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2008-02-15 Renesas, Sharp, Powerchip enter LCD driver JV
Renesas Technology, Sharp and Powerchip Semiconductor have agreed to establish a joint venture on Apr. 1, specializing in drivers and controllers for small- and mid-size LCDs.
2007-01-17 Renesas, Powerchip form JV on memory product design
Renesas Technology and Powerchip Semiconductor have agreed to establish a joint venture that will specialize in the design of advanced memory devices.
2006-06-06 Renesas, Powerchip broaden relationship on flash memory
Renesas and Powerchip have signed a manufacturing agreement and a technology and sales licensing agreement pertaining to Renesas' 4Gbit AG-AND flash memory devices.
2006-02-09 Renesas licenses flash line to Powerchip
Renesas Technology announced the conclusion of a licensing agreement with Powerchip Semiconductor covering the technology and sale of 1Gb AG-AND flash memory devices.
2012-09-21 Renasas to cut Powerchip ties, shift orders to TSMC
Powerchip has showed signs of reducing its presence in the DRAM market while Renesas needs TSMC's aluminium-based 80nm process technology for the manufacture of driver ICs used in Apple products.
2009-10-28 Powerchip, Taiwan Memory seek gov't funds
Taiwan DRAM makers Powerchip Semiconductor Corp. and Taiwan Memory Corp. (TMC) are separately seeking state support in an effort to survive, according to Gartner Inc.
2003-12-03 Powerchip, SST to co-develop 3G SuperFlash technology
Powerchip Semiconductor and Silicon Storage Technology have teamed up to develop its third-generation SuperFlash memory technology.
2008-01-31 Powerchip, IMEC team on sub-32nm memory processes
Taiwan's Powerchip Semiconductor has entered into an R&D partnership with European research center IMEC to develop solutions for the sub-32nm memory process generations.
2002-01-17 Powerchip to use 0.155m process in 256Mb DDR DRAM
Powerchip Semiconductor Corp. will use 0.155m CMOS process to make 256Mb DDR DRAMs in its 8-inch wafer fabs starting March this year.
2002-02-05 Powerchip to ramp up 12-inch fab this year
Powerchip Semiconductor Corp. has disclosed plans to expand capacity by ramping up its 12-inch fab using 0.135m process.
2004-02-19 Powerchip to make DDR-II using 0.11?m technology
Powerchip Semiconductor Corp. will launch an advanced 0.11?m process technology at its 12-inch wafer fab to make DDR-II units.
2015-07-07 Powerchip to build display, sensor IC fab in China
The total investment is estimated at $2.2 billion with the fab scheduled for completion in 2018-2019 and a manufacturing capacity of 40,000 wafer starts per month, with support from Hefei Construction.
2003-10-13 Powerchip taps Asyst for AMHS expansion
Taiwan-based memory chip manufacturer Powerchip Semiconductor Corp. has given a multi-million dollar follow-on-order to Asyst Technologies Inc.
2011-05-02 Powerchip returns to DRAM market
Under its updated business model, Powerchip will acquire Elpida's mobile DRAM technology and sales rights for the products, while Elpida will continue to develop, manufacture and sell mobile DRAM.
2005-10-25 Powerchip plans $10 billion DRAM spend, says report
Powerchip Semiconductor Corp. is planning to build four DRAM wafer fabs over the next six years at a cost of about $10 billion, according to a report, which cited Powerchip vice president Eric Tang, as its source.
2002-05-16 Powerchip opens 300mm DRAM fab
Amid sinking prices in the DRAM market, Powerchip Semiconductor Corp. flipped the switch on its first 300mm wafer fabrication facility on May 14.
2002-04-10 Powerchip injects $1.6B to build 12-inch wafer fab
Powerchip Semiconductor Corp. has invested $1.6 billion to establish a 12-inch wafer fab, with a proposed monthly capacity of 35,000 wafers.
2011-02-02 Powerchip bows out of DRAM business
Exiting from the DRAM market, Taiwan's Powerchip Technology transfers its business over to Japan's Elpida Memory.
2002-05-14 Powerchip 30mm wafer fab to use PRI reticle system
Taiwan memory chip maker Powerchip Semiconductor Corp. has selected PRI Automation Inc.'s Guardian Bare Reticle Stocker for its new 300mm wafer fab. The order represents PRI's first bare reticle management system in Taiwan.
2008-10-31 Mosaid, Powerchip end DRAM patent feud
Mosaid Technologies Inc. and Taiwan's Powerchip Semiconductor Corp. have settled their patent infringement litigation and signed a patent license agreement.
2010-08-03 Maxim, Powerchip form 300mm foundry alliance
Analog chip maker Maxim Integrated Products Inc. has formed a 300mm foundry alliance with Taiwan's Powerchip Semiconductor Corp., reports Needham & Co.
2007-07-04 Macronix survives PowerChip's takeover bid
Powerchip Semiconductor has failed in its bid to gain control of another Taiwan memory supplier, Macronix International, according to reports from the Taipei Times.
2006-09-14 Heard on the wire: Elpida to form JV with Taiwan's Powerchip
Elpida Memory said that it is still narrowing its site selection for a new wafer fab, although the Japanese DRAM maker is now fueling speculation about a possible venture in Taiwan.
2013-02-07 Globalfoundries closes P3 deal, Powerchip ends DRAM run
With P3 plant being purchased by GlobalFoundries, Powerchip is exiting the oversupplied DRAM Market.
2003-03-07 Elpida, Powerchip solidify strategic alliance
Elpida Memory Inc. and Powerchip Semiconductor Corp. have signed sales and purchasing contract agreements.
2006-12-11 Elpida, Powerchip join efforts for DRAM fab
Elpida Memory Inc. and Powerchip Semiconductor Corp. will form a memory joint venture that will focus on the cutthroat commodity DRAM market.
2009-07-03 Elpida ends partnership with Powerchip
Japanese DRAM maker Elpida Memory Inc. is withdrawing from Powerchip Semiconductor Corp.'s board, gradually walking away from their partnership.
2008-11-25 Buzz: Elpida muses on Powerchip buyout
Japan DRAM maker Elpida Memory Inc. is mulling over a plan to acquire Taiwan's Powerchip Semiconductor Corp., according to reports from Reuters and others.
2015-07-13 Wafer fab closures projected to grow in the coming years
Qimonda was the first company to close a 300mm wafer fab after it went out of business in early 2009 and more recently, ProMOS and Powerchip closed 300mm wafer fabs in 2013.
2013-01-24 Uncertainty in DRAM market to persist this year
IHS forecasted that DRAM revenue this year will reach $30 billion, up 14 per cent from $26.4 billion last year, marking the first time since 2010 that global DRAM market revenue will rise.
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