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2008-09-05 X-Fab Sarawak all set to start 0.35?m process tech
X-Fab Silicon Foundries' Malaysian facility in Kuching, Sarawak, with its 200mm production line, now is fully qualified for volume production and second sourcing of the company's 0.35?m high-voltage process technology called XH035.
2012-09-14 X-Fab claims the first open platform MEMS 3D process
X-Fab's 3-D sensor process is suitable for applications ranging from mobile devices, consumer goods, games and toys, automotive, robotics, industrial and medical equipment
2004-03-16 Updated process slashes size of CDMA RF filters
Agilent has reworked its proprietary film bulk-acoustic-resonator process technology to reduce the size of RF duplexer and filter devices for CDMA PCS phones.
2009-04-09 Unlock Micron's 50nm DRAM technology
With their latest 50nm process technology, Micron Technology Inc. seems to have struck the right balance between investment in new technologies and conservative design decisions.
2013-07-25 UMC, SuVolta team up for 28nm low-power process tech
The joint effort aims to yield a process that integrates SuVolta's Deeply Depleted Channel transistor technology into UMC's 28nm High-K Metal Gate high-performance mobile process.
2012-12-21 UMC touts 55nm display driver IC process
The 55nm SDDI process claims to feature an ultra-small SRAM size and provides an ideal balance of power consumption, performance and chip size for integration into high-end Full-HD smartphones
2008-11-27 UMC pushes high-k process for 45nm
Foundry United Microelectronics Corp. has validated its high-k metal gate process with a test SRAM design run at the 45nm node
2012-08-01 UMC first in producing FinFET process technology
UMC outdoes FinFET originator TSMC in producing a 20-nm FinFET process by 2014
2004-08-24 UMC 'engaging' customers with new 65nm process
Amid a major shift towards 90nm technology on 300mm wafers, Taiwan's United Microelectronics Corp. (UMC) is quietly "engaging" customers with its new and unannounced 65nm process.
2002-04-12 TSMC, ATMOS to make embedded memory on 90nm process
Taiwan Semiconductor Mfg Co. and ATMOS Corp. will jointly develop ATMOS SoC-RAM CMOS embedded memory on TSMC's Nexsys 90nm process technology.
2004-11-17 TSMC's 65nm process set to arrive late 2005, cost $1 billion
By the time Taiwan Semiconductor Mfg Co. Ltd (TSMC) ramps its first 65nm manufacturing process technology into volume production, late in 2005, it will have cost about $1 billion to develop, according to company chairman Morris Chang.
2005-01-14 TSMC validates 90nm process using Mentor Graphics Calibre xRC
Mentor Graphics Corp. disclosed that Taiwan Semiconductor Corp. (TSMC) used a comparison of Calibre xRC results, field solver data and silicon measurements as part of the validation for its 90nm process technology.
2006-05-26 TSMC to kick off 65nm technology operations
TSMC has qualified its 65nm low-power process technology, and expects to begin operations soon.
2005-01-04 TSMC to accelerate 90nm process ramp
Amid a move to ramp up its 65nm technology, Taiwan Semiconductor Mfg Co. Ltd (TSMC) on Wednesday (Dec. 29) said that it will accelerate its 90nm fab capacity throughout 2005
2008-11-07 TSMC tips high voltage .13? process
Taiwan Semiconductor Manufacturing Co. has enhanced its 0.13?m process technology with immediate availability of a 1.5-/6-/32V technology, targeted at high resolution mobile handset display drivers.
2006-01-23 TSMC starts 80nm process technology
Taiwan Semiconductor Mfg Co. has entered full production of its 80nm "half-node" process technology.
2005-04-29 TSMC sees low-power process as new technology driver
Changing its strategy in midstream, Taiwan Semiconductor Mfg Co. Ltd (TSMC) this week made a major but overlooked announcement.
2007-07-16 TSMC pulls curtains off 45nm design process
Taiwan Semiconductor Manufacturing Co. Ltd unveiled its latest and most ambitious design methodology for IC production at the challenging 45nm node.
2002-04-15 TSMC exec advocates slower steps between process nodes
Taiwan Semiconductor Mfg. Co. Ltd said it aims to deliver its first ICs based on 90nm design rules by the third quarter of this year, about one year ahead of the time frame cited in the industry's International Technology Roadmap for Semiconductors
2007-04-11 TSMC commences 45nm process
TSMC has rolled out its 45-nm process technology for foundry customers, with plans to enter production as early as September 2007.
2007-11-30 TSMC 55nm process tips knowledge-based processors
TSMC and NetLogic Microsystems have collaborated on using 55nm process technology for fabricating low-power knowledge-based processors.
2013-05-29 TowerJazz enlists Crocus for MLU process
Crocus will make its MLU blocks, including magnetic sensors and secure embedded memories, available to TowerJazz customers for integration into their SoC designs.
2002-08-22 Tower Semiconductor adopts PDF Solution technology
PDF Solutions Inc. has partnered with Tower Semiconductor Ltd on a program to enhance the yield and performance of 0.185m CMOS process technology at Tower's Fab 2.
2002-09-30 Tower licenses Motorola CMOS technology
Tower Semiconductor Ltd and Motorola's Semiconductor Products Sector have entered into an agreement for the technology transfer and licensing of 0.135m CMOS process technology.
2011-04-26 Toshiba-SanDisk overtake Intel-Micron in NAND process race
Outpacing the Intel-Micron duo, Toshiba and SanDisk have fabricated 2bit-per-cell, 64Gb NAND flash memory chips with 19nm process technology, thus enabling 8GB on a single chip.
2002-12-05 Toshiba, Sony announce breakthrough in IC process
Toshiba Corp. and Sony Corp. have announced that they have jointly developed a 65nm CMOS process technology for embedded DRAM system LSIs.
2009-11-19 Toshiba touts EUV photoresist for 20nm process
Toshiba Corp. has developed a photoresist suitable for use with EUV lithography and proved its viability in the first 20nm generation process technology.
2003-01-14 Toshiba to transfer SRAM process technology to SMIC
Semiconductor Mfg Int. Corp. and Toshiba Corp. have jointly announced a technology licensing and foundry agreement that will introduce 0.155m low power SRAM technology to SMIC's manufacturing facility in Shanghai, China
2002-08-12 Toshiba offers 130nm process as foundry service
Toshiba Corp. will offer its 130nm copper process line to third-party customers on a foundry basis
2004-11-23 TI, Ramtron tip 4Mb embedded FRAM technology
During the Non-Volatile Memory Technology Symposium 2004 (NVMTS2004) last week, Texas Instruments Inc. and Ramtron International Corp. presented more details of their efforts in the ferroelectric random access memory (FRAM) market
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