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2015-05-12 Impact of piling on package manufacturing
To accomplish various performance enhancements, packaging engineers should consider intriguing combinations being constructed at the chip to package level.
2012-09-28 How to select PCB materials for high-frequency apps
Find out how to simplify that choice when striving for the best tradeoff between ease of fabrication and best electrical performance.
2006-04-11 Power connector offers increased current capacity
Tyco Electronics has launched a high-current card edge connector based on its SEC-II product line.
2012-04-25 Molex looks into 25Gb/s interconnect
The Molex ZXP Modular I/O Interconnect System is a small form-factor pluggable interface supporting data transmission at speeds beyond SFP+ and protocols such as 100 Gigabit Ethernet.
2009-05-12 Low-axis materials improve antenna efficiency
The Advanced Circuit Materials (ACM) Division of Rogers Corp. has developed the latest patent-pending innovation in high frequency materials, RT/duroid 5880LZ laminate.
2003-01-06 Autosplice interconnects provide high retention force
The Flange Stacking Interconnects incorporate a flange design that provides higher retention forces in stacked PCBs.
2003-06-03 AIC PGA connector enables fewer board layer tests
The surface-mount, interstitial PGA connector from AIC involves the application of the patented BGA socket adapter system in an existing, molded PGA wafer.
2005-06-01 Driving 10Gb Serial ATCA backplanes
The Backplane Ethernet Task Force is focused on developing three new PHYs: 1000BASE-KX, 10GBASE-KX4 and 10GBASE-KR
2015-02-11 Desktop PCB printer eases prototype development
The printer is targeted at surface-mount designs. In addition to being able to print two conductive layers separated by an insulating medium, it can dispense solder paste into the requisite locations.
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