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2004-05-25 SUSS CPS integrates multiple test configurations
SUSS MicroTec has introduced its Cluster Probing System that combines multiple test configurations within one system.
2006-09-07 Sun, Unisys sue "DRAM price fixers"
Sun Microsystems and Unisys have filed suit against South Korean chip maker Hynix Semiconductor seeking damages from its participation in DRAM price fixing, according to online reports.
2013-04-30 Study digs deep into Li-ion particle properties
The research showed the importance of measuring the actual volumetric energy density when adopting a material that displays volumetric changes during charging/discharging in the electrodes of Li-ion batteries.
2007-10-25 STATS ChipPAC opens second China facility
STATS ChipPAC has announced the opening of a second manufacturing facility in Shanghai, China.
2003-08-06 Startup unwraps power grid planning software
Turning adversity into opportunity, a design engineer laid off last year has developed a block-level power grid noise simulator he had thought about for years.
2008-06-05 ST strives to zero in on more markets
STMicroelectronics is gearing toward high-value applications by renewing its efforts in creating analog ICs, MEMS, power semiconductors and proprietary processes fit for energy, healthcare, automotive electronics and multimedia.
2011-12-16 ST develops contactless testing wafer
STMicroelectronics has produced what it claims as the world's first semiconductor wafer whose dice were fully tested without contact probes.
2007-04-18 SSRM imaging tech improves LSI
Toshiba Corp. announced a breakthrough in imaging electron-carrier paths and impurities in semiconductors, which allows analysis at the 1nm level for the first time.
2015-04-15 SRC to standardise 3D chip testing
Duke University lays down the plan to designing-for-test the TSVs, so that large inexpensive probes can touch many TSV microbumps simultaneously to take measurements that ensure defect-free stacked die.
2015-06-10 Spotlight on position sensor tech for hydraulic cylinders
Position feedback sensors for hydraulic or pneumatic cylinders have used one of three traditional technologies: magnetostrictive, variable resistance and variable inductance sensors.
2001-04-15 Speed enhancements for Model Tech upgrades
This article discusses the ModelSim simulation upgrade, which promises faster performance, better memory use, new interactive debug features and improved testbench and regression test support.
2008-01-15 South Korea ends satellite mission
South Korea has aborted the eight-year mission of its first multipurpose satellite, which controllers lost contact with last month, according to an Agence France-Presse report.
2015-11-23 South Korea claims Qualcomm licensing is unlawful
Qualcomm said in a statement that the allegations and conclusions contained in the Examiner's Report are not supported by the facts and are a serious misapplication of law.
2013-02-06 Solving SoC and FPGA prototyping debug issues
Read about the accelerated development, verification and debugging of ASIC hardware and software.
2010-08-10 Solder paste is halogen-free, Pb-free
Indium Corp. introduced the Indium8.9HF-1 solder paste, highlighting the product's halogen-free, Pb-free formulation.
2007-11-05 Solar telescope rides balloon to fly over Earth
The U.S. National Center for Atmospheric Research recently launched its Sunrise vehicle on its maiden test flight to demonstrate its stability as a platform for the world's biggest solar telescope22 miles above the Earth with a 6,000lb, 1m-diameter mirror.
2008-06-17 SOIC adapter stretches PCB lifespan
Logical Systems' SMT to thru-hole adapter for SOIC is being touted as is a simple solution to several electronic assembly problems.
2007-09-03 Software verbally guides cable, wire harness assembly
CAMI Research has enhanced its AutoBuild software to provide guided assembly with speech for cable and wire harness manufacturing.
2013-06-18 Social networking vis--vis IC yield mgmt
Learn about the parallels between social networking and yield management in an IC manufacturing enterprise.
2013-01-17 SMM imaging of dopant structures of semiconductors
SMM can be engineered to measure differential capacitance by applying a low-frequency modulation signal to the MW measuring signal.
2007-03-20 SMIC partners with Cascade, Agilent for RFIC design, test
SMIC announced separate partnerships with Cascade Microtech and Agilent Technologies to provide RFIC services for RF design engineers in greater China.
2007-09-10 SK Supreme Court invalidates two FormFactor patent claims
The South Korea Supreme Court has issued a ruling affirming a 2005 Korea Patent Court decision invalidating certain claims of FormFactor's Korea Patent Nos. 278342 and 399210.
2013-06-28 Silicon Labs touts single-die alternative to quartz crystals
Silicon Labs joins the scalability and economy of CMOS and the stability of MEMS in its patented single-chip MEMS oscillator, dubbed CMEMS.
2003-07-21 Silicon debug tools lengthen their reach
Credence Systems and FEI have unveiled new products and acquisition this week that could assist design teams with leading-edge ICs.
2005-12-06 Signum unveils new emulator for TI's TMS32C2000 DSCs
Signum Systems announced the immediate availability of their JTAGjet-TMS-C2000 emulator for the Texas Instruments' TMS32C2000 platform of digital signal controllers.
2007-03-16 Signal-integrity issues plague multigigahertz era
Engineers want a new bag of tricks to manage signal integrity as data rates soar into multigigahertz territory.
2011-10-03 Signal integrity issues at 10 Gbit/sec and beyond
Know the challenges that this high-speed domain brings, as well as basic techniques for addressing them.
2002-12-23 Shipley, Therma-Wave ink nano-metrology development deal
Shipley Co. has signed a joint development agreement with Therma-Wave Inc. in which the two companies will co-develop scatterometric methods to better measure 130nm photoresist features for polysilicon gate and shallow trench applications.
2004-02-02 Serial storage SoCs demanding to test
The storage industry this year began widespread implementation of serial-based technologies to replace parallel physical-interface standards currently used to connect a system bus to disk storage devices.
2006-03-07 Sequence addresses needs of SoC designs below 90nm
Sequence Design announced the next generation of its PowerTheater design suite to meet the demanding requirements for wireless, mobile and large SoC designs below 90nm.
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