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2014-10-29 Apple iPad Air 2 doesn't fall far from the tree
The 16GB Wi-Fi-only version of the Apple iPad Air 2 sports a bill of materials of $270, based on a preliminary estimate. This compares to the $269 BOM for the tablet's 16GB predecessor.
2012-12-14 Analyst: All-robot manufacturing floor in the near future
Engineering consultant Douglas Alexander explains that technology exists today that makes it possible to operate a manufacturing line without human labour.
2015-09-14 Addressing PCB size limits in wearables
Wireless wearable applications call for a degree of IC, package, and board size reductions that only wafer-level chip-scale integration can solve.
2012-01-02 A primer on wireless sensor network
Here are the basic concepts of wireless sensor networks and protocols, the significant elements comprising a wireless sensor, and some of the important design considerations for using them.
2015-12-30 A primer on debugging video apps and beyond
Starting with the review of the application and culminating with the submission of parts through official failure analysis channels, this guide attempts to provide as comprehensive a framework as possible.
2005-05-23 A guide to better EMC for PCB design
In digital design, the number of possible coupling routes is simply too large to deal with using analysis alone. On the other hand, stating design rules out of context often presents an incomplete picture.
2014-12-23 3D printing spins confusion at copyrights
No matter which market analysis firm you go to, it will paint rosy picture for 3D printer and consumables market. Here we look at the current and upcoming capabilities of 3D scanners that help you "copy" designs for your 3D printing needs.
2014-12-12 3D printing creates LED on contact lens
The hard contact lens is made of plastic. The researchers used quantum dots to create the LEDs that generated the coloured light. Different size dots can be used to generate various colours.
2014-05-08 3D chip-making technique utilises metallisation layers
The technique fabricates active devices interleaved between the metallisation layers atop a standard CMOS die, eliminating the expense of vertically stacked transistors or of stacking dies with TSVs.
2008-12-19 200 Gbps silicon photonic integrated chip
To fully exploit the computing power of multi-core and many-core computers, there is a need of high-speed and high-capacity communication network that can manage enormous data transport among the cores and memories.
2002-03-07 'China's entry into WTO makes Asian trade fairs more important'
Messe M|nchen GmbH managing director Dr. Joachim Ensslin discussed the opportunity in organizing trade shows in China as well as the company's investments in Asia.
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