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2007-03-26	NXP readies 'smallest' Wi-Fi chip NXP Semiconductors is about to start sampling a single-package 81-pin TFBGA Wi-Fi chip that it says is the smallest device yet for 802.11 b/g connectivity as well as offering very low power drain.
2007-09-24	Nexperia solutions simplify Edge handset dev't NXP Semiconductors has developed a new family of multimedia-enhanced cellular system platforms that significantly accelerate the pace of Edge-based handset design.
2011-05-24	Multimedia chips target low-end mobile phones Spreadtrum Communications released two new multimedia chipsets for low-end mobile phones. The chips offer a competitive cost structure for GSM/GPRS multimedia-rich mobile phones.
2012-03-01	Mobile processors ready for Android's ICS Optimized for Android Ice Cream Sandwich smartphones, Broadcom's platforms offer single or dual ARM Cortex A9s and 3G modems up to 21Mb/s.
2011-05-02	MEMS test solution responds to the lowest-cost products OpenATE Inc. has developed the PXI test system to use the QSPI and NI Chassis for a variety of MEMS tests to validate performance.
2013-03-01	Memory test tip: Characterising PCM Learn about new techniques involving current limiting and high-speed pulse generators.
2013-02-21	Memory test tip: Alternative NVM options (Part 2) Know the testing challenges associated with another emerging NVM technology—ferroelectric memory.
2013-03-11	Mediatek takes crown for tiniest RF transceiver The MT6167 measures less than 7mm² and supports 2G and 3G protocols.
2014-12-22	Marvin offers compact, cost-effective test platform The TS-960 features a 20-slot, 3U PXI chassis accommodating up to 512 125MHz digital I/O channels with PMUs per pin, allowing users to address a range of test applications.
2005-10-31	GSM/GPRS monolithic radio integrates complete phone on one chip Silicon Laboratories' AeroFONE Si4905 integrates a power management unit, battery interface and charging circuitry, digital baseband, analog baseband and a quad-band RF transceiver in a 12-by-12mm package.
2012-08-08	Grasping power awareness in RTL design analysis Find out how formats such as CPF and UPF play a key role in capturing power intent for RTL design analysis and verification.
2014-07-24	Fundamentals of resistive memory devices In this article, we address the basics of resistive random access memory(ReRAM) structures, as well as the test hardware available to characterise them.
2015-07-03	Examining 3D embedded substrate power packaging Here is a look at 3D embedded substrate power packaging technologies, which will be increasingly deployed in everything from cell phones to hybrid electric vehicles.
2006-10-06	ESD protection, Schottky diodes come in a tiny package ON Semiconductor has introduced three new ESD diodes and three Schottky diodes in an ultrasmall SOD-923 package.
2013-08-07	Distributed power in portable electronics Know the concepts for portable appliances using switchable power supplies to control peripheral functions.
2008-07-16	Conquer ULC handset design challenges Ultralow-cost (ULC) handsets have been a hot topic in the past three years. ULC today refers to handsets that can be built for $20 or less. They represent a unique segment of the cellular market and require a unique set of strategies for success.
2013-03-21	Broadcom steals MediaTek's crown Just like MediaTek's MT6167, Broadcom's BCM2093 is a sub 7mm², 40nm RF chip. The BCM2093 was discovered second but it may actually have hit production a week or two prior to the Mediatek solution.
2007-10-17	Broadcom packs key 3G technologies in one chip Broadcom has announced a new single-chip HSPA processor that integrates all key 3G cellular and mobile technologies on a single low-power 65nm CMOS die.
2008-01-18	ATE pin devices handle up to 2Gbit/s rates Semtech claims its new family of off-the-shelf pin electronics devices is the first to integrate two complete channels of high-performance pin electronics with data rates up to 2Gbit/s.
2009-05-21	AnalogicTech stays 'fabless without foundries' To explain the current issues in analog, EE Times caught up with Richard Williams, president, CEO and chief technology officer of Advanced Analogic Technologies Inc., a fabless analog chip vendor.
2013-11-21	Advantest offers cloud as electronics testing sol'n Targeting IC design departments, academics and R&D, Advantest's platform taps the productivity potential of the cloud without compromising testing data confidentiality and availability.
2013-04-01	Add multi-cell battery system to single-cell designs Front-end power management units will unite multi-cell battery stack designs of future systems and single-cell-based designs of past systems.