclusively for cutting or stripping plastic optical fiber and flexible light pipe cabling.
2003-05-26 BGA (Ball Grid Array)
This application note provides general information about the Plastic Ball Grid Array (PBGA) packages and its variants - the TE-PBGA, EBGA, and TSBGA,
2014-05-26 Assembly handling, thermal mgmt for lidless FC-PBGA
Here are recommendations on the assembly handling and application of thermal management solutions for lidless Flip Chip Plastic Ball Grid Array components.
2002-08-01 ASAT to provide packaging solutions to Honeywell
ASAT Holdings Ltd will provide packaging and testing solutions for Honeywell's RF/microwave product family.
2002-01-24 Asahi Kasei establishes Shanghai unit
Asahi Kasei Corp. has reached an agreement with Nichimen Corp. for the transfer of a majority interest in Wuxian Hamasaki Plastics Compounds Co. Ltd, a wholly owned subsidiary of Nichimen.
2001-10-04 Applying the AN10E40 magnetic stripe read head amplifier
This application note briefly describes how the AN10E40 Field Programmable Analog Array (FPAA) can be used to construct a complete magnetic stripe read amplifier/decoder and how it can be easily interfaced to a host processor.
2005-04-08 Amkor, Asat sign cross-licensing agreement - again
Packaging companies Amkor Technology Inc. and Asat Holdings Ltd have entered into a multi-year cross-licensing agreement, Amkor said Wednesday (Apr. 6), a follow-on from a similar deal cut in November 2003.
2004-03-31 Agere devices reduce RF transistor packaging costs
Agere Systems has announced five RF overmolded plastic packaged transistor products that will lower the overall costs of wireless basestation amplifier equipment.
2003-10-27 Wuxi Xuyang rectifiers eye polarity protect apps
The surface-mount SS12 to SS16 series of Schottky barrier rectifiers from Wuxi Xuyang Electronics Co. Ltd features Jedec DO-214AC molded plastic body case, solder plated, and solderable per MIL-STD750 terminals.
2004-04-15 Vishay releases 110C-rated optocouplers
Vishay has disclosed that its family of optocouplers is the first devices in standard plastic packaging to achieve an operating temperature range from -55C up to 110C.
2003-03-03 Toshiba 8-bit MCUs target household appliances
The TMP86P20xP series of MCUs from Toshiba Corp. integrates an 8-bit CPU core and 2KB of ROM into a 20-pin plastic DIP package.
2004-01-28 Sunstar cable closure features >40mm curve radium
Sunstar Communication Technology has released a fiber-optic cable closure that comes with reliable sealing and high tensile plastic construction.
2008-03-24 Step-down regulator ready for military apps
From Linear Technology Corp. comes the Military Plastic grade (MP-grade) version of the LTC3414, a high efficiency, 4MHz synchronous buck regulator using a constant frequency, current mode architecture.
2007-10-03 Small PCB antennas for Micrel RF products
There is a high demand for small PCB layouts and antennas that can be enclosed inside of a plastic box without the problem of having the aerial surface touching other objects or being bent.
2006-08-01 Sirenza unveils 'first' SOF 26-packaged LDMOS transistor
Sirenza has released its first plastic encapsulated, surface mount packaged LDMOS transistor exclusively housed in the company's low thermal resistant SOF-26 package.
2014-02-17 Sensor detects diaper wetness
The sensor is printed on a plastic film using inkjet technology to minimise discomfort for wearers, enabling application to more parts in the human body.
2014-02-11 Sensirion offers micro-scale liquid flow sensors
The liquid flow series LPP10 and LPG10 are based on planar microfluidic substrates and are available with a glass (LPG10) or a plastic (LPP10) packaging.
2003-12-12 Sanmeng heating wire features hard aging
Shanghai Sanmeng Electrothermal Material Co. Ltd has released fiber infrared electrical heating wires that are made of carbon. Suitable for use in ground heating, the product has adopted high quality carbon fiber as its pyrotoxin while heat-resistant fluorin plastic and non-alkali glass fiber are used as insulated material.
2005-11-30 Samsung unveils 7-inch LCD
Samsung Electronics said it has developed a flexible seven-inch diagonal thin-film transistor LCD on which uses plastic substrate to display 640 x 480 pixel resolution television video pictures.
2009-03-18 Samsung claims print electronics progress
Samsung and its university research partners claim to have overcome two of the last hurdles to large-scale printable electronics on plastic substrates: an n-type organic semiconductor material and a patterning method for separately fabricating nano- and microwire transistor channels.
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