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2005-04-21 Virtio makes Linux version of Virtual Platform available
Virtio introduced a Linux version of its Virtual Platform technology. The Virtio Virtual Platform is a reconfigurable, functionally accurate simulator of an IC or of an entire circuit board containing multiple ICs.
2004-09-22 Toshiba adopts ATI platform in latest Satellite notebooks
Toshiba Corp. has selected ATI Technologies Inc.'s RADEON IGP platform technology for its new line of Satellite notebooks.
2008-08-07 Timing platform improves IP backhaul networks
Semtech has released the Timing Over Packet Synchronization ACS9510 device that enables IEEE1588v2 Precision Time Protocol to work closely with SONET/SDH synchronous equipment timing source solution, employing backhaul for broadband wireless base stations.
2007-01-26 Synopsys contributes virtual platform tech to OSCI
EDA software provider Synopsys Inc. has contributed a key technology for the development of Virtual Platforms based on SystemC to industry group Open SystemC Initiative (OSCI
2006-05-19 Synopsys acquires virtual platform creator
Synopsys announced that it is expanding its presence in electronic system level design by acquiring Virtio, a creator of virtual platforms for embedded software development.
2011-09-21 How virtual platform boosts product devt
Virtual hardware platforms can be leveraged to achieve considerable project and product planning improvements in terms of development time, time-to-market, and development process risk.
2007-06-29 Development platform rolls for PXA3xx processors
Synopsys Inc.'s DesignWare VPXA3 Virtual Platform eases the development of smartphones, handheld and consumer electronics devices that use Marvell PXA3xx XScale technology application processor.
2007-05-25 Common Platform, partners extend chip pact to 32nm
Common Platform partners IBM, Chartered Semiconductor and Samsung Electronics, along with joint-development alliance partners Infineon and Freescale, announced plans to extend their chip development pact to the 32nm node
2006-10-30 Common Platform produces mobile tech for Qualcomm
Common Platform technology founding members IBM, Chartered and Samsung announced that they have successfully produced 90nm chips for Qualcomm Inc. in their respective 300mm fabs.
2007-04-25 Common Platform partners deliver 65nm reference flow
Cadence Design Systems Inc. announced the immediate availability of the 65nm Common Power Format (CPF) enabled reference flow targeting the Common Platform technology.
2008-04-03 CDMA EV-DO platform trims cost of broadband upgrade
Motorola has released a new IP-BSC-DO, a highly scalable EV-DO base site controller platform that enables CDMA operators to quickly and cost-effectively upgrade the DO broadband data capacity
2008-10-01 ARM to work on SoC platform for IBM alliance
ARM has agreed to develop a SoC design platform of physical intellectual property at the 32nm and 28nm nodes for the Common Platform technology alliance.
2004-10-27 ARM platform based on ARM1176JZF-S 32bit processor core
ARM announced that it has released the latest PrimeXsys Platform based on the ARM1176JZF-S 32bit processor core to their lead partner STMicroelectronics
2008-08-19 Analog IP secures validation for Common Platform tech
Analog and mixed-signal IP provider Cosmic Circuits has announced the validation of silicon IP cores for the 90nm Common Platform technology employed by IBM, Chartered Semiconductor and Samsung.
2010-03-05 Altera sees platform collision in IC industry
Bradley Howe, VP of IC engineering at Altera, pointed out that IC integration challenge in the semiconductor industry, saying that a platform collision is in the horizon
2011-01-20 32/28-nm reference flow for Common Platform Alliance ushered
Cadence's 32/28nm Low-Power RTL-to-GDSII Silicon Realization Reference features new design intent, abstraction and convergence capabilities giving more deterministic path to advanced silicon.
2002-07-26 ZyXEL selects Infineon QAM-VDSL chipset for its broadband platform
ZyXEL Communications Corp. has selected Infineon Technologies' PoVDSL chipset for its VES broadband access platform
2004-01-08 Zoran technology enables Toshiba's new media server
Toshiba Corp. has selected Zoran Corp.'s Generation9 family of DTV system ICs, software and development platforms.
2007-03-30 Zigbee platform supports up to 20yrs battery life
Freescale's MC1322x Zigbee platform is engineered to support battery life of up to 20 years, doubling the expectations for current Zigbee solutions
2004-12-13 ZigBee platform supports multiple RF transceivers
Microchip's new PICDEM Z 2.4GHz demonstration kit provides an easy-to-use evaluation and development platform for ZigBee application designers
2003-03-04 YES to develop 300mm process tool platform for Adept
Yield Engineering Systems Inc. has selected Adept Technology Inc. to develop a new 300mm process tool platform that will fully automate its vacuum cure oven process.
2002-11-12 Xilinx, AMCC co-develop reference platform
Xilinx Inc. and Applied Micro Circuits Corp. have introduced the AMCC reference platform
2007-03-15 Xilinx touts 'first' 90nm non-volatile FPGA platform
Built on Xilinx's 90nm Spartan-3 Generation low-cost FPGA fabric, the Spartan-3AN FPGA platform is touted to be the industry's most advanced non-volatile FPGA solution
2005-02-03 Xilinx platform FPGAs enable 160Gbps switch fabric from TeraChip
Xilinx Inc. announced that TeraChip, a fabless developer of next-generation switch fabrics is using Xilinx Virtex-II Pro platform FPGAs to implement key functional elements of its memory-based TCF16X10 switching fabric
2002-02-04 Xenicent develops "lab on a chip" technology
Xenicent Inc. is developing a "lab on a chip" technology for commercial testing applications within the food packing and veterinary industries
2007-06-21 x86 platform eyes smaller PC systems
VIA Technologies' VIA VT6047 Pico-ITX form factor reference design is claimed to be the smallest x86 mainboard in the industry designed for a new generation of ultracompact embedded PC systems and appliances.
2012-09-14 X-Fab claims the first open platform MEMS 3D process
X-Fab's 3-D sensor process is suitable for applications ranging from mobile devices, consumer goods, games and toys, automotive, robotics, industrial and medical equipment.
2002-01-21 X-FAB adds new mixed-signal technology to its CMOS process platform
X-FAB Semiconductor Foundries AG has added a new mixed-signal technology called XC06 high-voltage process to its 0.65m mixed-signal CMOS process platform.
2011-08-05 Wireless test platform offers accurate OTA
octoScope's octoBox is a wireless testing product that offers accurate OTA testing of conventional and MIMO wireless devices in a customisable refrigerator-sized anechoic enclosure.
2006-04-12 Wind River's Linux platform to support Intel's next-gen processors
Wind River Systems announced that its platform for consumer devices, Linux Edition, supporting Intel's newest processor family, codenamed Monahans, is now sampling to customers
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